The disclosure provides a Sn—In electroplating bath that is Pb-free, environmentally safe, operates at room temperature, and does not require changes in existing plating assemblies. Room temperature aging and limited thermal cycling tests show that the electroplated Sn—In alloy film on a Cu substrate effectively mitigates whisker growth.

The disclosure provides a Sn—In electroplating bath that is Pb-free, environmentally safe, operates at room temperature, and does not require changes in existing plating assemblies. Room temperature aging and limited thermal cycling tests show that the electroplated Sn—In alloy film on a Cu substrate effectively mitigates whisker growth.

Described herein is an aqueous composition including tin ions and at least one compound of formula I ##STR00001##
where X.sup.1, X.sup.2 are independently selected from a linear or branched C.sub.1-C.sub.12 alkanediyl, R.sup.11 is a monovalent group of formula —(O—CH.sub.2—CHR.sup.41).sub.m—OR.sup.42, R.sup.12, R.sup.13, R.sup.14 are independently selected from H, R.sup.11, and R.sup.40; R.sup.15 is selected from H, R.sup.11, R.sup.40 and —X.sup.4—N(R.sup.21).sub.2, X.sup.4 is a divalent group selected from (a) a linear or branched C.sub.1 to C.sub.12 alkanediyl, and (b) formula —(O—CH.sub.2—CHR.sup.41).sub.o—, R.sup.21 is selected from R.sup.11 and R.sup.40, R.sup.40 is a linear or branched C.sub.1-C.sub.20 alkyl, R.sup.41 is selected from H and a linear or branched C.sub.1 to C.sub.5 alkyl, R.sup.42 is selected from H and a linear or branched C.sub.1-C.sub.20 alkyl, n is an integer of from 1 to 6, m is an integer of from 2 to 250, and o is an integer of from 1 to 250.

Described herein is an aqueous composition including tin ions and at least one compound of formula I ##STR00001##
where X.sup.1, X.sup.2 are independently selected from a linear or branched C.sub.1-C.sub.12 alkanediyl, R.sup.11 is a monovalent group of formula —(O—CH.sub.2—CHR.sup.41).sub.m—OR.sup.42, R.sup.12, R.sup.13, R.sup.14 are independently selected from H, R.sup.11, and R.sup.40; R.sup.15 is selected from H, R.sup.11, R.sup.40 and —X.sup.4—N(R.sup.21).sub.2, X.sup.4 is a divalent group selected from (a) a linear or branched C.sub.1 to C.sub.12 alkanediyl, and (b) formula —(O—CH.sub.2—CHR.sup.41).sub.o—, R.sup.21 is selected from R.sup.11 and R.sup.40, R.sup.40 is a linear or branched C.sub.1-C.sub.20 alkyl, R.sup.41 is selected from H and a linear or branched C.sub.1 to C.sub.5 alkyl, R.sup.42 is selected from H and a linear or branched C.sub.1-C.sub.20 alkyl, n is an integer of from 1 to 6, m is an integer of from 2 to 250, and o is an integer of from 1 to 250.

[Object] Provided is a technique capable of reducing the possibility of generation of a Cu—Sb compound in an overlay and the possibility of delamination between layers.

[Solution] A sliding member includes: an overlay including an alloy plating film of Bi and Sb; a lining including an Al alloy; a first intermediate layer including Cu as a main component, and laminated on the lining; and a second intermediate layer including Ag as a main component, and connecting the first intermediate layer and the overlay.

An electroplating bath for depositing a silver/tin alloy on a substrate. The electroplating bath comprises (a) a source of tin ions; (b) a source of silver ions; (c) an acid; (d) a first complexing agent; (e) a second complexing agent, wherein the second complexing agent is selected from the group consisting of allyl thioureas, aryl thioureas, and alkyl thioureas, and combinations thereof; and (f) optionally, a wetting agent, and (g) optionally, an antioxidant.

Method of manufacturing a ground apparatus and ground apparatus comprising an aluminum nut (16) having an internal thread and adapted to clamp an eyelet (28) of an electrical conductor on a corresponding contact area of the stud (12), wherein the nut (16) has at least one coating (30) which contains at least zinc, characterized in that the coating further comprises tin, in that the coating consists of an acid tin-zinc electroplating on the aluminum nut (16) and is such that the tin is between 60 and 80% by weight of the coating and the tin-zinc coating forms a layer with an average thickness of from about 5 to 16 microns

A tin or tin alloy plating solution includes: (A) a soluble salt containing at least a stannous salt; (B) an acid selected from an organic acid and an inorganic acid or a salt thereof; (C) a surfactant; and (D) a leveling agent. In addition, the surfactant contains polyoxyethylene polyoxypropylene alkylamine, an alkyl group of the polyoxyethylene polyoxypropylene alkylamine is C.sub.aH2.sub.a+1 (where a is 12 to 18). Further, in a case where a number of a functional group of polyoxypropylene of the polyoxyethylene polyoxypropylene alkylamine is set as p and a number of a functional group of polyoxyethylene of the polyoxyethylene polyoxypropylene alkylamine is set as q, the sum of p and q (p+q) is 8 to 21, and a ratio of p to q (p/q) is 0.1 to 1.6.

The composition according to the present embodiment is a composition for forming a lubricant coating layer on a threaded connection for pipes or tubes, and contains Cr.sub.2O.sub.3, a metal soap, a wax and a basic metal salt of an aromatic organic acid. The threaded connection for pipes or tubes according to the present embodiment includes a pin and a box. The pin and the box each include a contact surface including a threaded portion. The threaded connection for pipes or tubes includes, as an outermost layer, a lubricant coating layer formed from the aforementioned composition on at least one of the contact surfaces of the pin and the box.

A tin alloy electroplating bath, wherein the tin alloy electroplating bath includes (A) a soluble tin salt, (B) a soluble nickel salt and/or a soluble cobalt salt, (C) an oxycarboxylic acid or a salt thereof, (D) a nitrogen-containing heterocyclic unsaturated compound, and (E) a surfactant, and the pH of the tin alloy electroplating bath is 3 to 7.