A coated component includes a metallic body defining an inner volume configured to retain a fluid therein. The metallic body includes a plurality of segments, at least one weld joint attaching the plurality of segments, an outer surface, and an inner surface facing and defining the inner volume. The component further includes a chrome-free protective coating disposed on each of the outer surface and the inner surface. The coating includes an epoxy layer, and an oxide layer disposed between the epoxy layer and the respective outer surface and inner surface.

A coated component includes a metallic body defining an inner volume configured to retain a fluid therein. The metallic body includes a plurality of segments, at least one weld joint attaching the plurality of segments, an outer surface, and an inner surface facing and defining the inner volume. The component further includes a chrome-free protective coating disposed on each of the outer surface and the inner surface. The coating includes an epoxy layer, and an oxide layer disposed between the epoxy layer and the respective outer surface and inner surface.

A method for producing a corrosion resistant metal substrate and corrosion resistant metal substrate provided thereby. The method involves forming a plated substrate including a metal substrate provided with a nickel layer or with a nickel and cobalt layer followed by electrodepositing a molybdenum oxide layer from an aqueous solution onto the plated substrate, which is subsequently subjected to an annealing step in a reducing atmosphere to reduce the molybdenum oxide in the molybdenum oxide layer to molybdenum metal in a reduction annealing step and to form a diffusion layer which contains nickel and molybdenum, and optionally cobalt.

A method for producing a corrosion resistant metal substrate and corrosion resistant metal substrate provided thereby. The method involves forming a plated substrate including a metal substrate provided with a nickel layer or with a nickel and cobalt layer followed by electrodepositing a molybdenum oxide layer from an aqueous solution onto the plated substrate, which is subsequently subjected to an annealing step in a reducing atmosphere to reduce the molybdenum oxide in the molybdenum oxide layer to molybdenum metal in a reduction annealing step and to form a diffusion layer which contains nickel and molybdenum, and optionally cobalt.

The described embodiments relate generally to aluminum films and methods for forming aluminum films. Methods involve providing aluminum films having increased hardness. Methods involve using higher than conventional current densities during plating of aluminum on substrates. The higher current density plating creates aluminum films with grain structures that are different from conventional plated aluminum films. In some embodiments, the average grain sizes are smaller in the hard aluminum films than conventional plated aluminum films. In some embodiments, the plated aluminum layer is anodized. In some embodiments, a multi-layered aluminum coating is formed using a combination of high current density and low current density plating. In some embodiments, a current filter is used to provide uniform plating across a part.

In one implementation, a method of depositing a material on a substrate is provided. The method comprises positioning an aluminum-containing substrate in an electroplating solution, the electroplating solution comprising a non-aqueous solvent and a deposition precursor. The method further comprises depositing a coating on the aluminum-containing substrate, the coating comprising aluminum or aluminum oxide. Depositing the coating comprises applying a first current for a first time-period to nucleate a surface of the aluminum-containing substrate and applying a second current for a second time-period, wherein the first current is greater than the second current and the first time-period is less than the second time-period to form the coating on the nucleated surface of the aluminum-containing substrate.

In one implementation, a method of depositing a material on a substrate is provided. The method comprises positioning an aluminum-containing substrate in an electroplating solution, the electroplating solution comprising a non-aqueous solvent and a deposition precursor. The method further comprises depositing a coating on the aluminum-containing substrate, the coating comprising aluminum or aluminum oxide. Depositing the coating comprises applying a first current for a first time-period to nucleate a surface of the aluminum-containing substrate and applying a second current for a second time-period, wherein the first current is greater than the second current and the first time-period is less than the second time-period to form the coating on the nucleated surface of the aluminum-containing substrate.

An intermediate rotogravure product has a cylindrical case onto which a circumferential copper layer extends, the circumferential copper layer having a characteristic surface roughness Rz and porosity. A copper engraving layer is on the circumferential copper layer. A method for engraving into adds a copper engraving layer, followed by engraving a predetermined pattern. A rotogravure cylinder product and method add a copper engraving layer on the circumferential copper layer that can be engraved in accordance with a predefined pattern and protected with a protection layer.

An intermediate rotogravure product has a cylindrical case onto which a circumferential copper layer extends, the circumferential copper layer having a characteristic surface roughness Rz and porosity. A copper engraving layer is on the circumferential copper layer. A method for engraving into adds a copper engraving layer, followed by engraving a predetermined pattern. A rotogravure cylinder product and method add a copper engraving layer on the circumferential copper layer that can be engraved in accordance with a predefined pattern and protected with a protection layer.

In certain aspects, electrolytic deposition and electroless displacement deposition methods are provided to form bimetallic structures that may be used as a bipolar current collector in a battery or a substrate for forming graphene sheets. In other aspects, bipolar current collectors for lithium-ion based electrochemical cells are provided. The bimetallic current collector may have an aluminum-containing surface and a continuous copper coating. In other aspects, a flexible substrate may be coated with one or more conductive materials, like nickel, copper, graphene, aluminum, alloys, and combinations thereof. The flexible substrate is folded to form a bipolar current collector. New stack assemblies for lithium-ion based batteries incorporating such bipolar current collectors are also provided that can have cells with a tab-free and/or weld-free design.