The present invention is directed to the electrolytic deposition of an alloy predominantly containing silver. Further constituents of the deposited alloy layer are palladium, tellurium and one or more of the metals Ce, Dy, Pb, Bi, Al, Ga, Ge, Fe, In, Co, Ni, Cu, Sn, Sb, Rh, Ru, Ir, Pt, Au. The present invention also relates to a method for the electrolytic deposition of a corresponding layer using a suitable electrolyte. The use of the electrolytically deposited alloy layer is also claimed.

The present invention is directed to the electrolytic deposition of an alloy predominantly containing silver. Further constituents of the deposited alloy layer are palladium, tellurium and one or more of the metals Ce, Dy, Pb, Bi, Al, Ga, Ge, Fe, In, Co, Ni, Cu, Sn, Sb, Rh, Ru, Ir, Pt, Au. The present invention also relates to a method for the electrolytic deposition of a corresponding layer using a suitable electrolyte. The use of the electrolytically deposited alloy layer is also claimed.

Aqueous acid binary silver-bismuth alloy electroplating compositions and methods enable electroplating silver rich binary silver-bismuth deposits. The aqueous acid binary silver-bismuth alloy electroplating compositions include 5-membered heterocyclic nitrogen compounds with a thiol functionality which enable deposition of the silver rich binary silver-bismuth alloys. The silver rich silver-bismuth deposits are matte to semi-bright, uniform and have a low coefficient of friction.

A terminal includes a connection part electrically connectable to a mating terminal, and a crimp part capable of crimping a cable. The connection part includes a first base having electrical conductivity, and a first plating layer that covers the first base, has a Vickers hardness of 250 Hv or more, and contains silver alloy containing silver. The crimp part includes a second base having electrical conductivity, and a second plating layer that covers the second base, has a Vickers hardness of less than 225 Hv, and contains either silver or silver alloy containing silver.

Systems, methods, and devices related to hollow metallic objects are disclosed. A solid sacrificial material is formed in a desired three-dimensional shape, and a precursor is deposited about an exterior surface of the solid sacrificial material. The precursor is used to deposit a first conductor about the exterior surface of the solid sacrificial material, and the solid sacrificial material is then removed. The first conductor assumes the three-dimensional shape, and is substantially hollow after removing the solid sacrificial material. Contemplated hollow metallic objects include waveguides, heat pipes, and vapor chambers.

The surface-treated material (10) according to the present invention is a surface-treated material including an electroconductive substrate (1) and a surface treatment coating film (2) including at least one metal layer formed above the electroconductive substrate (1), wherein a lowermost metal layer (21), as a metal layer included in the at least one metal layer and formed above the electroconductive substrate (1), is made of nickel, nickel alloy, cobalt, cobalt alloy, copper, or copper alloy, the surface-treated material includes an intervening layer (3) between the electroconductive substrate (1) and the surface treatment coating film (2), the intervening layer (3) containing a metal component of the electroconductive substrate (1), a metal component of the surface treatment coating film (2), and an oxygen component, and the mean thickness of the intervening layer (3) is in the range of 1.00 nm or larger and 40 nm or smaller as measured in the vertical cross-section of the surface-treated material.

The present invention relates to an electrolyte and to a method for the electrolytic deposition of silver coatings and silver alloy coatings. The electrolyte according to the invention is cyanide-free, storage-stable and ensures the deposition of high-gloss, brilliant and white silver and silver alloy layers for technical and decorative applications.

The present invention relates to an electrolyte and to a method for the electrolytic deposition of silver coatings and silver alloy coatings. The electrolyte according to the invention is cyanide-free, storage-stable and ensures the deposition of high-gloss, brilliant and white silver and silver alloy layers for technical and decorative applications.

Silver-nickel alloy electroplating compositions and methods enable electroplating silver rich silver-nickel deposits which are bright, uniform and have a relatively low coefficient of friction. The binary silver-nickel alloy is deposited from an aqueous acid silver-nickel alloy electroplating composition. The aqueous acid silver-nickel alloy electroplating composition includes thiol compounds which shift the reduction potential of silver ions toward the reduction potential of nickel ions such that a silver rich binary silver-nickel layer is deposited on a substrate.

Silver-nickel alloy electroplating compositions and methods enable electroplating silver rich silver-nickel deposits which are bright, uniform and have a relatively low coefficient of friction. The binary silver-nickel alloy is deposited from an aqueous acid silver-nickel alloy electroplating composition. The aqueous acid silver-nickel alloy electroplating composition includes thiol compounds which shift the reduction potential of silver ions toward the reduction potential of nickel ions such that a silver rich binary silver-nickel layer is deposited on a substrate.