An apparatus and method for electrochemically depositing a unitary layer structure using a reactor configured to contain an electrolyte solution with an anode array containing a plurality of independently electrically controllable anodes arranged in a two-dimensional array, a cathode, an addressing circuit configured to receive a signal containing anode address data and configured to output a signal causing an anode array pattern; and, a first controller being a current controller configured to control a flow of current to the anode array; a second controller in communication with the addressing circuit, the current controller and the anode array, the second controller operable to communicate with the current controller to command the flow of current to each anode in the anode array causing an electrochemical reaction at the cathode to deposit a layer corresponding to the anode array pattern signal received from the addressing circuit; and a third controller configured to clear bubbles which have formed on the anode after a length of time of steady state deposition by controlling the flow of the electrolyte solution across the anode array surface.

An apparatus and method for electrochemically depositing a unitary layer structure using a reactor configured to contain an electrolyte solution with an anode array containing a plurality of independently electrically controllable anodes arranged in a two-dimensional array, a cathode, an addressing circuit configured to receive a signal containing anode address data and configured to output a signal causing an anode array pattern; and, a first controller being a current controller configured to control a flow of current to the anode array; a second controller in communication with the addressing circuit, the current controller and the anode array, the second controller operable to communicate with the current controller to command the flow of current to each anode in the anode array causing an electrochemical reaction at the cathode to deposit a layer corresponding to the anode array pattern signal received from the addressing circuit; and a third controller configured to clear bubbles which have formed on the anode after a length of time of steady state deposition by controlling the flow of the electrolyte solution across the anode array surface.

The present disclosure provides electrolyte solutions for electrodeposition of zinc-iron alloys, methods of forming electrolyte solutions, and methods of electrodepositing zinc-iron alloys. An electrolyte solution for electroplating can include an alkali metal citrate, an alkali metal acetate, a citric acid, and glycine with a metal salt. An electrolyte solution can be formed by dissolving an alkali metal citrate, an alkali metal acetate, a citric acid, and glycine in water or an aqueous solution. Electrodepositing zinc-iron alloys on a substrate can include introducing a cathode and an anode into an electrolyte solution comprising an alkali metal citrate, an alkali metal acetate, a citric acid, and glycine. Electrodepositing can further include passing a current between the cathode and the anode through the electrolyte solution to deposit zinc and iron onto the cathode.

The present disclosure provides electrolyte solutions for electrodeposition of zinc-iron alloys, methods of forming electrolyte solutions, and methods of electrodepositing zinc-iron alloys. An electrolyte solution for electroplating can include an alkali metal citrate, an alkali metal acetate, a citric acid, and glycine with a metal salt. An electrolyte solution can be formed by dissolving an alkali metal citrate, an alkali metal acetate, a citric acid, and glycine in water or an aqueous solution. Electrodepositing zinc-iron alloys on a substrate can include introducing a cathode and an anode into an electrolyte solution comprising an alkali metal citrate, an alkali metal acetate, a citric acid, and glycine. Electrodepositing can further include passing a current between the cathode and the anode through the electrolyte solution to deposit zinc and iron onto the cathode.

The present invention refers to a process for the electrolytic deposition of a zinc or zinc alloy coating on a metallic substrate, a zinc coated metallic substrate having a specific gloss as well as an aqueous alkaline plating bath for the electrolytic deposition of a zinc or zinc alloy coating on a metallic substrate and the use of a zinc plating bath additive in a process for the electrolytic deposition of a zinc or zinc alloy coating on a metallic substrate and for improving the optical appearance and/or the adhesion of a zinc or zinc alloy coating on a metallic substrate.

The present invention refers to a process for the electrolytic deposition of a zinc or zinc alloy coating on a metallic substrate, a zinc coated metallic substrate having a specific gloss as well as an aqueous alkaline plating bath for the electrolytic deposition of a zinc or zinc alloy coating on a metallic substrate and the use of a zinc plating bath additive in a process for the electrolytic deposition of a zinc or zinc alloy coating on a metallic substrate and for improving the optical appearance and/or the adhesion of a zinc or zinc alloy coating on a metallic substrate.

The present invention refers to a process for the electrolytic deposition of a zinc or zinc alloy coating on a metallic substrate, a zinc coated metallic substrate having a specific gloss as well as an aqueous alkaline plating bath for the electrolytic deposition of a zinc or zinc alloy coating on a metallic substrate and the use of a zinc plating bath additive in a process for the electrolytic deposition of a zinc or zinc alloy coating on a metallic substrate and for improving the optical appearance and/or the adhesion of a zinc or zinc alloy coating on a metallic substrate.

The present invention refers to a process for the electrolytic deposition of a zinc or zinc alloy coating on a metallic substrate, a zinc coated metallic substrate having a specific gloss as well as an aqueous alkaline plating bath for the electrolytic deposition of a zinc or zinc alloy coating on a metallic substrate and the use of a zinc plating bath additive in a process for the electrolytic deposition of a zinc or zinc alloy coating on a metallic substrate and for improving the optical appearance and/or the adhesion of a zinc or zinc alloy coating on a metallic substrate.

Hot-stamped steel includes: a base metal that is steel including a tempered portion having hardness corresponding to 85% or less of the highest quenching hardness, the highest quenching hardness being defined as a Vickers hardness at a depth position spaced away from a surface by ? times a sheet thickness in a case of performing water quenching after heating at a temperature equal to or higher than an A.sub.c3 point and retention for 30 minutes; and a Zn coating layer that is formed on the tempered portion of the base metal. The Zn coating layer includes a solid-solution layer including a solid-solution phase that contains Fe and Zn that is solid-soluted in Fe, and a lamella layer that includes the solid-solution phase and a capital gamma phase. An area ratio of the lamella layer in the Zn coating layer is 20% or less.

The present disclosure provides electrolyte solutions for electrodeposition of zinc-iron alloys, methods of forming electrolyte solutions, and methods of electrodepositing zinc-iron alloys. An electrolyte solution for electroplating can include an alkali metal citrate, an alkali metal acetate, a citric acid, and glycine with a metal salt. An electrolyte solution can be formed by dissolving an alkali metal citrate, an alkali metal acetate, a citric acid, and glycine in water or an aqueous solution. Electrodepositing zinc-iron alloys on a substrate can include introducing a cathode and an anode into an electrolyte solution comprising an alkali metal citrate, an alkali metal acetate, a citric acid, and glycine. Electrodepositing can further include passing a current between the cathode and the anode through the electrolyte solution to deposit zinc and iron onto the cathode.