C23C28/341

Layer of hard material on a metal substrate

A chain component of a chain for power transmission coated with a layer of hard material includes a substrate based on steel and a layer of hard material on an outer surface of the substrate based on steel, with the layer of hard material containing metal nitrides and the C mass concentration in the layer of hard material decreasing in the direction toward the outer surface of the layer of hard material.

MULTI-LAYER METAL ARTICLE AND METHOD OF MAKING THE SAME
20220290307 · 2022-09-15 ·

The multi-layer metal article (10) includes a metal base (12) formed from a first metal and at least one interlayer (14) formed on an upper surface (18) of the metal base (12). The at least one interlayer (14) is formed from a second metal having a greater hardness than a hardness of the first metal, thus increasing the hardness of the overall multi-layer metal article (10) when compared against the hardness of just the metal base (12). An outer coating layer (16) may then be coated on an upper surface (20) of the at least one interlayer (14). As a non-limiting example, the outer coating layer (16) may be a scratch-resistant material, thus increasing both the hardness and scratch resistance of the overall multi-layer metal article (10) when compared against those of just the metal base (12). The outer coating layer (16) may be transparent, partially transparent or opaque.

Piston ring with shot-peened running-in layer and method for the production thereof

A piston ring includes an annular body, a wear-resistant layer that is applied to the annular body by thermal spraying, and a strain-hardened run-in layer, made of an AlCuFe alloy, that is applied to the wear-resistant layer by thermal spraying.

METHOD OF MANUFACTURING A NEURAL INTERFACE PROBE EMPLOYING AMORPHOUS SILICON CARBIDE
20220110565 · 2022-04-14 ·

Manufacturing a neural interface device. Forming a neural interface probe of an implantable microelectrode body. PECVD a first amorphous silicon carbide insulation layer, forming a thin film metal trace and interface pad on the first layer, the pad on a portion of the trace. PECVD a second amorphous silicon carbide insulation layer on the first layer and covering the trace and the pad. Forming an opening in the second layer to expose the pad to an ambient environment. Patterning the first and second layers to define the neural interface probe. The probe has a rectangular cuboid shape, a cross-sectional area perpendicularly transverse to a long axis length of the probe and through any perpendicularly transverse cross-section along the long axis length is less than about 50 microns. The layers are the principle material of construction of the probe.

COMPOUND SEMICONDUCTOR SUBSTRATE

A compound semiconductor substrate that can improve in-plane uniformity of current-voltage characteristics in the vertical direction is provided.

A compound semiconductor substrate includes a center and an edge which is 71.2 millimeters away from the center when viewed in a plane. When a film thickness of the GaN layer at the center of the compound semiconductor substrate is W1 and a film thickness of the CaN layer at the edge is W2, film thickness error ΔW represented by ΔW (%)=W1−W2|*100/W1 is greater than 0 and 8% or less. The average carbon concentration in the depth direction at a center of the CaN layer is 3*10.sup.18 pieces/cm.sup.3 or more and 5*10.sup.20 pieces/cm.sup.3 or less. When a carbon concentration at a center position of the depth direction at the center of the GaN layer is concentration C1 and a carbon concentration at a center position of the depth direction at the edge of the GaN layer is concentration C2, concentration error ΔC represented by ΔC (%)=|C1−C2*100/C1 is 0 or more and 50% or less.

METHOD AND SYSTEM FOR DEPOSITING MOLYBDENUM LAYERS

Methods and systems for forming molybdenum layers on a surface of a substrate and structures and devices formed using the methods are disclosed. Exemplary methods include forming an underlayer prior to forming the molybdenum layer. The underlayer can be used to manipulate stress in the molybdenum layer and/or reduce a nucleation temperature and/or deposition temperature of a step of forming the molybdenum layer.

MATERIAL COMPOSITIONS AND SEQUENCES OF MANUFACTURING
20210222787 · 2021-07-22 ·

The disclosure provides for a valve including a surface movably engaged with another surface. A coating is on the surface and is characterized by: a CoF of less than 0.1; a hardness in excess of 1,200 HVN; impermeability to liquids at pressures ranging from 15 and 20,000 psi; a surface finish of 63 or less; and a thickness ranging from 0.5 to 20 mils. The disclosure provides for material constructions including a continuous phase, including a transition metal, and a discontinuous phase, including a solid dry lubricant. The disclosure also provides for a method of depositing a coating that includes depositing a first layer of a coating onto a surface using electroplating, electroless plating, thermal spraying, or cladding, and then depositing a second layer of the coating onto a surface of the first layer using sputtering, ion beam, plasma enhanced chemical vapor deposition, cathodic arc, or chemical vapor deposition.

LAYER AND LAYER SYSTEM, AS WELL AS BIPOLAR PLATE, FUEL CELL AND ELECTROLYSER

Layers for a bipolar plates are disclosed, as well as bipolar plates including the layers and fuel cells and/or electrolyzers including the bipolar plates. The layer may include a homogeneous or heterogeneous solid metallic solution or compound which either contains a first chemical element from the group of the noble metals in the form of iridium; or contains a first chemical element from the group of the noble metals in the form of iridium and a second chemical element from the group of the noble metals in the form of ruthenium. The layer may also include at least one further nonmetallic chemical element from the group consisting of nitrogen, carbon, boron, fluorine, and hydrogen.

SIMULTANEOUS SELECTIVE DEPOSITION OF TWO DIFFERENT MATERIALS ON TWO DIFFERENT SURFACES

In some embodiments, methods are provided for simultaneously and selectively depositing a first material on a first surface of a substrate and a second, different material on a second, different surface of the same substrate using the same reaction chemistries. For example, a first material may be selectively deposited on a metal surface while a second material is simultaneously and selectively deposited on an adjacent dielectric surface. The first material and the second material have different material properties, such as different etch rates.

Coating Repair for Ceramic Matrix Composite (CMC) Substrates

In a method for repairing a coated article, the article has: a ceramic matrix composite (CMC) substrate; and a coating system having a plurality of layers. A damage site at least partially penetrates at least one of the layers. The method includes: applying a slurry of a repair material to the damage site for repairing a first of the penetrated layers; and after the applying, heating the repair material with a plasma torch.