Superconformally filling a recessed feature includes: contacting the recessed feature with superconformal filling composition that includes: Au(SO.sub.3).sub.2.sup.3 anions; SO.sub.3.sup.2 anions; and Bi.sup.3+ cations; convectively transporting Au(SO.sub.3).sub.2.sup.3 and Bi.sup.3+ to the bottom member of the recessed feature; subjecting the recessed feature to an electrical current to superconformally deposit gold from the Au(SO.sub.3).sub.2.sup.3 on the bottom member relative to the sidewall and the field, the electrical current providing a cathodic voltage; and increasing the electrical current subjected to the field and the recessed feature to maintain the cathodic voltage between 0.85 V and 1.00 V relative to the SSE during superconformally depositing gold on the substrate to superconformally fill the recessed feature of the article with gold as a superconformal filling of gold, the superconformal filling being void-free and seam-free.

Superconformally filling a recessed feature includes: contacting the recessed feature with superconformal filling composition that includes: Au(SO.sub.3).sub.2.sup.3 anions; SO.sub.3.sup.2 anions; and Bi.sup.3+ cations; convectively transporting Au(SO.sub.3).sub.2.sup.3 and Bi.sup.3+ to the bottom member of the recessed feature; subjecting the recessed feature to an electrical current to superconformally deposit gold from the Au(SO.sub.3).sub.2.sup.3 on the bottom member relative to the sidewall and the field, the electrical current providing a cathodic voltage; and increasing the electrical current subjected to the field and the recessed feature to maintain the cathodic voltage between 0.85 V and 1.00 V relative to the SSE during superconformally depositing gold on the substrate to superconformally fill the recessed feature of the article with gold as a superconformal filling of gold, the superconformal filling being void-free and seam-free.

The present invention concerns a metal or metal alloy deposition composition, particularly a copper or copper alloy deposition composition, for electrolytic deposition of a metal or metal alloy layer, particularly for electrolytic deposition of a copper or copper alloy layer, comprising at least one type of metal ions to be deposited, preferably copper ions, and at least one imidazole based plating compound. The present invention further concerns a method for preparation of the plating compound, the plating compound itself and its use in a metal or metal alloy deposition composition. The inventive metal or metal alloy deposition composition can be preferably used for filling recessed structures, in particular those having higher diameter to depth aspect ratios.

A method of forming a radio frequency (RF) strap for use in a process chamber is provided. The method includes positioning a core strap including a first material that is electrically and thermally conductive in a first electrochemical bath. The first electrochemical bath includes a first solvent and a first plating precursor. The method further includes forming a first protective coating on an outer surface of the core strap, removing the first solvent and the first plating precursor from the core strap having the first protective coating formed thereon, post-treating the core strap having the first protective coating formed thereon, positioning the core strap having the first protective coating formed thereon in a second electrochemical bath, and forming a second protective coating on an outer surface of the first protective coating. The first protective coating includes nickel, the second electrochemical bath includes a second solvent and a second plating precursor, and the second protective coating includes gold.

A method for the galvanoplastic deposition of a gold alloy on an electrode dipped into a bath including gold metal, organometallic compounds, a wetting agent, a sequestering agent and free cyanide, the alloy metals being copper metal and silver metal allowing a mirror-bright yellow gold alloy to be deposited on the electrode characterized in that the bath respects a proportion of 21.53% gold, 78.31% copper and 0.16% silver.

A method for the galvanoplastic deposition of a gold alloy on an electrode dipped into a bath including gold metal, organometallic compounds, a wetting agent, a sequestering agent and free cyanide, the alloy metals being copper metal and silver metal allowing a mirror-bright yellow gold alloy to be deposited on the electrode characterized in that the bath respects a proportion of 21.53% gold, 78.31% copper and 0.16% silver.

The present application relates to systems and methods for forming catalysts for use in fuel cells, other energy storage/generation devices, and other applications where catalysts may be used. In embodiments, a catalyst comprising one or more metallic glass structures may be formed by disposing a porous mold in a plating bath comprising one or more dissolved metal salts. An electrodeposition process may be initiated by applying current to the plating bath, where the electrodeposition process forms the one or more metallic glass structures within pores of the porous mold. One or more sensors may be used to monitor one or more properties of the electrodeposition process during the application of the current to the plating bath, and the one or more properties of the electrode-position process may be controlled, based on the monitoring of the one or more parameters, to adjust one or more characteristics of the metallic glass structures.

The invention relates to a cyanide-free formulation for the electrodeposition of a layer of gold and silver on electrically conductive substrates, wherein the formulation respectively contains a complexing agent from the group of sulfites and thiosulfates and is characterized in that at least one transition metal from the 5th or 6th sub-group is added in the form of the soluble oxygen acid thereof in order to increase the bath stability.

A method of galvanoplastic deposition of a gold alloy on an electrode dipped into a bath including metal gold in alkaline aurocyanide form, organometallic compounds, a wetting agent, a sequestering agent and free cyanide, where the alloy metals are copper, in double copper and potassium cyanide form, and silver in cyanide form, allowing a mirror bright yellow gold alloy to be deposited on the electrode.

A method of galvanoplastic deposition of a gold alloy on an electrode dipped into a bath including metal gold in alkaline aurocyanide form, organometallic compounds, a wetting agent, a sequestering agent and free cyanide, where the alloy metals are copper, in double copper and potassium cyanide form, and silver in cyanide form, allowing a mirror bright yellow gold alloy to be deposited on the electrode.