A method includes: agitating base members that has been immersed in an electrolytic solution inside of an electroplating tank so as to flow in a circumference direction along an inner wall of the electroplating tank; and electroplating the base members flowing along the circumference direction in the electrolytic solution inside of the electroplating tank. The flow of the base members along the circumference direction is caused by a flow of magnetic media along the circumference direction in the electrolytic solution inside of the electroplating tank or is caused by rotation of an agitation unit provided at a bottom side of the electroplating tank. At least one of the base members touches a bottom cathode, and a base member positioned upward relative to the base member touching the bottom cathode is electrically connected to the bottom cathode via at least the base member touching the bottom cathode.

A method includes: agitating base members that has been immersed in an electrolytic solution inside of an electroplating tank so as to flow in a circumference direction along an inner wall of the electroplating tank; and electroplating the base members flowing along the circumference direction in the electrolytic solution inside of the electroplating tank. The flow of the base members along the circumference direction is caused by a flow of magnetic media along the circumference direction in the electrolytic solution inside of the electroplating tank or is caused by rotation of an agitation unit provided at a bottom side of the electroplating tank. At least one of the base members touches a bottom cathode, and a base member positioned upward relative to the base member touching the bottom cathode is electrically connected to the bottom cathode via at least the base member touching the bottom cathode.

An apparatus and method for measuring the isoelectric pH for materials deposited on or otherwise affixed onto and in contact with an electrode surface, and a method for utilizing the isoelectric pH to form nanometer thickness, self-assembled layers on the material, are described. Forming such layers utilizing information obtained about the isoelectric pH values of the substrate and the coating is advantageous since the growth of the coating is self-limiting because once the surface charge has been neutralized there is no longer a driving force for the solid electrolyte coating thickness to increase, and uniform coatings without pinhole defects will be produced because a local driving force for assembly will exist if any bare electrode material is exposed to the solution. The present self-assembly procedure, when combined with electrodeposition, may be used to increase the coating thickness. Self-assembly, with or without additional electrodeposition, allows intimate contact between the anode, electrolyte and cathode which is required for successful application to solid-state batteries, as an example.

A composition comprising a source of metal ions and at least one additive comprising at least one polyaminoamide, said polyaminoamide comprising the structural unit represented by formula I ##STR00001##
or derivatives of the polyaminoamide of formula I obtainable by complete or partial protonation, N-functionalization or N-quaternization with a non-aromatic reactant,
wherein D.sup.6 is, for each repeating unit 1 to s independently, a divalent group selected from a saturated or unsaturated C.sub.1-C.sub.20 organic radical, D.sup.7 is, for each repeating unit 1 to s independently, a divalent group selected from straight chain or branched C.sub.2-C.sub.20 alkanediyl, which may optionally be interrupted by heteroatoms or divalent groups selected from O, S and NR.sup.10, R.sup.1 is, for each repeating unit 1 to s independently, selected from H, C.sub.1-C.sub.20 alkyl, and C.sub.1-C.sub.20 alkenyl, which may optionally be substituted by hydroxyl, alkoxy or alkoxycarbonyl, or, together with R.sup.2, may form a divalent group D.sup.8, and R.sup.2 is, for each repeating unit 1 to s independently, selected from H, C.sub.1-C.sub.20 alkyl, and C.sub.1-C.sub.20 alkenyl, which may optionally be substituted by hydroxyl, alkoxy or alkoxycarbonyl, or, together with R.sup.1, may form a divalent group D.sup.8, and D.sup.8 is selected from straight chain or branched C.sub.1-C.sub.18 alkanediyl, which may optionally be interrupted by heteroatoms or divalent groups selected from O, S and NR.sup.10, s is an integer from 1 to 250, R.sup.10 is selected from H, C.sub.1-C.sub.20 alkyl, and C.sub.1-C.sub.20 alkenyl, which may optionally be substituted by hydroxyl, alkoxy or alkoxycarbonyl.

An electrode for a battery, comprising an active material and a metallic fabric is disclosed. The metallic fabric comprises fibers being at least partially covered by a coating of nickel or copper, which comprises a layer and a plurality of protrusions protruding from the layer. The active material is attached on the protrusions. The metallic fabric provides a high electrical conductivity and a high mechanical stability, and demonstrates outstanding performance for the use as a current collector of battery.

An electrode for a battery, comprising an active material and a metallic fabric is disclosed. The metallic fabric comprises fibers being at least partially covered by a coating of nickel or copper, which comprises a layer and a plurality of protrusions protruding from the layer. The active material is attached on the protrusions. The metallic fabric provides a high electrical conductivity and a high mechanical stability, and demonstrates outstanding performance for the use as a current collector of battery.

Disclosed is a copper foil including a copper layer and an anticorrosive layer disposed on the copper layer, wherein the copper foil has a peak to arithmetic mean roughness (PAR) of 0.8 to 12.5, a tensile strength of 29 to 58 kgf/mm.sup.2, and a weight deviation of 3% or less, wherein the PAR is calculated in accordance with the following Equation 1:
PAR=Rp/Ra  [Equation 1] wherein Rp is a maximum profile peak height and Ra is an arithmetic mean roughness.

Disclosed is a copper foil including a copper layer and an anticorrosive layer disposed on the copper layer, wherein the copper foil has a peak to arithmetic mean roughness (PAR) of 0.8 to 12.5, a tensile strength of 29 to 58 kgf/mm.sup.2, and a weight deviation of 3% or less, wherein the PAR is calculated in accordance with the following Equation 1:
PAR=Rp/Ra  [Equation 1] wherein Rp is a maximum profile peak height and Ra is an arithmetic mean roughness.

A copper or copper alloy electroplating bath has two or more electrolytes. The two or more electrolytes include at least one selected from nitric acid and a nitrate. The two or more electrolytes can form electrodeposits, such as a group of high-aspect bump electrodes, that have a uniform height or thickness at high speed.

A copper or copper alloy electroplating bath has two or more electrolytes. The two or more electrolytes include at least one selected from nitric acid and a nitrate. The two or more electrolytes can form electrodeposits, such as a group of high-aspect bump electrodes, that have a uniform height or thickness at high speed.