Patent classifications
C23G1/106
Chemical decontamination method using chelate free chemical decontamination reagent for removal of the dense radioactive oxide layer on the metal surface
A chemical decontamination reagent containing a reducing agent, a reductive metal ion, and an inorganic acid is provided to remove a radioactive oxide layer on a metal surface. The reagent can dissolve the radioactive oxide layer on the metal surface effectively at a relatively low temperature and enables a simple process of contacting the reagent to the radioactive oxide, thus economically effective in terms of cost and time required for the process. Since the decontamination does not use a conventional organic chelating agent such as oxalic acid, but the reducing agent as a main substance, the residuals of the reducing agent remained after decontamination can be decomposed and removed with an oxidizing agent. Due to the easy decomposition with the chemical decontamination reagent, secondary wastes can be minimized and the radionuclides remained in the decontamination reagent solution can be removed effectively.
Chemical process for matification
The invention relates to a method for mattifying a turbine engine part (10) comprising a metal material, the method comprising a step of immersing said part in a chemical bath (14) for mattifying said metal part (10), the bath (14) comprising at least sodium fluoride (NaF) and hydrofluoric (HF) acid, characterised in that the immersion step lasts between 2 and 15 minutes.
METHOD FOR PLATING A METALLIC MATERIAL ONTO A TITANIUM SUBSTRATE
A method for plating a metallic material onto a titanium substrate, wherein the titanium substrate includes an outer surface and an oxide layer on the outer surface. The method includes chemically etching the outer surface of the titanium substrate to remove at least a portion of the oxide layer, thereby yielding an etched titanium substrate. The method also includes establishing a cathodic protection current through the etched titanium substrate while the etched titanium substrate is immersed in a cathodic electrolyte solution. The method further includes strike plating a bond promoter layer onto the outer surface of the etched titanium substrate after the establishing of the cathodic protection current. The method lastly includes plating the metallic material onto the bond promoter layer.
Titanium nano-scale etching on an implant surface
A method of forming an implant to be implanted into living bone is disclosed. The method comprises the act of roughening at least a portion of the implant surface to produce a microscale roughened surface. The method further comprises the act of immersing the microscale roughened surface into a solution containing hydrogen peroxide and a basic solution to produce a nanoscale roughened surface consisting of nanopitting superimposed on the microscale roughened surface. The nanoscale roughened surface has a property that promotes osseointegration.
Decontamination method reducing radioactive waste
A decontamination method that includes the steps of decontaminating an object containing radioactive contaminated metals or alloys with a chemical decontamination agent including sulfuric acid (H.sub.2SO.sub.4) and forming a Ba or Sr precipitate by adding a Ba or Sr cation and a hydroxylion or halogen anion salts to the decontamination waste water.
WET-ETCHING METHOD AND METHOD OF PRODUCING SEMICONDUCTOR DEVICE
The invention provides a method of wet-etching a laminate of metal films on a base plate in a target predetermined pattern. The metal films include a naturally oxidized Ti film as a top layer. The method includes a resist forming process of forming a resist film having a shape corresponding to the predetermined pattern on the laminate, a top layer selectively etching process of placing the laminate in contact with a top layer selectively etching solution to mainly etch a portion of the top layer that is not covered by the resist film, and a finishing etching process of placing the laminate in contact with a finishing etching solution to etch all layers including the top layer until a target shape of the laminate is obtained.
PROCESS FOR REGENERATING A BATH FOR CHEMICAL ETCHING OF TITANIUM PARTS
Disclosed is a method of regenerating a nitric and hydrofluoric acid bath contained in a machining vessel, the method including, when the etching bath is spent, performing steps of: transferring a portion of the spent etching bath, referred to as the spent solution, from the machining vessel into a reactor; adding NaF and NaNO.sub.3 to the spent solution, to form HF, HNO.sub.3, and Na.sub.2TiF.sub.6; separating the resulting precipitate from the supernatant; transferring the supernatant, which is a regenerated solution, into a tank; measuring the concentrations of HF, of HNO.sub.3, and of dissolved titanium in the tank and in the machining vessel; and determining the volume of regenerated solution that can be added to the spent etching bath to obtain a regenerated bath in which the concentrations of HF, of HNO.sub.3, and of dissolved titanium lie in acceptable concentration ranges, and transferring the regenerated solution into the machining vessel.
CHEMICAL PROCESS FOR MATIFICATION
The invention relates to a method for mattifying a turbine engine part (10) comprising a metal material, the method comprising a step of immersing said part in a chemical bath (14) for mattifying said metal part (10), the bath (14) comprising at least sodium fluoride (NaF) and hydrofluoric (HF) acid, characterised in that the immersion step lasts between 2 and 15 minutes.
METHOD OF MANUFACTURING SPUTTERING TARGET AND SPUTTERING TARGET
The manufacturing cost of a sputtering target is reduced and the impurity concentration of the manufactured sputtering target is also reduced. A method of manufacturing a sputtering target includes: surface-treating at least one of a used sputtering target and a scrap material; melting at least one of the used sputtering target and the scrap material after the surface treatment to form an ingot; and manufacturing a sputtering target by subjecting the ingot to forging, rolling, heat treating, and machining.
METHOD OF MANUFACTURING SPUTTERING TARGET AND SPUTTERING TARGET
The manufacturing cost of a sputtering target is reduced and the impurity concentration of the manufactured sputtering target is also reduced. A method of manufacturing a sputtering target includes: surface-treating at least one of a used sputtering target and a scrap material; melting at least one of the used sputtering target and the scrap material after the surface treatment to form an ingot; and manufacturing a sputtering target by subjecting the ingot to forging, rolling, heat treating, and machining.