Atomic layer etching (ALE) processes are disclosed. In some embodiments, the methods comprise at least one etch cycle in which a substrate comprising a metal, metal oxide, metal nitride or metal oxynitride layer is contacted with an etch reactant comprising an vapor-phase N-substituted derivative of amine compound. In some embodiments the etch reactant reacts with the substrate surface to form volatile species including metal atoms from the substrate surface. In some embodiments a metal or metal nitride surface is oxidized as part of the ALE cycle. In some embodiments a substrate surface is contacted with a halide as part of the ALE cycle. In some embodiments a substrate surface is contacted with a plasma reactant as part of the ALE cycle.

A method for preparing an icephobic surface includes cleaning, etching and anodizing a target surface and applying fluorinated nanoparticles to the cleaned, etched and anodized target surface. A surface is treated according to this method.

One exemplary embodiment of this disclosure relates to a method of forming an engine component. The method includes forming an engine component having an internal passageway, the internal passageway formed with an initial dimension. The method further includes establishing a flow of machining fluid within the internal passageway, the machining fluid changing the initial dimension.

One exemplary embodiment of this disclosure relates to a method of forming an engine component. The method includes forming an engine component having an internal passageway, the internal passageway formed with an initial dimension. The method further includes establishing a flow of machining fluid within the internal passageway, the machining fluid changing the initial dimension.

An object of the present invention is to provide a treatment liquid having excellent resist film removal performance and excellent residue removal performance. Another object of the present invention is to provide a treatment method. The treatment liquid of an embodiment of the present invention is a treatment liquid containing an alkali compound and a hydroxycarboxylic acid, in which abrasive particles are not substantially contained, and a content mass ratio of a content of the hydroxycarboxylic acid to a content of the alkali compound is 0.001 and 1.0.

Provided is a method of manufacturing an organic deposition mask used in manufacturing of an organic light emitting diode (OLED). More specially, provided is a method of manufacturing an organic deposition mask by which fine deposition openings may be formed on a thin board by electrochemical machining (ECM) using a multi array electrode having projecting electrode parts arrayed thereon. According to an embodiment of the present invention, the method of manufacturing an organic deposition mask including deposition openings formed of first openings facing a deposition source and second openings facing a deposited object, the method may include: forming the first openings on one side of a thin board; and forming the second openings on an opposite side of the thin board by electrochemical machining (ECM) using a second multi array electrode having second projecting electrode parts arrayed thereon so as to communicate with the first openings.

The present invention discloses a low-dielectric resin composition, a low-dielectric resin/metal composite material and a preparation method thereof, and an electronic device. The resin composition comprises, based on 100% by weight of the resin composition: 45-70 wt % of a base resin, 20-45 wt % of a chopped glass fiber, 1-3 wt % of a toughening resin, 0.2-0.5 wt % of an unmodified glycidyl methacrylate, and 0-10 wt % of an auxiliary. The base resin is selected from the PBT resin and/or the PPS resin. The chopped glass fiber has a dielectric constant of 4.0 to 4.4 at 1 MHz. With the same base resin component, the dielectric constant and dielectric loss of the low-dielectric resin material prepared with the low-dielectric resin composition are significantly reduced, which is advantageous for satisfying the requirements of use of plastics for antenna channels in metal shell of an electronic device, so as to improve the ability of the electronic device having antennas to receive and transmit signals.

The present invention relates to a method of manufacturing a metal-polymer resin bonded body, including: degreasing metal using a degreasing solution; etching the metal using an etching solution; electrolyzing the metal using an electrolyte solution; and performing a polymer resin injection to bond a polymer resin to the metal, wherein the electrolyte solution includes a compound containing distilled water, oxalic acid, sulfuric acid, and carboxylic acid.

The present invention relates to a method of manufacturing a metal-polymer resin bonded body, including: degreasing metal using a degreasing solution; etching the metal using an etching solution; electrolyzing the metal using an electrolyte solution; and performing a polymer resin injection to bond a polymer resin to the metal, wherein the electrolyte solution includes a compound containing distilled water, oxalic acid, sulfuric acid, and carboxylic acid.

Provided is a method of manufacturing an organic deposition mask used in manufacturing of an organic light emitting diode (OLED). More specially, provided is a method of manufacturing an organic deposition mask by which fine deposition openings may be formed on a thin board by electrochemical machining (ECM) using a multi array electrode having projecting electrode parts arrayed thereon. According to an embodiment of the present invention, the method of manufacturing an organic deposition mask including deposition openings formed of first openings facing a deposition source and second openings facing a deposited object, the method may include: forming the first openings on one side of a thin board; and forming the second openings on an opposite side of the thin board by electrochemical machining (ECM) using a second multi array electrode having second projecting electrode parts arrayed thereon so as to communicate with the first openings.