The surface-treated material (10) according to the present invention is a surface-treated material including an electroconductive substrate (1) and a surface treatment coating film (2) including at least one metal layer formed above the electroconductive substrate (1), wherein a lowermost metal layer (21), as a metal layer included in the at least one metal layer and formed above the electroconductive substrate (1), is made of nickel, nickel alloy, cobalt, cobalt alloy, copper, or copper alloy, the surface-treated material includes an intervening layer (3) between the electroconductive substrate (1) and the surface treatment coating film (2), the intervening layer (3) containing a metal component of the electroconductive substrate (1), a metal component of the surface treatment coating film (2), and an oxygen component, and the mean thickness of the intervening layer (3) is in the range of 1.00 nm or larger and 40 nm or smaller as measured in the vertical cross-section of the surface-treated material.

A multi-scale data acquiring and processing device and method for an aluminum oxide production process. The device includes a production index and variable configuring module, a data acquiring module, a data storing module, a main control module, a display module, a data processing module and a data transmitting module. The main control module is used for emitting a command, acquiring production indexes and variables generated in the aluminum oxide production process by different process control devices, and is used for performing unified processing, storage and display on the data, and further the data is transmitted through a transmitting module to systems or devices using the data.

A multi-scale data acquiring and processing device and method for an aluminum oxide production process. The device includes a production index and variable configuring module, a data acquiring module, a data storing module, a main control module, a display module, a data processing module and a data transmitting module. The main control module is used for emitting a command, acquiring production indexes and variables generated in the aluminum oxide production process by different process control devices, and is used for performing unified processing, storage and display on the data, and further the data is transmitted through a transmitting module to systems or devices using the data.

The present invention aims to provide an etchant that can provide good deposition of a metal plating such as a nickel plating, despite its acidity, and a method of surface treatment of aluminum or an aluminum alloy using the etchant. Included is an etchant containing a zinc compound and a fluorine compound and having a pH of 4.5 to 6.5.

A production method of aluminum including: a step of synthesizing an aluminum compound from a mixture including a halogenated aluminum hydrate and a perfluoroalkylsulfonimide-type or perfluoroalkylsulfonamide-type ionic liquid represented by general formula (1); a step of dissolving the aluminum compound in a nitrile-based organic solvent to prepare an aluminum electrolyte; a step of adding at least one ligand selected from a phosphorus compound and an organic compound having an amide group to the aluminum electrolyte and dehydrating water molecules from a hydrate included in the aluminum electrolyte; and a step of electrodepositing aluminum on a cathode by allowing electricity to pass between an anode and the cathode in the aluminum electrolyte after the dehydrating step.

A production method of aluminum including: a step of synthesizing an aluminum compound from a mixture including a halogenated aluminum hydrate and a perfluoroalkylsulfonimide-type or perfluoroalkylsulfonamide-type ionic liquid represented by general formula (1); a step of dissolving the aluminum compound in a nitrile-based organic solvent to prepare an aluminum electrolyte; a step of adding at least one ligand selected from a phosphorus compound and an organic compound having an amide group to the aluminum electrolyte and dehydrating water molecules from a hydrate included in the aluminum electrolyte; and a step of electrodepositing aluminum on a cathode by allowing electricity to pass between an anode and the cathode in the aluminum electrolyte after the dehydrating step.

Methods for electropolishing and coating aluminum on a surface of an air and/or moisture sensitive substrate, including: in a vessel, submerging the substrate in a first molten salt bath and applying an anodizing current to the substrate at a first temperature to electropolish the surface of the substrate; wherein the first molten salt bath includes one of a first organic salt bath and first inorganic salt bath; wherein, when used, the first organic salt bath includes one of (a) aluminum halide and ionic liquid, (b) a combination of an aluminum halide and halogenatedmethylphenylsulfone (C.sub.6(H.sub.5y,X.sub.y)SO.sub.2CX.sub.3, where y is a number from 0-5), (c) a combination of an aluminum halide, an ionic liquid, and halogenatedmethylphenylsulfone (C.sub.6(H.sub.5y,X.sub.y)SO.sub.2CX.sub.3), and (d) AlF.sub.3-organofluoride-hydrofluoric acid adduct; wherein, when used, the first inorganic salt bath includes aluminum halide and alkali metal halide; and wherein the anodizing current is 10-30 mA/cm.sup.2.

A method for producing a hollow structure useful as a base material for a heat sink or the like which increases a heat dissipation property of devices mounted in various kinds of electronic apparatuses, without sacrificing downsizing, thinning, weight reduction, and multifunctionality, and provides a hollow structure. The method including: producing a plated composite by coating a surface of a core made of aluminum to form a copper plating layer; cutting off part of the plated composite to expose cut surfaces of the core; and turning a part corresponding to the core into a hollow part by immersing the plated composite in a sodium solution which dissolves aluminum but does not dissolve copper and selectively dissolving and removing only the aluminum, thereby producing a hollow structure whose skeletal part is composed of all copper plating layers.

A method for producing a hollow structure useful as a base material for a heat sink or the like which increases a heat dissipation property of devices mounted in various kinds of electronic apparatuses, without sacrificing downsizing, thinning, weight reduction, and multifunctionality, and provides a hollow structure. The method including: producing a plated composite by coating a surface of a core made of aluminum to form a copper plating layer; cutting off part of the plated composite to expose cut surfaces of the core; and turning a part corresponding to the core into a hollow part by immersing the plated composite in a sodium solution which dissolves aluminum but does not dissolve copper and selectively dissolving and removing only the aluminum, thereby producing a hollow structure whose skeletal part is composed of all copper plating layers.

A heterostructure comprising at least one first surface containing only copper and at least one second surface, opposite the first surface, containing only aluminium or an aluminium alloy with solid solutions present in the alloy, wherein a. an anchoring layer is arranged between the first and second surfaces, wherein b. each slice plane running perpendicular to the anchoring layer has at least one aluminium or aluminium-alloy island surrounded by copper, and c. at most the aluminium alloy solid solutions which are present in the alloy occur in the anchoring layer. Also, an aluminium-copper connector and a heterostructure production method.