Embodiments of the present disclosure provide a surface treatment composition and methods for using same. The composition for removing contaminants from a metallic surface, can include 3 wt % to 40 wt % of at least one bifunctional alkaline compound, 0.03 wt % to 10 wt % of at least one oxidizer comprising a metal salt, and water, where all weight percentages are based on the total weight of the composition.

Embodiments of the present disclosure provide a surface treatment composition and methods for using same. The composition for removing contaminants from a metallic surface, can include 3 wt % to 40 wt % of at least one bifunctional alkaline compound, 0.03 wt % to 10 wt % of at least one oxidizer comprising a metal salt, and water, where all weight percentages are based on the total weight of the composition.

Described herein is dioxolane-containing compound of formula (I) wherein (i) Rf.sup.1 and Rf.sup.2 are independently linear or branched perfluoroalkyi groups having with 1-8 carbon atoms and optionally comprise at least one catenated heteroatom, or (ii) Rf.sup.1 and Rf.sup.2 are bonded together to form a ring structure having 4-6 carbon atoms and optionally comprise one or more catenated heteroatoms; Rf.sup.2 is a linear or branched perfluoroalkyi groups having with 1-3 carbon atoms; and R.sup.4 and R.sup.5 are independently selected from H, F, Cl, a linear or branched alkyl group having 1-3 carbon atoms, optionally wherein the alkyl group comprises at least one of: fluorine, chlorine, a hydroxyl group, or a catenated heteroatom; for use in cleaning compositions, as an electrolyte solvent, as a heat transfer fluid, or a vapor phase soldering fluid. There is also provided a method of making the dioxolane-containing compound, comprising: contacting a 1,2-diol compound with a fluorinated ethylenically unsaturated compound in the presence of a base.

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The present invention relates to an unsaturated fluorinated ether or amine compound of formula (I) with low global warming potential and method of making the compound (I), where R.sub.H.sup.1 is and R.sub.H.sup.2 are independently selected from H or CH.sub.3, wherein when R.sub.H.sup.1 is CH.sub.3 then R.sub.H.sup.2 is H and when R.sub.H.sup.2 is CH.sub.3, then R.sub.H.sup.1 is H; X is O or N and when X is O, then n is 1 and R.sub.f is a linear or branched perfluorinated alkyl group comprising 1-10 carbon atoms and optionally comprising at least one catenated O or N atom; X is N, then n is 2 and (i) each R.sub.f is independently selected from a linear or branched perfluorinated alkyl group comprising 1-8 carbon atoms and optionally comprising at least one catenated O or N atom, or (ii) the two R.sub.f's are bonded together to form a ring structure optionally comprising at least one catenated O or N atom, wherein the ring of the ring structure consists of 5-7 atoms, no more than 10 carbon atoms, and is perfluorinated. The applications of the compound include solvent cleaning, electrolyte solvents or additives, heat transfer, and vapour phase soldering.

A method of removing material that fouls processing equipment that includes applying a composition comprising N,N-dimethylacetamide (DMAC) to fouling material deposited on the processing equipment to solubilize and remove the fouling material from the processing equipment.

A method of removing material that fouls processing equipment that includes applying a composition comprising N,N-dimethylacetamide (DMAC) to fouling material deposited on the processing equipment to solubilize and remove the fouling material from the processing equipment.

A method of removing material that fouls processing equipment that includes applying a composition comprising N,N-dimethylacetamide (DMAC) to fouling material deposited on the processing equipment to solubilize and remove the fouling material from the processing equipment.

A method of removing material that fouls processing equipment that includes applying a composition comprising N,N-dimethylacetamide (DMAC) to fouling material deposited on the processing equipment to solubilize and remove the fouling material from the processing equipment.

A hydrophobic preliminary cleaning agent includes a first compound and a second compound, The first compound is fatty acid ester and the second compound is any one of solid paraffin, hydroxylated wax, and aliphatic alcohol having 1 to 24 carbon atoms. The second compound is greater than or equal to 30 weight % with respect to 100 weight % by total weight of the first compound and the second compound, The hydrophobic preliminary cleaning agent is solidified at room temperature.

A hydrophobic preliminary cleaning agent includes a first compound and a second compound, The first compound is fatty acid ester and the second compound is any one of solid paraffin, hydroxylated wax, and aliphatic alcohol having 1 to 24 carbon atoms. The second compound is greater than or equal to 30 weight % with respect to 100 weight % by total weight of the first compound and the second compound, The hydrophobic preliminary cleaning agent is solidified at room temperature.