Patent classifications
C25D5/14
OPTICAL ELEMENT FOR MODIFYING THE DISTRIBUTION OF A LIGHT BEAM, FOR A MOTOR VEHICLE HEADLIGHT
The invention relates to an optical element including a resin body having a functional surface covered with a reflective coating capable of reflecting light beams, the reflective coating including a copper layer covering at least the functional surface, a nickel layer covering the copper layer, and a chromium layer covering the nickel layer.
ELECTRODEPOSITED COPPER FOIL AND ELECTRODE, AND LITHIUM-ION SECONDARY BATTERY COMPRISING THE SAME
Provided are an electrodeposited copper foil, an electrode comprising the same, and a lithium-ion secondary battery comprising the same. The electrodeposited copper foil has a drum side and a deposited side opposing the drum side, wherein at least one of the drum side and the deposited side exhibits a void volume value (Vv) in the range of 0.17 μm.sup.3/μm.sup.2 to 1.17 μm.sup.3/μm.sup.2; and an absolute value of a difference between a maximum height (Sz) of the drum side and a Sz of the deposited side is in the range of less than 0.60 μm.
ELECTRODEPOSITED COPPER FOIL AND ELECTRODE, AND LITHIUM-ION SECONDARY BATTERY COMPRISING THE SAME
Provided are an electrodeposited copper foil, an electrode comprising the same, and a lithium-ion secondary battery comprising the same. The electrodeposited copper foil has a drum side and a deposited side opposing the drum side, wherein at least one of the drum side and the deposited side exhibits a void volume value (Vv) in the range of 0.17 μm.sup.3/μm.sup.2 to 1.17 μm.sup.3/μm.sup.2; and an absolute value of a difference between a maximum height (Sz) of the drum side and a Sz of the deposited side is in the range of less than 0.60 μm.
SPARK PLUG HOUSING INCLUDING AN ELECTROPLATED OR A CHEMICALLY APPLIED NICKEL-CONTAINING PROTECTIVE LAYER AND A SILICON-CONTAINING SEALING LAYER, AND A SPARK PLUG INCLUDING THIS HOUSING, AND METHOD FOR MANUFACTURING THIS HOUSING
A housing for a spark plug. The housing includes a bore along the longitudinal axis X of the housing, as the result of which the housing has an outer side and an inner side, and an electroplated or chemically applied nickel-containing protective layer situated on at least one portion of the outer side of the housing and a sealing layer situated on the nickel-containing protective layer. The sealing layer contains silicon. A first intermediate layer is applied between the housing and the nickel-containing protective layer and/or a second intermediate layer is applied between the nickel-containing protective layer and the sealing layer and/or a cover layer is applied on the sealing layer. The sealing layer may be free of chromium.
Method for treatment of a chromium finish surface
A method for post-treatment of a chromium finish surface to improve corrosion resistance comprising a) providing a substrate having a chromium finish surface, and at least one intermediate layer between the chromium finish surface and the substrate, selected from the group consisting of nickel, nickel alloys, copper and copper alloys, wherein the chromium finish surface is a surface of a trivalent chromium plated layer, obtained by electroplating the substrate, having the at least one intermediate layer, in a plating bath, the plating bath comprising chromium (III) ions; b) contacting the chromium finish surface with an aqueous solution, comprising a permanganate, at least one compound which is selected from a phosphorus-oxygen compound, a hydroxide, a nitrate, a borate, boric acid, a silicate, or a mixture of two or more of these compounds; c) forming a transparent corrosion protection layer onto the chromium finish surface during step b.
Method for treatment of a chromium finish surface
A method for post-treatment of a chromium finish surface to improve corrosion resistance comprising a) providing a substrate having a chromium finish surface, and at least one intermediate layer between the chromium finish surface and the substrate, selected from the group consisting of nickel, nickel alloys, copper and copper alloys, wherein the chromium finish surface is a surface of a trivalent chromium plated layer, obtained by electroplating the substrate, having the at least one intermediate layer, in a plating bath, the plating bath comprising chromium (III) ions; b) contacting the chromium finish surface with an aqueous solution, comprising a permanganate, at least one compound which is selected from a phosphorus-oxygen compound, a hydroxide, a nitrate, a borate, boric acid, a silicate, or a mixture of two or more of these compounds; c) forming a transparent corrosion protection layer onto the chromium finish surface during step b.
Tin-plated copper terminal material, terminal, and wire terminal part structure
On a base member made of copper or a copper alloy, a zinc-nickel alloy layer including zinc and nickel, and a tin layer made of tin alloy are laminated in this order: the zinc-nickel alloy layer has a thickness of 0.1-5 μm inclusive and has a nickel content of 5-50 mass % inclusive, the tin layer has a zinc concentration of 0.6-15 mass % inclusive, and, under an oxide layer which is the outermost layer, a metal zinc layer, having a zinc concentration of 5-40 at % inclusive and a thickness of 1-10 nm inclusive in SiO.sub.2 conversion, is formed on the tin layer.
METHOD FOR CREATING A CHROMIUM-PLATED SURFACE WITH A MATTE FINISH
A method for creating a chrome-plated surface having a matte finish that typically includes: controlling a resistance of a current bridge circuit; depositing a first chromium layer on a substrate positioned in a chromium bath, wherein the first chromium layer is deposited by supplying current from a power source that is electrically connected to the substrate and to anodes positioned in the chromium bath; etching the first chromium layer by engaging a current bridge that closes the current bridge circuit; depositing a first intermediate chromium layer, wherein the first intermediate chromium layer is deposited by supplying current from the power source; etching the first intermediate chromium layer, wherein the first intermediate chromium layer is etched by engaging the current bridge; and depositing a final chromium layer, wherein the final chromium layer is deposited by supplying current from the power source.
METHOD FOR CREATING A CHROMIUM-PLATED SURFACE WITH A MATTE FINISH
A method for creating a chrome-plated surface having a matte finish that typically includes: controlling a resistance of a current bridge circuit; depositing a first chromium layer on a substrate positioned in a chromium bath, wherein the first chromium layer is deposited by supplying current from a power source that is electrically connected to the substrate and to anodes positioned in the chromium bath; etching the first chromium layer by engaging a current bridge that closes the current bridge circuit; depositing a first intermediate chromium layer, wherein the first intermediate chromium layer is deposited by supplying current from the power source; etching the first intermediate chromium layer, wherein the first intermediate chromium layer is etched by engaging the current bridge; and depositing a final chromium layer, wherein the final chromium layer is deposited by supplying current from the power source.
MANUFACTURING METHOD OF CIRCUIT BOARD ASSEMBLY FOR HIGH FREQUENCY SIGNAL TRANSMISSION
A manufacturing method of copper foil and circuit board assembly for high frequency transmission are provided. Firstly, a raw copper foil having a predetermined surface is produced by an electrolyzing process. Subsequently, a roughened layer including a plurality of copper particles is formed on the predetermined surface by an arsenic-free electrolytic roughening treatment and an arsenic-free electrolytic surface protection treatment. Thereafter, a surface treatment layer is formed on the roughened layer, and the roughened layer is made of a material which includes at least one kind of non-copper metal elements and the concentration of the non-copper metal elements is smaller than 400 ppm. By controlling the concentration of the non-copper elements, the resistance of the copper foil can be reduced.