A method for depositing a zinc-nickel alloy on a substrate, including: (a) providing the substrate, (b) providing an aqueous zinc-nickel deposition bath as catholyte in a compartment, wherein the compartment includes an anode and anolyte, the anolyte being separated from catholyte by a membrane, and the catholyte includes nickel ions, complexing agent, zinc ions, (c) depositing zinc-nickel alloy onto the substrate, wherein after step (c) nickel ions have lower concentration than before step (c), (d) rinsing the zinc-nickel coated substrate in water, obtaining a rinsed zinc-nickel coated substrate and rinse water including a portion of the complexing agent and nickel ions, wherein (i) a portion of rinse water and/or a portion of catholyte is treated in a first treatment compartment to separate water from the complexing agent and the nickel ions, (ii) returning the separated complexing agent to the catholyte, and (iii) adding nickel ion to the catholyte.

An anti-corrosion terminal material including a base material made of copper or copper alloy and a coating film laminated on the base material: the coating film includes: a first coating film, provided with a zinc layer made of zinc alloy and a tin layer made of tin or tin alloy which are laminated in this order, and formed at a planned core contact part; and a second coating film including the tin layer but not comprising the zinc layer, which is provided at a planned contact part being a contact part when the terminal is formed: and the zinc layer has a thickness not less than 0.1 μm and not more than 5.0 μm and zinc concentration not less than 30% by mass and not more than 95% by mass, and has any one or more of nickel, iron, manganese, molybdenum, cobalt, cadmium, lead and tin as a balance.

Electrolyte solutions for electrodeposition of zinc alloys and methods of electrodepositing zinc-iron alloys. An electrolyte solution for electroplating can include an alkali metal hydroxide, a zinc salt, a condensation polymer of epichlorohydrin, a quaternary amine, an aliphatic amine, a polyhydroxy alcohol, an aromatic organic acid and/or salts thereof, an amino alcohol, a bisphosphonic acid and/or salts thereof, an iron salt, an alkali metal gluconate, and an amine-based chelating agent. Electrodepositing zinc alloys on a substrate can include introducing a cathode and an anode into an electrolyte solution comprising an alkali metal hydroxide, a zinc salt, a condensation polymer of epichlorohydrin, a quaternary amine, an aliphatic amine, a polyhydroxy alcohol, an aromatic organic acid and/or salts thereof, an amino alcohol, a bisphosphonic acid and/or salts thereof, an iron salt, an alkali metal gluconate, and an amine-based chelating agent.

A metal porous body having a three-dimensional network structure, includes: a framework forming the three-dimensional network structure; and a coating layer having fine pores and coating the framework, the three-dimensional network structure including a rib and a node connecting a plurality of ribs, the framework including an alkali-resistant first metal, the fine pores having an average fine pore diameter of 10 nm or more and 1 μm or less, the coating layer including an alkali-resistant second metal and optionally including an alkali-soluble metal, the alkali-soluble metal being contained at a proportion of 0% by mass or more and 30% by mass or less with reference to a total mass of the framework and the coating layer.

A Ni-plated steel sheet according to one aspect of the present invention includes a base steel sheet; and a Ni plating layer provided on a surface of the base steel sheet, wherein the Ni plating layer includes a Ni—Fe alloy layer formed on the surface of the base steel sheet, and a ratio of a Sn content to a Ni content in the Ni plating layer is 0.0005% to 0.10%.

A Ni-plated steel sheet according to one aspect of the present invention includes a base steel sheet and a Ni plating layer provided on a surface of the base steel sheet, the Ni plating layer has a Ni—Fe alloy layer formed on a surface of the base steel sheet, and a ratio of a Zn content to a Ni content in the Ni plating layer is 0.0005% to 0.10%. A manufacturing method of the Ni-plated steel sheet according to one aspect of the present invention has electroplating a base steel sheet using a Ni plating bath in which [Zn.sup.2+]/[Ni.sup.2+] is set to 0.0005% to 0.10% to obtain a material Ni-plated steel sheet, and annealing the material Ni-plated steel sheet.

The preset invention has as its object the provision of a laminate free of hexavalent chromium and excellent in corrosion resistance and wear resistance, and a manufacturing process of the laminate. To solve the above-described problems, a laminate according to the present invention includes a substrate, and a laminated film portion with metal films laminated in two or more layers. The laminate has an interface layer between each two adjacent ones of the metal films. The laminated film portion contains a first metal element as a principal component, the first metal element being at least one element of Ni, Cr, Co, and W, and a second metal element that is a metal element of smaller cohesive energy than that of the first metal element. The second metal element contained in the interface layer is at a content ratio higher than that of the second metal element contained in each of the adjacent metal films.

A composite copper foil contains a carrier layer, a release layer and an ultra-thin copper layer in this order. In the composite copper foil, the release layer includes a binary alloy or a ternary alloy comprising nickel, and is formed into an amorphous layer, and the ultra-thin copper layer is peelable from the carrier layer. A method of fabricating the composite copper foil includes preparing a carrier layer, forming a release layer which is amorphous on the carrier layer by electroplating using an electrolyte that comprises nickel, and forming an ultra-thin copper layer on the release layer by electroplating.

A novel method of preparing and using an improved electrolyte bath for the purpose of electrodeposition of metallic film onto a substrate is disclosed. The electrolyte bath makes use of unexpected findings in the process of electrodeposition with the claimed compounds and elements to perform the process with less expensive and more environmentally-friendly materials to produce a consistent, high-quality deposition.

Provided is a copper foil provided with a carrier in which the laser hole-opening properties of the ultrathin copper layer are good and which is suitable for producing a high-density integrated circuit substrate. A copper foil provided with a carrier having, in order, a carrier, an intermediate layer, and an ultrathin copper layer, wherein the specular gloss at 60° in an MD direction of the intermediate layer side surface of the ultrathin copper layer is 140 or less.