A porous membrane material comprising a porous membrane substrate coated with a thin, uniform coating of a metal or metal alloy. The membrane material can have high electrical conductivity. The membrane material can exhibit a very high ratio of electrical conductivity to thermal conductivity. The porous membrane substrate may be removed to form the membrane.

The printed circuit board for the memory card includes an insulating layer; a mounting unit formed on a first surface of the insulating layer and electrically connected to a memory device; a terminal unit formed on a second surface of the insulating layer and electrically connected to electronic apparatuses of an outside; and metal layers formed at the mounting unit and the terminal unit and made of the same material.

There is provided a method for producing a plated article, comprising immersing a substrate made of a conductive metal in a plating solution and forming a plating layer on the substrate by electroplating, wherein the plating solution is a solution containing 0.01 to 1 mol/L of Ni ions with pH of 6 or more; and a porous Ni plating layer is formed by performing the electroplating at a cathode current density of 10 A/dm.sup.2 or more. This method allows for easily producing a plated article wherein a uniform porous Ni plating layer is formed on the surface of a substrate.

A nickel-cobalt material and component includes a thermally stabilized nickel-cobalt alloy. The nickel-cobalt alloy disclosed herein includes nanocrystalline grain structures, pinning, such as Zener pinning, and intragranular twinning. The nickel-cobalt alloy disclosed herein exhibits multiple properties including an improved fracture toughness, an increased thermal stability, and an improved ultimate tensile strength.

A process for coating a metal article may include: preparing an electrolytic bath including a suspension of boron carbide particles in an aqueous solution including: at least one nickel (II) salt; and at least one phosphorous compound selected from: phosphoric acid, phosphorous acid, hypophosphorous acid, or their salts; and immersing, in the electrolytic bath, a cathode and an anode, and carrying out electrodeposition by passing direct current in the electrolytic bath. The cathode may include the metal article to be coated. The boron carbide particles may have an average size greater than or equal to 0.01 micron (μm) and less than or equal to 2 μm. The boron carbide particles may have been pretreated with at least one carboxylic acid or a derivative thereof. The at least one carboxylic acid or the derivative thereof may have a solubility in water at 20° C. greater than 0.10 grams/liter.

Disclosed is a composite electroplating method for sintered NdFeB magnet, including: a process of pre-treating sintered NdFeB magnet, a process of electroplating the pre-treated sintered NdFeB magnet, and a process of cleaning and drying the electroplated sintered NdFeB magnet. The electroplating process forms a composite coating composed of a Zn coating, a Zn—Ni alloy coating, a Cu coating and a Ni coating on the surface of the sintered NdFeB magnet.

A surface-treated metal plate including: a metal plate; and a nickel-cobalt binary alloy layer formed on the metal plate. When a part having a content ratio of oxygen atoms of 5 atomic % or more as measured by X-ray photoelectron spectroscopic analysis is an oxide coating film, the nickel-cobalt binary alloy layer contains the oxide coating film with a thickness of 0.5 to 30 nm on a surface thereof, and when a pressure cooker test including temperature increasing, retention for 72 hours under a water-vapor atmosphere at a temperature of 105° C. and a relative humidity of 100% RH, and temperature decreasing is performed, the amount of increase in the thickness of the oxide coating film is 28 nm or less.

The present invention provides a copper-nickel alloy electroplating bath which contains (a) a copper salt and a nickel salt, (b) a metal complexing agent, (c) a conductivity imparting agent, (d) a sulfur-containing organic compound and (e) a redox potential regulator.

Provided is a copper-nickel alloy electroplating apparatus which is capable of stably forming a copper-nickel plated coating on a workpiece with a uniform composition and which enables a plating bath to be used for a long period. The present invention provides a copper-nickel alloy electroplating apparatus (1), comprising: a cathode chamber (4) in which a workpiece (5) is to be placed; an anode chamber (6); an anode (7) placed in the anode chamber; an electrically conductive diaphragm (14) placed to separate the cathode chamber and the anode chamber from each other; a cathode chamber oxidation-reduction potential adjusting tank (8) for adjusting the oxidation-reduction potential of a plating liquid in the cathode chamber; an anode chamber oxidation-reduction potential adjusting tank (10) for adjusting the oxidation-reduction potential of a plating liquid in the anode chamber; and a power supply unit (36) that provides an electric current to flow between the workpiece and the anode.

Disclosed herein is a catalytic assembly comprising a porous electrically conductive substrate, and a porous metallic composite coating the substrate, where the catalytic assembly has a three dimensional interpenetrating porous structure, where the substrate has a three dimensional interpenetrating porous structure having a first average pore diameter (PD.sub.SUB), and the porous metallic composite is amorphous and has a three dimensional interpenetrating porous structure having a second average pore diameter (PD.sub.PMC), the PD.sub.PMC being sufficiently smaller than the PD.sub.SUB to allow the porous metallic composite to coat substrate surfaces throughout the substrate including surfaces of pores in the substrate. The catalytic assembly may be suitable for use as oxygen evolution reaction (OER) catalysts and hydrogen evolution reaction (HER) catalysts, among others.