A method for microstructure modification of conducting lines is provided. An electroplating process is performed to deposit the metal thin film/conducting line(s) with a face-centered cubic (FCC) structure and a preferred crystallographic orientation over a surface of a substrate. The metal thin film/conducting line(s) is subsequently subjected to a thermal annealing process to modify its microstructure with the grain sizes in a range of 5 μm to 100 μm. The thermal annealing process is conducted at the temperature of above 25 degrees Celsius and below 240 degrees Celsius.

A vapor deposition metal mask substrate includes a nickel-containing metal sheet including a obverse surface and a reverse surface, which is opposite to the obverse surface. At least one of the obverse surface and the reverse surface is a target surface for placing a resist layer. The target surface has a surface roughness Sa of less than or equal to 0.019 μm. The target surface has a surface roughness Sz of less than or equal to 0.308 μm.

The metal plate includes a plurality of pits located on the surface of the metal plate. The manufacturing method for a metal plate for use in manufacturing of a deposition mask includes an inspection step of determining a quality of the metal plate based on a sum of volumes of a plurality of pits located at a portion of the surface of the metal plate.

Articles including a layer comprising nickel and chromium as well as related methods are described herein.

An electrolyte for electrochemical machining of a γ-γ′ nickel-based superalloy includes NaNO.sub.3 at a content of between 10 and 50% by weight relative to the total weight of the electrolyte; an additive chosen from KBr, NaBr, KI, NaI and mixtures thereof, in an additive/NaNO.sub.3 molar ratio of between 1 and 15; optionally an ethylenediaminetetraacetic acid-based complexing agent at a content of between 1 and 5% by weight relative to the total weight of the electrolyte at a pH of between 6 and 12; optionally an anionic surfactant at a content of between 1 and 5% by weight relative to the total weight of the electrolyte; optionally NaOH to obtain the appropriate pH; and an aqueous solvent.

The present invention relates to a plated steel sheet for hot stamping comprising a steel sheet and a Zn—Ni plating layer formed on at least one surface of the steel sheet, wherein the Zn—Ni plating layer has an Ni concentration of 8 mass % or more, a plating deposition amount of 10 g/m.sup.2 or more and 90 g/m.sup.2 or less per surface, and an average grain size of 50 nm or more, and a difference between a diffraction peak of the Zn—Ni plating layer after heat treating the plated steel sheet for hot stamping at 200° C. for 1 hour, and a diffraction peak of the Zn—Ni plating layer before heat treating it, is 0.3° or less.

A terminal material for a connector terminal, using a copper or copper alloy substrate is crimped to an end of wire formed from an aluminum wire material; and a terminal using this terminal material: a zinc layer 4 that is formed of zinc or a zinc alloy and a tin layer 5 that is formed of tin or a tin alloy are sequentially laminated in this order on a substrate 2 that is formed of copper or a copper alloy: with respect to the zinc layer and the tin layer, the adhesion amount of tin contained in the whole layers is from 0.5 mg/cm.sup.2 to 7.0 mg/cm.sup.2 (inclusive) and the adhesion amount of zinc contained in the whole layers is from 0.07 mg/cm.sup.2 to 2.0 mg/cm.sup.2 (inclusive), and the content percentage of zinc in the vicinity of the surface is from 0.2% by mass to 10.0% by mass (inclusive).

An electrolyte solution for iron-tungsten plating is prepared by dissolving in an aqueous medium a divalent iron salt (e.g., iron (II) sulfate) and an alkali metal citrate (e.g., sodium citrate, potassium citrate, or other alkali metal citrate) to form a first solution, dissolving in the first solution a tungstate salt (e.g., sodium tungstate, potassium tungstate, or other potassium tungstate) to form a second solution, and dissolving in the second solution a citric acid to form the electrolyte solution. An iron-tungsten coating is formed on a substrate using the electrolyte solution by passing a current between a cathode and an anode through the electrolyte solution to deposit iron and tungsten on the substrate.

An electrode for a battery, comprising an active material and a metallic fabric is disclosed. The metallic fabric comprises fibers being at least partially covered by a coating of nickel or copper, which comprises a layer and a plurality of protrusions protruding from the layer. The active material is attached on the protrusions. The metallic fabric provides a high electrical conductivity and a high mechanical stability, and demonstrates outstanding performance for the use as a current collector of battery.

Articles and methods for depositing iron alloy coatings onto metal wires for wireless recharging devices are generally described.