The water outlet of a subsystem that includes an ultraviolet oxidation device and the water inlet of each substrate treatment device are connected to each other via a main pipe. A hydrogen peroxide removal device is installed between the ultraviolet oxidation device of the subsystem and a non-regenerative ion-exchange device. In addition, a carbon dioxide supply device is installed at the middle of a pipe that branches from the water outlet of the subsystem to reach the substrate treatment device. According to an aspect, the hydrogen peroxide removal device is filled with a platinum-group metal catalyst. Thus, ultrapure water passed through the ultraviolet oxidation device is used as a base to produce carbonated water in which the concentration of hydrogen peroxide dissolved therein is limited to 2 g/L or less and to which carbon dioxide is added to adjust resistivity to be within the range of 0.03 to 5.0 M.Math.cm.

The present invention relates to a method for increasing adhesion strength between a surface of copper or copper alloy and an organic layer, the method comprising in this order the steps: (i) providing a non-conductive substrate comprising on at least one side said surface, said surface having a total surface area of copper or copper alloy, (ii) contacting said substrate comprising said surface with an acidic aqueous non-etching protector solution comprising (ii-a) one or more than one amino azole, (ii-b) one or more than one organic acid and/or salts thereof, (ii-c) one or more than one peroxide in a total amount of 0.4 wt-% or less, based on the total weight of the protector solution, and (ii-d) inorganic acids in a total amount of 0 to 0.01 wt-%, based on the total weight of the protector solution, wherein during step (ii) the total surface area of said surface is not increased upon contacting with the protector solution.

The water outlet of a subsystem that includes an ultraviolet oxidation device and the water inlet of each substrate treatment device are connected to each other via a main pipe. A hydrogen peroxide removal device is installed between the ultraviolet oxidation device of the subsystem and a non-regenerative ion-exchange device. In addition, a carbon dioxide supply device is installed at the middle of a pipe that branches from the water outlet of the subsystem to reach the substrate treatment device. According to an aspect, the hydrogen peroxide removal device is filled with a platinum-group metal catalyst. Thus, ultrapure water passed through the ultraviolet oxidation device is used as a base to produce carbonated water in which the concentration of hydrogen peroxide dissolved therein is limited to 2 g/L or less and to which carbon dioxide is added to adjust resistivity to be within the range of 0.03 to 5.0 M.Math.cm.

An anticorrosion treatment method for a copper-containing material comprises: carrying out a sealed and pressurized reaction on a copper-containing material and a stabilizer in presence of a polar solvent and any assistant, the stabilizer being a compound capable of providing formates, so that the formates are adsorbed on the surface of the copper-containing material. In the method, formates are modified on the surface of the copper-containing material, accordingly, the oxidation resistance capability and the stability of the copper-containing material can be significantly improved while the electrical conductivity of the copper-containing material is not reduced, and the corrosion resistance of the copper-containing material and especially, the salt and alkali corrosion resistance of the copper-containing material are significantly improved.

A pipe is manufactured through injecting a chloride ion-containing aqueous solution into a copper pipe to fill the copper pipe, thereby forming a copper oxide film on an inner surface of the copper pipe.

A method for smoothing surfaces of a copper foil and the copper foil obtained are provided, wherein the method for smoothing surfaces of the copper foil includes the following steps. Supplied with a copper foil. A first electropolishing process is performed on the copper foil. The copper foil is subjected to a pickling process. A second electropolishing process is performed on the copper foil.

A method for manufacturing the circuit board comprises following steps of providing an insulating substrate, and defining at least one through-hole on the insulating substrate to extending through two opposite surfaces of the insulating substrate; forming a silver layer on each of the two opposite surfaces, and forming a silver conductive structure in each through-hole connecting the silver layers; forming a copper wiring layer on the silver layers to cover each silver conductive structure and a portion region of the silver layers; and etching the silver layers to form a silver wiring layer corresponding to the copper wiring layer, wherein a first etching liquid, which does not etch the copper wiring layer, is used for etching the silver layers.

Methods, systems and apparatuses for treating operating aluminum desmutting solutions by reacting, mixing and filtering a partial desmutting solution flow are disclosed.

Provided is a method for surface-treatment of a metal using bacteria, and more particularly, a method for surface-treatment of a metal using bacteria including immersing the metal having a surface layer on which a deformed layer is formed in a culture fluid cultured with metal-oxidizing bacteria, such that the metal-oxidizing bacteria selectively oxidize and leach-remove the deformed layer of the metal to perform micro-machining, thereby minimizing a damage to a metal basic material to effectively remove the deformed layer of the metal, and further including partly coating a surface of the metal to produce fine patterns of which sizes and shapes are various.

The present invention is a charge complexing chemical composition that protects metal during polymer removal. The polymer coatings include crosslinked systems by chemical-amplification and photoacid generated (PAG) means as in epoxies. The system includes a solvent, a charge complexing additive, and an acid that creates a protective complex for sensitive metals during the dissolving and rinsing practice needed for processing microelectronic parts. The composition can be utilized with a method for removing partial and fully cured crosslinked coatings that originate from chemical amplification or PAG-epoxy photoimageable coatings.