C23C28/345

Process and material configuration for making hot corrosion resistant HPC abrasive blade tips

An abrasive coating system for a substrate of an airfoil in a turbine engine high pressure compressor, comprising a plurality of grit particles adapted to be placed on a top surface of the substrate; a matrix material bonded to the top surface; the matrix material partially surrounds the grit particles, the matrix material consisting of unalloyed chromium and unalloyed aluminum distributed throughout the matrix material, wherein the grit particles extend above the matrix material relative to the top surface; and a film of oxidant resistant coating applied over the plurality of grit particles and the matrix material.

SUBSTRATE PROCESSING METHOD, SUBSTRATE PROCESSING APPARATUS, AND METHOD FOR PRODUCING NANOWIRE OR NANOSHEET TRANSISTOR

The present disclosure appropriately shortens a processing step for processing a substrate in which a silicon layer and a silicon germanium layer are alternatively laminated. The present disclosure provides a substrate processing method of processing the substrate in which the silicon layer and the silicon germanium layer are alternatively laminated, which includes forming an oxide film by selectively modifying a surface layer of an exposed surface of the silicon germanium layer by using a processing gas including fluorine and oxygen and converted into plasma.

COATED METAL ALLOY SUBSTRATE AND PROCESS FOR PRODUCTION THEREOF
20220403528 · 2022-12-22 ·

A coated metal alloy substrate for an electronic device, a process for producing a coated metal alloy substrate for an electronic device and a housing for an electronic device, comprising a coated metal alloy substrate wherein the coated metal alloy CA substrate comprises at least one chamfered edge (1) and comprises: a passivation layer (2) deposited on the at least one chamfered edge (1); an electrophoretic deposition layer (3) deposited on the passivation layer (2); and a hydrophobic layer (4) deposited on the electrophoretic deposition layer (3).

Methods for forming vertically cracked thermal barrier coatings and articles including vertically cracked thermal barrier coatings
11525179 · 2022-12-13 · ·

A method for forming a vertically cracked thermal barrier coating is disclosed including positioning an article relative to a heat source. The article includes a thermal barrier coating disposed on a first surface of a substrate, and the substrate includes a second surface distal across the substrate from the first surface. Heat is applied locally to at least one discrete portion of the second surface of the substrate. At least one vertical crack in the thermal barrier coating is formed disposed over the at least one discrete portion. An article is disclosed including a substrate and a vertically-cracked thermal barrier coating disposed on the substrate. The vertically cracked thermal barrier coating includes at least one vertical crack in the thermal barrier coating and at least one of a low density of less than 85% of a theoretical density for the thermal barrier coating and a selective crack distribution.

Additive manufacturing for segmented electric machines

A method of making a component of an electrical machine is provided. An additive manufacturing process is used to manufacture a part, including applying beams of energy to a successive plurality of ferromagnetic material particles and fusing them together to form a ring or segment of a ring with an axis, a solid portion, and laminas that extend from the solid portion in a radial or axial direction.

OPTOELECTRONIC DEVICE FORMED ON A FLEXIBLE SUBSTRATE
20220393046 · 2022-12-08 ·

An optoelectronic device includes a flexible substrate, a cerium oxide (CeO.sub.2) layer arranged on the flexible substrate, a single crystal β-III-oxide layer arranged on the CeO.sub.2 layer, and a metallic contact layer arranged on the single crystal β-III-oxide layer.

METHOD FOR FORMING ELECTRODE
20220392769 · 2022-12-08 ·

A method of forming an electrode in accordance with an exemplary embodiment includes a process of forming a mask pattern on one surface of a base to expose a partial area of the one surface of the base by using a mask material that is polymer including an end tail having at least one bonding structure of covalent bond and double bond, a process of loading the base on which the mask pattern is formed into a chamber, and a process of forming a conductive layer containing copper on the exposed one surface of the base by using an atomic layer deposition method that alternately injects a source material containing copper and a reactive material that reacts with the source material into the chamber.

Thus, according to the method of forming an electrode in accordance with an exemplary embodiment, a thin-film caused by a material for forming an electrode is not formed on a surface of the mask pattern. Therefore, a residue is not remained when the mask pattern is removed to prevent a defect caused by the residue from being generated.

Sn-BASED PLATED STEEL SHEET
20220389590 · 2022-12-08 · ·

To provide a Sn-based plated steel sheet excellent in yellowing resistance, coating film adhesiveness, and sulfurization blackening resistance without performing the conventional chromate treatment.

A Sn-based plated steel sheet of the present invention includes: a steel sheet; a Sn-based plating layer located on at least one surface of the steel sheet; and a coating layer located on the Sn-based plating layer, wherein: the Sn-based plating layer contains 0.10 to 15.00 g/m.sup.2 of Sn per side in terms of metal Sn; the coating layer contains a Zr oxide and a Mn oxide; a content of the Zr oxide is 0.20 to 50.00 mg/m.sup.2 per side in terms of metal Zr; a content of the Mn oxide in terms of metal Mn is 0.01 to 0.50 times on a mass basis relative to the content of the Zr oxide in terms of metal Zr; and a depth position A where an element concentration of Mn is maximum is located on a side closer to a surface of the coating layer than a depth position B where an element concentration of Zr is maximum, and a distance in a depth direction between the depth position A and the depth position B is 2 nm or more in an element analysis in the depth direction by XPS.

METAL OXIDE RESIST PATTERNING WITH ELECTRICAL FIELD GUIDED POST-EXPOSURE BAKE

A method for processing a substrate is described. The method includes forming a metal containing resist layer onto a substrate, patterning the metal containing resist layer, and performing a post exposure bake on the metal containing resist layer. The post exposure bake on the metal containing resist layer is a field guided post exposure bake operation and includes the use of an electric field to guide the ions or charged species within the metal containing resist layer. The field guided post exposure bake operation may be paired with a post development field guided bake operation.

Composite panel comprising a perforated metallic foil for lightning strike protection and a perforated metallic foil

A composite panel having a plurality of carbon plies, a perforated metallic foil comprising several apertures and being directly secured to the plurality of carbon plies, and a protective layer made from resin reinforced with fibers which is secured to the metallic foil. The perforated metallic foil is embedded in the protective layer through its apertures. A free surface of the protective layer forms a top side of the composite panel. The thickness of the protective layer between the top side of the composite panel and the perforated metallic foil is at least 15 micrometers and the perforated metallic foil has a thickness of not more than 30 micrometers. The plurality of apertures in the aggregate defines an open area of not more than 40% of the surface area and a maximum distance between two opposed points in a perimeter of an aperture is equal to or less than 3 mm.