Patent classifications
C23F1/16
Method for constructing micro-nano porous organic acid pretreatment layer on metal surface and its application
A method for constructing a micro-nano porous organic acid pretreatment layer on the metal surface and its application are provided. A pretreatment reagent used is prepared by chemically grafting organic acid with hydroxylation-rich polymer. After immersed in the pretreatment reagent for a period of time, the metal substrates are then dried and cured, and the organic acid pretreatment layer with a micro-nano porous structure and excellent adhesion is successfully formed. The present invention provides the pretreatment reagent and pretreatment process of the metal surface coating protection technology. The solvent is only pure water and realizes no organic solvation. The pretreatment layer has excellent adhesion with the metal substrate, rough and porous structure, and can be closely interlocked with the subsequent coating layer, which greatly enhances the anticorrosion performance of the whole coating system.
METHODS OF MANUFACTURING EMBOSSING ELEMENTS
A method of manufacturing an embossing element for decorative surfaces includes the steps of: a) UV curable inkjet printing a decorative pattern on a metallic surface; and b) forming a relief by etching metal from the metallic surface.
METHODS OF MANUFACTURING EMBOSSING ELEMENTS
A method of manufacturing an embossing element for decorative surfaces includes the steps of: a) UV curable inkjet printing a decorative pattern on a metallic surface; and b) forming a relief by etching metal from the metallic surface.
SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING LIQUID
In one embodiment, a substrate processing liquid contains phosphoric acid as a primary component and contains water and ketone. In another embodiment, a substrate processing method includes processing a substrate in a substrate processing bath with a substrate processing liquid containing phosphoric acid, water and ketone. The method further includes discharging the substrate processing liquid from the substrate processing bath to a circulating flow channel, heating the substrate processing liquid flowing through the circulating flow channel at a temperature between 50° C. and 90° C., and supplying the substrate processing liquid again from the circulating flow channel to the substrate processing bath to circulate the substrate processing liquid under heating.
SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING LIQUID
In one embodiment, a substrate processing liquid contains phosphoric acid as a primary component and contains water and ketone. In another embodiment, a substrate processing method includes processing a substrate in a substrate processing bath with a substrate processing liquid containing phosphoric acid, water and ketone. The method further includes discharging the substrate processing liquid from the substrate processing bath to a circulating flow channel, heating the substrate processing liquid flowing through the circulating flow channel at a temperature between 50° C. and 90° C., and supplying the substrate processing liquid again from the circulating flow channel to the substrate processing bath to circulate the substrate processing liquid under heating.
Manufacturing method of metal-polymer resin bonded component
The present invention relates to a method of manufacturing a metal-polymer resin bonded body, including: degreasing metal using a degreasing solution; etching the metal using an etching solution; electrolyzing the metal using an electrolyte solution; and performing a polymer resin injection to bond a polymer resin to the metal, wherein the electrolyte solution includes a compound containing distilled water, oxalic acid, sulfuric acid, and carboxylic acid.
Manufacturing method of metal-polymer resin bonded component
The present invention relates to a method of manufacturing a metal-polymer resin bonded body, including: degreasing metal using a degreasing solution; etching the metal using an etching solution; electrolyzing the metal using an electrolyte solution; and performing a polymer resin injection to bond a polymer resin to the metal, wherein the electrolyte solution includes a compound containing distilled water, oxalic acid, sulfuric acid, and carboxylic acid.
Diamond-coated composite heat sinks for high-power laser systems
In various embodiments, laser systems feature beam emitters thermally coupled to heat sinks comprising, consisting essentially of, or consisting of a metal-matrix composite of a thermally conductive metal and a refractory metal. At least a portion of the surface of the heat sink is treated to form a depleted region, and a diamond coating is deposited within and/or over the depleted region. The depleted region is substantially free of the thermally conductive metal or contains the thermally conductive metal at a concentration less than that of the body of the heat sink.
Diamond-coated composite heat sinks for high-power laser systems
In various embodiments, laser systems feature beam emitters thermally coupled to heat sinks comprising, consisting essentially of, or consisting of a metal-matrix composite of a thermally conductive metal and a refractory metal. At least a portion of the surface of the heat sink is treated to form a depleted region, and a diamond coating is deposited within and/or over the depleted region. The depleted region is substantially free of the thermally conductive metal or contains the thermally conductive metal at a concentration less than that of the body of the heat sink.
COMPOSITION FOR ETCHING AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE USING THE SAME
The present invention provides a method of preparing composition for etching a silicon nitride film comprising stirring ammonium salt-based compound and metaphosphoric acid so that the ammonium salt-based compound dissolves the metaphosphoric acid, and adding phosphoric acid, wherein the ammonium salt-based compound comprises tetramethyl ammonium hydroxide (TMAH).