Method and apparatus for reducing metal oxide surfaces to modified metal surfaces are disclosed. By exposing a metal oxide surface to a remote plasma, the metal oxide surface on a substrate can be reduced to pure metal and the metal reflowed. A remote plasma apparatus can treat the metal oxide surface as well as cool, load/unload, and move the substrate within a single standalone apparatus. The remote plasma apparatus includes a processing chamber and a controller configured to provide a substrate having a metal seed layer in a processing chamber, form a remote plasma of a reducing gas species where the remote plasma includes radicals, ions, and/or ultraviolet (UV) radiation from the reducing gas species, and expose a metal seed layer of the substrate to the remote plasma to reduce oxide of the metal seed layer to metal and to reflow the metal.

An nickel plating layer (5a) intended for corrosion current distribution is formed over a body (2), and a 0.05 to 2.5 micrometers thick surface chrome plating layer (6) made of trivalent chromium is formed on the surface thereof using basic chromium sulfate as a source of metal. Further on the same, a not less than 7 nm thick chromium compound film (7) is formed by cathode acidic electrolytic chromatin. The corrosion distribution nickel plating layer (5a) has a function of forming a microporous structure, a microcrack structure, or the both of the same in the surface chrome plating layer (6).

An nickel plating layer (5a) intended for corrosion current distribution is formed over a body (2), and a 0.05 to 2.5 micrometers thick surface chrome plating layer (6) made of trivalent chromium is formed on the surface thereof using basic chromium sulfate as a source of metal. Further on the same, a not less than 7 nm thick chromium compound film (7) is formed by cathode acidic electrolytic chromatin. The corrosion distribution nickel plating layer (5a) has a function of forming a microporous structure, a microcrack structure, or the both of the same in the surface chrome plating layer (6).

The present invention discloses a de-bouncing keypad and a preparation method thereof, wherein the keypad is composed of a rubber substrate and a metal contact having three layers of layered structures. A layer of tin alloy or lead alloy is plated on a surface of the metal contact by electroplating or chemical plating. The metal contact plated with the tin alloy or lead alloy has excellent contact bouncing resistance and arc-ablation resistance, and the metal contact is further composited with the rubber to shape and prepare the rubber de-bouncing keypad.

The present invention relates to a component of a turbomachine with a repair layer and a method for repairing wear-damaged components (1, 10) of a turbomachine, in particular of elements of a flow duct boundary, having the following method steps:

preparing the area to be repaired, in order to provide a smooth and clean surface (4),

applying an Ni-based braze (7) with a proportion of hard material particles (8) to the surface (4) to form a repair layer (15), wherein the hard material particles comprise hard alloys based on cobalt or nickel,

heat treating the component to braze the repair layer onto the component under vacuum conditions.

The present invention relates to a component of a turbomachine with a repair layer and a method for repairing wear-damaged components (1, 10) of a turbomachine, in particular of elements of a flow duct boundary, having the following method steps:

preparing the area to be repaired, in order to provide a smooth and clean surface (4),

applying an Ni-based braze (7) with a proportion of hard material particles (8) to the surface (4) to form a repair layer (15), wherein the hard material particles comprise hard alloys based on cobalt or nickel,

heat treating the component to braze the repair layer onto the component under vacuum conditions.

A self-terminating rapid process for controlled growth of platinum or platinum alloy monolayer films from a K.sub.2PtCl.sub.4NaClNaBr electrolyte. Using the present process, platinum deposition may be quenched at potentials just negative of proton reduction by an alteration of the double layer structure induced by a saturated surface coverage of underpotential deposited hydrogen. The surface may be reactivated for platinum deposition by stepping the potential to more positive values where underpotential deposited hydrogen is oxidized and fresh sites for absorption of platinum chloride become available. Periodic pulsing of the potential enables sequential deposition of two dimensional platinum layers to fabricate films of desired thickness relevant to a range of advanced technologies, from catalysis to magnetics and electronics.

Provided is a three-dimensional composite of nickel cobalt oxide/graphene on nickel foam as high-performance electrode materials for supercapacitors and a method for preparing the same, and the electrode comprising a three-dimensional nickel cobalt oxide/graphene on nickel foam exhibited an ultrahigh specific capacitance of 2,260 F/g at a current density of 1 A/g.

Multi-layer microscale or mesoscale structures are fabricated with adhered layers (e.g. layers that are bonded together upon deposition of successive layers to previous layers) and are then subjected to a heat treatment operation that enhances the interlayer adhesion significantly. The heat treatment operation is believed to result in diffusion of material across the layer boundaries and associated enhancement in adhesion (i.e. diffusion bonding). Interlayer adhesion and maybe intra-layer cohesion may be enhanced by heat treating in the presence of a reducing atmosphere that may help remove weaker oxides from surfaces or even from internal portions of layers.

Multi-layer microscale or mesoscale structures are fabricated with adhered layers (e.g. layers that are bonded together upon deposition of successive layers to previous layers) and are then subjected to a heat treatment operation that enhances the interlayer adhesion significantly. The heat treatment operation is believed to result in diffusion of material across the layer boundaries and associated enhancement in adhesion (i.e. diffusion bonding). Interlayer adhesion and maybe intra-layer cohesion may be enhanced by heat treating in the presence of a reducing atmosphere that may help remove weaker oxides from surfaces or even from internal portions of layers.