C25D3/565

COLLECTOR PLATE
20210002779 · 2021-01-07 ·

The present invention provides a collector plate including a porous ultra-thin copper foil made by the method for manufacturing porous ultra-thin copper foil. One of surfaces of the porous ultra-thin copper foil has a plurality of pores and the thickness of the porous ultra-thin copper foil is between 1 and 5 micron.

ULTRA-THIN COPPER FOIL STRUCTURE, ELECTROMAGNETIC INTERFERENCE SHIELD, COPPER CLAD LAMINATE AND PRINTED CIRCUIT BOARD
20210002780 · 2021-01-07 ·

The present invention provides an ultra-thin copper foil structure including a carrier layer, a separation layer, and an ultra-thin copper layer. The carrier layer has a predetermined surface. The separation layer is formed on the predetermined surface of the carrier layer. The ultra-thin copper layer is disposed on the carrier layer through the separation layer. The separation layer includes at least two of nickel, molybdenum, chromium, and their salts.

A method for the manufacture of a coated steel sheet

A steel sheet coated with a coating comprising from 10 to 40% of nickel, the balance being zinc, such steel sheet having a microstructure comprising from 1 to 50% of residual austenite, from 1 to 60% of martensite and optionally at least one element chosen from: bainite, ferrite, cementite and pearlite, and the following chemical composition in weight: 0.10<C<0.50%, 1.0<Mn<5.0%, 0.7<Si<3.0%, 0.05<Al<1.0%, 0.75<(Si+Al)<3.0% and on a purely optional basis, one or more elements such as Nb0.5%, B0.005%, Cr1.0%, Mo0.50%, Ni1.0%, Ti0.5%, the remainder of the composition making up of iron and inevitable impurities resulting from the elaboration.

Threaded Connection for Pipes and Method for Producing Threaded Connection for Pipes

The threaded connection for pipes includes a pin, a box and a ZnNi alloy plating layer. The pin has a pin-side contact surface that includes a pin-side thread part. The box has a box-side contact surface that includes a box-side thread part. The ZnNi alloy plating layer is formed on at least one of the pin-side contact surface and the box-side contact surface. The ZnNi alloy plating layer is consisting of Zn, Ni, trace amount of Cr and impurities. The trace amount of Cr content of the ZnNi alloy plating layer is 5.010 counts/sec or more in terms of Cr intensity as measured by secondary ion mass spectrometry using O.sub.2.sup.+ ions as bombarding ions.

Acidic zinc and zinc nickel alloy plating bath composition and electroplating method

The present invention relates to an acidic zinc or zinc-nickel alloy plating bath composition comprising a source for zinc ions, optionally a source for nickel ions, a source for chloride ions and at least one dithiocarbamyl alkyl sulfonic acid or salt thereof. Said plating bath composition and the corresponding plating method result in zinc or zinc-nickel alloy layers having an improved throwing power and thickness distribution, particularly when plating substrates having a complex shape and/or in rack-and-barrel plating.

METAL POROUS BODY

A metal porous body having a three-dimensional network structure, includes: a framework forming the three-dimensional network structure; and a coating layer having fine pores and coating the framework, the three-dimensional network structure including a rib and a node connecting a plurality of ribs, the framework including an alkali-resistant first metal, the fine pores having an average fine pore diameter of 10 nm or more and 1 m or less, the coating layer including an alkali-resistant second metal and optionally including an alkali-soluble metal, the alkali-soluble metal being contained at a proportion of 0% by mass or more and 30% by mass or less with reference to a total mass of the framework and the coating layer.

Electrolytic Preparation Of A Metal Substrate For Subsequent Electrodeposition

A method of plating a workpiece, the method includes electrochemically removing any oxide on the surface of the workpiece by applying a first waveform to the workpiece and a cathode both placed in a first electrolyte solution, and electroplating the workpiece surface by applying a second waveform to the workpiece and an anode both placed in a second electrolyte solution including a plating material.

Zinc-based plated steel sheet

[Object] To provide a zinc-based plated steel sheet excellent in coating film adhesiveness after hot pressing more conveniently. [Solution] A zinc-based plated steel sheet according to the present invention comprises: a zinc-based plated steel sheet that is a base metal; and a surface treatment layer formed on at least one surface of the zinc-based plated steel sheet, in which the surface treatment layer contains one or more oxides selected from titanium oxide, nickel oxide, and tin(IV) oxide each having a particle size of more than or equal to 2 nm and less than or equal to 500 nm, in a range of more than or equal to 0.2 g/m.sup.2 and less than or equal to 2 g/m.sup.2 per one surface.

COMPOSITIONALLY MODULATED ZINC-IRON MULTILAYERED COATINGS

The present disclosure provides electrolyte solutions for electrodeposition of zinc-iron alloys, methods of forming electrolyte solutions, and methods of electrodepositing zinc-iron alloys. An electrolyte solution for electroplating can include an alkali metal citrate, an alkali metal acetate, a citric acid, and glycine with a metal salt. An electrolyte solution can be formed by dissolving an alkali metal citrate, an alkali metal acetate, a citric acid, and glycine in water or an aqueous solution. Electrodepositing zinc-iron alloys on a substrate can include introducing a cathode and an anode into an electrolyte solution comprising an alkali metal citrate, an alkali metal acetate, a citric acid, and glycine. Electrodepositing can further include passing a current between the cathode and the anode through the electrolyte solution to deposit zinc and iron onto the cathode.

METAL OR METAL ALLOY DEPOSITION COMPOSITION AND PLATING COMPOUND

The present invention concerns a metal or metal alloy deposition composition, particularly a copper or copper alloy deposition composition, for electrolytic deposition of a metal or metal alloy layer, particularly for electrolytic deposition of a copper or copper alloy layer, comprising at least one type of metal ions to be deposited, preferably copper ions, and at least one imidazole based plating compound. The present invention further concerns a method for preparation of the plating compound, the plating compound itself and its use in a metal or metal alloy deposition composition. The inventive metal or metal alloy deposition composition can be preferably used for filling recessed structures, in particular those having higher diameter to depth aspect ratios.