An apparatus for use in electrochemical layer deposition includes an anode array containing a plurality of independently electrically controllable anodes and immersible in an electrolyte. The plurality of anodes are arranged in a two-dimensional array. The anode array is connected electrically to, or disposed upon an integrated circuit, semiconductor, or combination of conductive and insulative elements meant for biasing the plurality of anodes with a potential. An anode addressing circuit is provided to receive a signal containing anode address data and to output a signal causing an anode array pattern. The anode addressing circuit communicates with a controller and the anode array. The controller is configured to electrically control each one of the plurality of anodes in the anode array to result in an electrochemical reaction at a cathode to deposit a layer corresponding to the anode array pattern signal received from the addressing circuit.

An apparatus for use in electrochemical layer deposition includes an anode array containing a plurality of independently electrically controllable anodes and immersible in an electrolyte. The plurality of anodes are arranged in a two-dimensional array. The anode array is connected electrically to, or disposed upon an integrated circuit, semiconductor, or combination of conductive and insulative elements meant for biasing the plurality of anodes with a potential. An anode addressing circuit is provided to receive a signal containing anode address data and to output a signal causing an anode array pattern. The anode addressing circuit communicates with a controller and the anode array. The controller is configured to electrically control each one of the plurality of anodes in the anode array to result in an electrochemical reaction at a cathode to deposit a layer corresponding to the anode array pattern signal received from the addressing circuit.

Provided herein are composite conductors, characterized by having copper deposits inside the bulk rather than on the outer surface of a non-metallic conductive porous matrix, such as CNT fabric, as well as a process for obtaining the same. The composite conductors provided herein are also characterized by a low specific weight and a high ampacity compared to metal conductors of similar size and shape.

Provided herein are composite conductors, characterized by having copper deposits inside the bulk rather than on the outer surface of a non-metallic conductive porous matrix, such as CNT fabric, as well as a process for obtaining the same. The composite conductors provided herein are also characterized by a low specific weight and a high ampacity compared to metal conductors of similar size and shape.

Provided herein are composite conductors, characterized by having copper deposits inside the bulk rather than on the outer surface of a non-metallic conductive porous matrix, such as CNT fabric, as well as a process for obtaining the same. The composite conductors provided herein are also characterized by a low specific weight and a high ampacity compared to metal conductors of similar size and shape.

Provided herein are composite conductors, characterized by having copper deposits inside the bulk rather than on the outer surface of a non-metallic conductive porous matrix, such as CNT fabric, as well as a process for obtaining the same. The composite conductors provided herein are also characterized by a low specific weight and a high ampacity compared to metal conductors of similar size and shape.

An ammonium salt compound represented by the following Chemical Formula 1:

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An ammonium salt compound represented by the following Chemical Formula 1:

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