Aqueous electroplating solution for alkaline electroplating, comprising: [M(NH.sub.3).sub.4].sup.2+ ions, wherein M is selected from the group consisting of Pd or Pt; and organic anions selected from the group consisting of bicarbonate, carbonate, or a mixture thereof; wherein the following species, if present, are present in the following amounts: alkali metals in an amount of less than 5 g/L; compounds comprising phosphorus in an amount of less than 5 g/L; compounds comprising boron in an amount of less than 5 g/L. The invention also relates to an electroplating bath comprising the electroplating solution, and a method of forming a metal layer on a substrate by electroplating using the electroplating solution.

The invention relates to an aqueous electroplating solution for alkaline electroplating, comprising: [M(NH3)4]2+ ions, wherein M is selected from the group consisting of Pd or Pt; and organic anions selected from the group consisting of bicarbonate, carbonate, or a mixture thereof; wherein the following species, if present, are present in the following amounts: alkali metals in an amount of less than 5 g/L; compounds comprising phosphorus in an amount of less than 5 g/L; compounds comprising boron in an amount of less than 5 g/L. The invention also relates to an electroplating bath comprising the electroplating solution, and a method of forming a metal layer on a substrate by electroplating using the electroplating solution.

The invention relates to an aqueous electroplating solution for alkaline electroplating, comprising: [M(NH3)4]2+ ions, wherein M is selected from the group consisting of Pd or Pt; and organic anions selected from the group consisting of bicarbonate, carbonate, or a mixture thereof; wherein the following species, if present, are present in the following amounts: alkali metals in an amount of less than 5 g/L; compounds comprising phosphorus in an amount of less than 5 g/L; compounds comprising boron in an amount of less than 5 g/L. The invention also relates to an electroplating bath comprising the electroplating solution, and a method of forming a metal layer on a substrate by electroplating using the electroplating solution.

A metal recovery device for recovering metal in a waste printed circuit board by way of electrodeposition including: a cathode, an anode, and an electrolyte in electrical communication with the cathode and the anode, wherein the electrolyte includes a glycol-based compound and a metal chloride. A method of preparing an electrolyte for use in the same. A method of metal recovery for recovering metal from waste printed circuit board by making use the same.