The present invention relates to a method for preserving a mark on a metallic workpiece prior to a chemical etching process to remove a surface material from a surface of the workpiece carrying the mark, the method comprising the steps of: deepening the mark relative to the surface to form a first depth; and depositing a filling material into the first depth, wherein the filling material is adapted to be removed during the chemical process, such that a second depth is obtained at the mark after the chemical process. The present invention also relates to a method of treating a metallic workpiece to preserve a mark on the surface of the workpiece, the method comprising the step of treating at least a portion of the surface of the workpiece surrounding the mark to remove at least a surface oxide layer from the mark, the treating step being arranged such that it does not remove all of the surface material from said portion of the surface of the workpiece, but removes at least the surface oxide layer from the mark.

Method and device which make it possible to remove the oxides present at the surface of nodules of a metal powder before the use of the latter in an industrial process for the assembling of powder by the solid or liquid route, characterized in that it consists in stripping the said metal powder by bringing the latter into contact with vapour from a stripping solid material and/or by sublimation of a stripping solid material followed by a chemical transformation.

A switch contact element, having a layered structure comprising three layers: the bottom layer is silicone rubber, the middle layer is a continuous base metal sheet layer, and the upper layer is a discontinuous (stripe-shaped, raised-point-shaped or lattice-shaped) precious metal plated layer or a double-metal composite layer of a discontinuous base metal plated layer and a precious metal plated layer. The thickness of the bottom layer is greater than that of the middle layer, the thickness of the middle layer is greater than that of the upper layer, and the thickness of the upper layer meets the conditions that the conductive current is greater than safe current of conductive contacts on a circuit board, and the service life of a switch for the design is ensured.

A switch contact element, having a layered structure comprising three layers: the bottom layer is silicone rubber, the middle layer is a continuous base metal sheet layer, and the upper layer is a discontinuous (stripe-shaped, raised-point-shaped or lattice-shaped) precious metal plated layer or a double-metal composite layer of a discontinuous base metal plated layer and a precious metal plated layer. The thickness of the bottom layer is greater than that of the middle layer, the thickness of the middle layer is greater than that of the upper layer, and the thickness of the upper layer meets the conditions that the conductive current is greater than safe current of conductive contacts on a circuit board, and the service life of a switch for the design is ensured.

A method of manufacturing metallic articles from a metal substrate includes the steps of: a) jetting an image with a UV curable inkjet ink on at least one surface of the metallic substrate; b) UV curing the image; c) electroplating or acidic etching the at least one metallic surface not covered by the UV cured image; and d) stripping or solubilizing the UV cured image by an aqueous alkaline solution; wherein the UV curable inkjet ink has a viscosity of no more than 100 mPa.Math.s at 25 C. and at a shear rate of 1,000 s.sup.1; and wherein the UV curable inkjet ink contains a specific polymerizable composition and up to 20 wt % of photoinitiator including at least one of an acyl phosphine oxide photoinitiator and a thioxanthone photoinitiator.

A process for generating a compact alumina passivation layer on an aluminum component includes rinsing the component in deionized water for at least one minute, drying it for at least one minute, and exposing it to concentrated nitric acid, at a temperature below 10 C., for one to 30 minutes. The process also includes rinsing the component in deionized water for at least one minute, drying it for at least one minute, and exposing it to NH.sub.4OH for one second to one minute. The process further includes rinsing the component in deionized water for at least one minute and drying it for at least one minute. A component for use in a plasma processing system includes an aluminum component coated with an Al.sub.xO.sub.y film having a thickness of 4 to 8 nm and a surface roughness less than 0.05 m greater than a surface roughness of the component without the Al.sub.xO.sub.y film.

A method for conditioning a semiconductor chamber component may include passivating the chamber component with an oxidizer. The method may also include performing a number of chamber process operation cycles in a semiconductor processing chamber housing the chamber component until the process is stabilized. The number of chamber operation cycles to stabilize the process may be less than 10% of the amount otherwise used with conventional techniques.

A method of manufacturing metallic articles from a metal substrate includes the steps of: a) jetting an image with a UV curable inkjet ink on at least one surface of the metallic substrate; b) UV curing the image; c) electroplating or acidic etching the at least one metallic surface not covered by the UV cured image; and d) stripping or solubilising the UV cured image by an aqueous alkaline solution; wherein the UV curable inkjet ink has a viscosity of no more than 100 mPa.Math.s at 25 C. and at a shear rate of 1,000 s.sup.1; and wherein the UV curable inkjet ink contains a specific polymerizable composition and up to 20 wt % of photoinitiator including at least one of an acyl phosphine oxide photoinitiator and a thioxanthone photoinitiator.

A UV curable inkjet ink includes a polymerizable composition, wherein at least 80 wt % of the polymerizable composition consists of: a) 15.0 to 70.0 wt % of an acryl amide; b) 20.0 to 75.0 wt % of a polyfunctional acrylate; and c) 1.0 to 15.0 wt % of a monofunctional (meth)acrylate containing a carboxylic acid group, a phosphoric acid group, or a phosphonic acid group; with all weight percentages (wt %) based on the total weight of the polymerizable composition.

The invention is an aqueous composition useful for chemical mechanical polishing of a patterned semiconductor wafer containing a copper interconnect metal. The aqueous composition includes an oxidizer, an inhibitor for the copper interconnect metal, 0.001 to 15 weight percent of a water soluble modified cellulose, non-saccaride water soluble polymer, 0 to 15 complexing agent for the copper interconnect metal, 0 to 15 weight percent phosphorus compound, 0.05 to 20 weight percent of an acid compound that is capable of complexing copper ions, and water; and the solution has an acidic pH.