C25D3/562

High-strength galvanized steel sheet and method for producing the same

Provided are a high-strength galvanized steel sheet having excellent delayed fracture resistance by reducing the diffusible hydrogen content in the steel and a method for producing the same. The high-strength galvanized steel sheet includes a steel sheet having a prescribed composition and a microstructure including martensite and tempered martensite, the total area fraction of the martensite and the tempered martensite being 30% or more, and a galvanizing layer formed on the surface of the steel sheet. The diffusible hydrogen content in the high-strength galvanized steel sheet is 0.50 wt. ppm or less. The half-width of the hydrogen release peak of the high-strength galvanized steel sheet is 70° C. or less. The diffusible hydrogen content and the half-width of the hydrogen release peak are determined by a prescribed analysis method.

Surface Treated Copper Foil, Copper Clad Laminate, And Printed Circuit Board
20210360785 · 2021-11-18 ·

A surface treated copper foil 1 includes a copper foil 2, and a first surface treatment layer 3 formed on one surface of the copper foil 2. The first surface treatment layer 3 of the surface treated copper foil 1 has a root mean square gradient of roughness curve elements RΔq according to JIS B0601:2013 of 5 to 28°. A copper clad laminate 10 includes the surface treated copper foil 1 and an insulating substrate 11 adhered to the first surface treatment layer 3 of the surface treated copper foil 1.

Diffusion barrier to prevent super alloy depletion into nickel-CBN blade tip coating

A diffusion barrier coating on a nickel-based alloy substrate comprising the diffusion barrier being coupled to the substrate between the substrate and a composite material opposite the substrate, wherein the diffusion barrier comprises a nickel phosphorus alloy material.

HYDROGEN EVOLUTION REACTION CATALYST
20220010440 · 2022-01-13 ·

The invention relates to a catalyst for the hydrogen evolution reaction (HER) and methods for using the catalyst in a water-splitting process. The invention also provides a composition, a material and an electrode comprising the catalyst. In particular, the invention relates to a hydrogen evolution reaction (HER) catalyst comprising a catalytic metal species comprising an active catalyst species and a vanadium species; wherein the catalytic metal species and the vanadium species are interspersed within the HER catalyst.

METHOD OF SYNTHESIZING HIGH-EFFICIENCY BIFUNCTIONAL ELECTROCATALYSTS
20210354120 · 2021-11-18 ·

The design of bifunctional catalysts for water splitting by modifying the electronic structure of the catalyst. That bifunctional catalyst that is synthesized is a quaternary FeNi—PSe nanoporous film (FeNi—PSe NF). A self-supported FeNi—PSE NF is synthesized and used as an anode and a cathode in a two-electrode electrolytic cell. The cell is subjected to a water source, and the FeNi—PSe NFs split the water molecules to produce hydrogen fuel. The slightly oxidized FeNi—PSe surface serves as an active site for oxygen evolution reactions, making hydrogen evolution reactions and oxygen evolution reactions well-balanced, thereby improving electrolysis efficiency.

Surface-treated steel sheet for battery cases, battery case and battery

A surface-treated steel sheet for battery cases is provided which comprises a nickel-cobalt alloy layer formed at the outermost surface of a plane to be an inner surface of a battery case, wherein a Co/Ni value at the surface of the nickel-cobalt alloy layer is within a range of 0.1 to 1.5 as determined by Auger electron spectroscopy analysis.

Gas exchange valve for an internal combustion engine

A gas exchange valve for an internal combustion engine may include a valve stem and a wear resistance improving functional layer. The valve stem may extend in an axial direction and may transition into a valve plate in the axial direction. The functional layer may include nickel and tungsten. The functional layer may be arranged in a coating area on an outer circumference of the valve stem and may at least partially define a sliding surface.

IRON TUNGSTEN COATING FORMULATIONS AND PROCESSES

An electrolyte solution for iron-tungsten plating is prepared by dissolving in an aqueous medium a divalent iron salt (e.g., iron (II) sulfate) and an alkali metal citrate (e.g., sodium citrate, potassium citrate, or other alkali metal citrate) to form a first solution, dissolving in the first solution a tungstate salt (e.g., sodium tungstate, potassium tungstate, or other potassium tungstate) to form a second solution, and dissolving in the second solution a citric acid to form the electrolyte solution. An iron-tungsten coating is formed on a substrate using the electrolyte solution by passing a current between a cathode and an anode through the electrolyte solution to deposit iron and tungsten on the substrate.

Nickel-chromium nanolaminate coating having high hardness
11168408 · 2021-11-09 · ·

The present disclosure describes electrodeposited nanolaminate materials having layers comprised of nickel and/or chromium with high hardness. The uniform appearance, chemical resistance, and high hardness of the nanolaminate NiCr materials described herein render them useful for a variety of purposes including wear (abrasion) resistant barrier coatings for use both in decorative as well as demanding physical, structural and chemical environments.

Copper electrodeposition on cobalt lined features

In one example, an electroplating system comprises a bath reservoir, a holding device, an anode, a direct current power supply, and a controller. The bath reservoir contains an electrolyte solution. The holding device holds a wafer submerged in the electrolyte solution. The wafer comprises features covered by a cobalt layer. The anode is opposite to the wafer and submerged in the electrolyte solution. The direct current power supply generates a direct current between the holding device and the anode. A combination of forward and reverse pulses is applied between the holding device and the anode to electroplate a copper layer on the cobalt layer of the wafer.