The invention relates to traceable metallic products, methods of uses and methods of making same. The metallic products may be made traceable for integrity purposes, identification purposes, counterfeit avoidance and the like. The invention also relates to metallic supports for nanostorage of various compounds and samples.

The invention relates to traceable metallic products, methods of uses and methods of making same. The metallic products may be made traceable for integrity purposes, identification purposes, counterfeit avoidance and the like. The invention also relates to metallic supports for nanostorage of various compounds and samples.

A method is provided for pretreating a thick-film aluminum electrode. The pretreatment is processed before subsequent metal plating. the thick-film aluminum electrode is pretreated with a purely mechanical or chemical treatment or a mixture of mechanical and chemical treatments; the chemical treatment is an alkaline/acid washing or a chemical anodizing; The surface of the thick-film aluminum electrode is made even and alumina, a nonconductive substance, on the surface is removed. The thick-film aluminum electrode has a surface with evenness and low oxygen content. The thick-film aluminum electrode has similar quality as the thick-film electrode of noble metal silver for subsequent metal plating.

A method is provided for pretreating a thick-film aluminum electrode. The pretreatment is processed before subsequent metal plating. the thick-film aluminum electrode is pretreated with a purely mechanical or chemical treatment or a mixture of mechanical and chemical treatments; the chemical treatment is an alkaline/acid washing or a chemical anodizing; The surface of the thick-film aluminum electrode is made even and alumina, a nonconductive substance, on the surface is removed. The thick-film aluminum electrode has a surface with evenness and low oxygen content. The thick-film aluminum electrode has similar quality as the thick-film electrode of noble metal silver for subsequent metal plating.

The described embodiments relate generally to aluminum films and pretreatments for improving the adhesion of aluminum films on substrate surfaces. Methods involve providing three-dimensional adhesion surfaces on the substrate that promote adhesion to a subsequently deposited aluminum film. The methods can avoid the use of strike materials, such as nickel and copper, used in conventional adhesion-promoting treatments. According to some embodiments, methods involve providing an aluminum oxide adhesion layer on the substrate prior to depositing aluminum. According to some embodiments, methods involve providing a zincating layer on the substrate prior to depositing aluminum. According some embodiments, methods involve roughening the surface of the substrate prior to depositing aluminum. Some embodiments involve a combination of two or more substrate pretreatments. Described methods can be used to provide more flexibility in subsequent anodizing processes. In some embodiments, methods involve anodizing the aluminum film and a portion of the substrate.

The described embodiments relate generally to aluminum films and pretreatments for improving the adhesion of aluminum films on substrate surfaces. Methods involve providing three-dimensional adhesion surfaces on the substrate that promote adhesion to a subsequently deposited aluminum film. The methods can avoid the use of strike materials, such as nickel and copper, used in conventional adhesion-promoting treatments. According to some embodiments, methods involve providing an aluminum oxide adhesion layer on the substrate prior to depositing aluminum. According to some embodiments, methods involve providing a zincating layer on the substrate prior to depositing aluminum. According some embodiments, methods involve roughening the surface of the substrate prior to depositing aluminum. Some embodiments involve a combination of two or more substrate pretreatments. Described methods can be used to provide more flexibility in subsequent anodizing processes. In some embodiments, methods involve anodizing the aluminum film and a portion of the substrate.

A surface-treated material of the present disclosure has a conductive substrate, and a surface treatment film which includes at least one layer of metal layers and is formed on the conductive substrate. The surface treatment film is a plating film. The surface treatment film is formed on a whole surface or a part of the conductive substrate through a zinc-containing layer that contains zinc as a main component and has a thickness of 50 nm or less, or is formed on the conductive substrate without through the zinc-containing layer. The surface-treated material has a ratio of a contact area to a test area of 85% or more as measured according to a tape test method defined in JIS H 8504: 1999.

A surface-treated material of the present disclosure has a conductive substrate, and a surface treatment film which includes at least one layer of metal layers and is formed on the conductive substrate. The surface treatment film is a plating film. The surface treatment film is formed on a whole surface or a part of the conductive substrate through a zinc-containing layer that contains zinc as a main component and has a thickness of 50 nm or less, or is formed on the conductive substrate without through the zinc-containing layer. The surface-treated material has a ratio of a contact area to a test area of 85% or more as measured according to a tape test method defined in JIS H 8504: 1999.

In example implementations, a method for coloring an alloy is provided. The method includes anodizing a substrate in an anodizing bath comprising phosphoric acid, at a constant temperature and a constant voltage for a first time period to develop an anodizing layer that includes a barrier layer, reducing the constant voltage applied to the anodizing bath for a second time period to change a thickness of the barrier layer and change a width of pores in the anodizing layer, plating the substrate in a plating bath at a first current that is increased over a third time period in accordance with a current profile of the plating bath, and plating the substrate in the plating bath at a second current for a fourth time period.

In example implementations, a method for coloring an alloy is provided. The method includes anodizing a substrate in an anodizing bath comprising phosphoric acid, at a constant temperature and a constant voltage for a first time period to develop an anodizing layer that includes a barrier layer, reducing the constant voltage applied to the anodizing bath for a second time period to change a thickness of the barrier layer and change a width of pores in the anodizing layer, plating the substrate in a plating bath at a first current that is increased over a third time period in accordance with a current profile of the plating bath, and plating the substrate in the plating bath at a second current for a fourth time period.