Patent classifications
C25D3/08
Method for producing chromium plated parts, and chromium plating apparatus
According to the method for producing chromium plated parts, a plurality of workpieces are immersed in a chromium plating bath, a plating treatment is performed by using a pulse current, and chromium plating layers that have compressive residual stress and suppressed cracking are deposited on surfaces of the plurality of workpieces. A direct current from plating separation lower limit current density up to a range in which the chromium plating layers have compressive residual stress is superimposed during downtime of application of the pulse current.
METHOD FOR PRODUCING CHROMIUM PLATED PARTS, AND CHROMIUM PLATING APPARATUS
According to the method for producing chromium plated parts, a plurality of workpieces are immersed in a chromium plating bath, a plating treatment is performed by using a pulse current, and chromium plating layers that have compressive residual stress and suppressed cracking are deposited on surfaces of the plurality of workpieces. A direct current from plating separation lower limit current density up to a range in which the chromium plating layers have compressive residual stress is superimposed during downtime of application of the pulse current.
Method for coating an object by means of a multilayer system with a nickel-phosphorus alloy
A method for coating an article, wherein a surface of the article is at least partially coated with a coating that has a multiplicity of layers, wherein at least one layer of the coating is made of a nickel phosphorus alloy and wherein a mass fraction of the phosphorus in the nickel phosphorus alloy is at least 8%.
Method for coating an object by means of a multilayer system with a nickel-phosphorus alloy
A method for coating an article, wherein a surface of the article is at least partially coated with a coating that has a multiplicity of layers, wherein at least one layer of the coating is made of a nickel phosphorus alloy and wherein a mass fraction of the phosphorus in the nickel phosphorus alloy is at least 8%.
COMPOSITE COPPER FOIL
[Problem] An object is to provide novel composite copper foils. [Means to solve the problem] A composite copper foil comprises a copper foil and a layer of metal other than copper, the metal layer being formed on at least a part of a surface of the copper foil, wherein at least a part of the composite copper foil has protrusions on a surface thereof, and each protrusion has a height of 10 nm or more but 1000 nm or less in a cross-section of the composite copper foil.
BLACK PLATED SUBSTRATE
The present invention relates to a black plated substrate comprising a base-substrate and deposited thereon a layer stack, wherein the layer stack comprises a black chromium plating layer comprising on its surface a conversion layer having a depth of 30 nm or more, characterized in that the conversion layer does not comprise metallic chromium or comprises metallic chromium only up to 2 at.-%, based on the element chromium and the total number of chromium atoms in the conversion layer.
BLACK PLATED SUBSTRATE
The present invention relates to a black plated substrate comprising a base-substrate and deposited thereon a layer stack, wherein the layer stack comprises a black chromium plating layer comprising on its surface a conversion layer having a depth of 30 nm or more, characterized in that the conversion layer does not comprise metallic chromium or comprises metallic chromium only up to 2 at.-%, based on the element chromium and the total number of chromium atoms in the conversion layer.
Low transmission loss copper foil and methods for manufacturing the copper foil
Surface-treated copper foils that exhibit a material volume (Vm) less than 1.90 m.sup.3/m.sup.2. Where the surface-treated copper foil is treated on the drum side and includes a treatment layer comprising a nodule layer. Such surface-treated copper foils can be used as a conductive material having low transmission loss, for example in circuit boards.
Electrolytic copper foil for printed circuit board with low transmission loss
Surface-treated copper foils that exhibit a material volume (Vm) in a range of 0.05 to 0.6 m.sup.3/m.sup.2 and a yellowness index (YI) in a range of 17 to 52 are reported. Where the surface-treated copper foil is treated on the deposited side and includes a treatment layer comprising a nodule layer. Such surface-treated copper foils can be used as a conductive material having low transmission loss, for example in circuit boards.
Steel sheet for cans and production method for steel sheet for cans
A steel sheet for cans has, on the surface thereof, in order from the steel sheet side, a chromium metal layer and a hydrous chromium oxide layer. The chromium metal layer is deposited in an amount of 65-200 mg/m.sup.2, and the hydrous chromium oxide layer is deposited in an amount of 3-15 mg/m.sup.2 in terms of chromium. The chromium metal layer includes: a flat chromium metal layer that has a thickness of at least 7 nm; and a granular chromium metal layer that includes granular protrusions that are formed on the surface of the flat chromium metal layer. The maximum grain size of the granular protrusions is 100 nm or smaller. The number density of the granular protrusions per unit area is 10/m.sup.2 or higher.