C25D5/44

HEAT DISSIPATION COMPONENT FOR SEMICONDUCTOR ELEMENT

A heat dissipation component for a semiconductor element includes: a composite part containing 50-80 vol % diamond powder with the remainder having metal including aluminum, the diamond powder having a particle diameter volume distribution first peak at 5-25 μm and a second peak at 55-195 μm. A ratio between a volume distribution area at particle diameters of 1-35 μm and a volume distribution area at particle diameters of 45-205 μm is 1:9 to 4:6; surface layers on both composite part principal surfaces, each of the surface layers containing 80 vol % or more metal including aluminum and having a film thickness of 0.03-0.2 mm; and a crystalline Ni layer and an Au layer on at least one of the surface layers, the crystalline Ni layer having a film thickness of 0.5-6.5 μm, and the Au layer having a film thickness of 0.05 μm or larger.

COPPER PLATING SOLUTION AND COPPER PLATING METHOD
20170268119 · 2017-09-21 ·

A copper plating solution includes: water-soluble copper salt; ethylenediamine; at least one of EDTA, a substituted derivative of EDTA, an ethylenediamine derivative, or glycine; and at least one of hydantoin or a substituted derivative thereof. The copper plating solution allows an aluminum or aluminum alloy base to be displacement-plated with copper.

COPPER PLATING SOLUTION AND COPPER PLATING METHOD
20170268119 · 2017-09-21 ·

A copper plating solution includes: water-soluble copper salt; ethylenediamine; at least one of EDTA, a substituted derivative of EDTA, an ethylenediamine derivative, or glycine; and at least one of hydantoin or a substituted derivative thereof. The copper plating solution allows an aluminum or aluminum alloy base to be displacement-plated with copper.

Preparation of metal substrate surfaces for electroplating in ionic liquids

Metal surface pretreatments using ionic liquids prior to electroplating are disclosed. The surface treatments include forming an activated metal substrate surface by removing any naturally formed metal oxide layers formed on the surfaces of the metal substrates. According to some embodiments, the surface treatments include exposing the metal substrate to a non-aqueous ionic liquid. In some embodiments, an electrical current is applied to the metal substrate to assist removal of the metal oxide layer. The electrical current can be a pulsed anodic current. After activating the surface, a metal layer can be deposited on the activated surface. In some embodiments, the metal layer is electrodeposited in the same ionic liquid used to form the activated surface. The resultant metal coating is resistant to scratching and peeling.

Preparation of metal substrate surfaces for electroplating in ionic liquids

Metal surface pretreatments using ionic liquids prior to electroplating are disclosed. The surface treatments include forming an activated metal substrate surface by removing any naturally formed metal oxide layers formed on the surfaces of the metal substrates. According to some embodiments, the surface treatments include exposing the metal substrate to a non-aqueous ionic liquid. In some embodiments, an electrical current is applied to the metal substrate to assist removal of the metal oxide layer. The electrical current can be a pulsed anodic current. After activating the surface, a metal layer can be deposited on the activated surface. In some embodiments, the metal layer is electrodeposited in the same ionic liquid used to form the activated surface. The resultant metal coating is resistant to scratching and peeling.

ROUGHENED PLATED SHEET

Provided is a roughened plated sheet comprising a roughened plated layer having a roughened nickel plated layer and a zinc plated layer famed on at least one surface of a metal substrate in this order from the metal substrate side, wherein a ten-point average roughness Rz.sub.jis of a surface of the roughened plated layer, according to laser microscope measurement, is 3 μm or more.

PROCESS FOR LOW-COST TEMPERING OF ALUMINUM CASTING
20220228242 · 2022-07-21 ·

A thermally stable component formed of a tempered aluminum alloy casting which reduced costs is provided. The aluminum alloy typically has an elongation of at least 8% after casting, which is preferred for self-piercing rivet processes. The aluminum alloy leaves a casting facility in the as-cast (F temper) condition. The cast aluminum alloy is then shipped to another entity, such as an OEM, and is subjected to an artificial aging process, such as on the OEM's existing paint line, rather than at the casting facility. The artificial aging process typically includes electrodeposition coating and curing. The components that can be formed by the reduced cost method include lightweight automotive vehicle components, including structural, body-in-white, suspension, or chassis components, such as front shock towers, front body hinge pillars, tunnels, and rear rails.

PROCESS FOR LOW-COST TEMPERING OF ALUMINUM CASTING
20220228242 · 2022-07-21 ·

A thermally stable component formed of a tempered aluminum alloy casting which reduced costs is provided. The aluminum alloy typically has an elongation of at least 8% after casting, which is preferred for self-piercing rivet processes. The aluminum alloy leaves a casting facility in the as-cast (F temper) condition. The cast aluminum alloy is then shipped to another entity, such as an OEM, and is subjected to an artificial aging process, such as on the OEM's existing paint line, rather than at the casting facility. The artificial aging process typically includes electrodeposition coating and curing. The components that can be formed by the reduced cost method include lightweight automotive vehicle components, including structural, body-in-white, suspension, or chassis components, such as front shock towers, front body hinge pillars, tunnels, and rear rails.

Roughened plated sheet

Provided is a roughened plated sheet comprising a roughened plated layer having a roughened nickel plated layer and a zinc plated layer formed on at least one surface of a metal substrate in this order from the metal substrate side, wherein a ten-point average roughness Rz.sub.jis of a surface of the roughened plated layer, according to laser microscope measurement, is 3 μm or more.

HIGH PURITY ALUMINUM COATING WITH ZINC SACRIFICIAL UNDERLAYER FOR ALUMINUM ALLOY FAN BLADE PROTECTION
20220119975 · 2022-04-21 · ·

A coating system for an aluminum component includes a substrate formed from an aluminum material, a zinc or zinc alloy sacrificial layer deposited on the substrate, and an aluminum coating deposited over the zinc or zinc alloy sacrificial layer.