A copper plating solution includes: water-soluble copper salt; ethylenediamine; at least one of EDTA, a substituted derivative of EDTA, an ethylenediamine derivative, or glycine; and at least one of hydantoin or a substituted derivative thereof. The copper plating solution allows an aluminum or aluminum alloy base to be displacement-plated with copper.

A copper plating solution includes: water-soluble copper salt; ethylenediamine; at least one of EDTA, a substituted derivative of EDTA, an ethylenediamine derivative, or glycine; and at least one of hydantoin or a substituted derivative thereof. The copper plating solution allows an aluminum or aluminum alloy base to be displacement-plated with copper.

In example implementations, a method for producing a thin film coating is provided. The method includes pre-treating a substrate, placing the substrate in a bath comprising at least phosphoric acid and sulphuric acid to produce a thin anodized layer, rinsing the thin anodized layer in a solution, plating a surface of the thin anodized layer in an electro deposition bath following a plating current profile for a predetermined period, and increasing the plating current to the recommended bath plating current to produce the thin film coating having a desired initial coating thickness.

In example implementations, a method for producing a thin film coating is provided. The method includes pre-treating a substrate, placing the substrate in a bath comprising at least phosphoric acid and sulphuric acid to produce a thin anodized layer, rinsing the thin anodized layer in a solution, plating a surface of the thin anodized layer in an electro deposition bath following a plating current profile for a predetermined period, and increasing the plating current to the recommended bath plating current to produce the thin film coating having a desired initial coating thickness.

A method of manufacturing a terminal comprising, in the following order, preparing a sheet material comprising 0.005 mass %-3.000 mass % in total of at least one element selected from Mg, Si, Cu, Zn, Mn, Ni, Cr and Zr, the balance being Al and incidental impurities, performing solution heat treatment by heating the sheet material, cold rolling the solution heat treated sheet material, forming a metal coating layer over a part of or an entirety of the cold-rolled sheet material, the metal coating layer being composed primarily of Sn, Cr, Cu, Zn, Au or Ag, or an alloy composed primarily thereof, forming a developed terminal material by punching the sheet material into a developed view geometry of a terminal, forming the developed terminal material into a terminal, and performing an aging treatment on the terminal at 150-190 C. for 60-600 minutes.

A method of manufacturing a terminal comprising, in the following order, preparing a sheet material comprising 0.005 mass %-3.000 mass % in total of at least one element selected from Mg, Si, Cu, Zn, Mn, Ni, Cr and Zr, the balance being Al and incidental impurities, performing solution heat treatment by heating the sheet material, cold rolling the solution heat treated sheet material, forming a metal coating layer over a part of or an entirety of the cold-rolled sheet material, the metal coating layer being composed primarily of Sn, Cr, Cu, Zn, Au or Ag, or an alloy composed primarily thereof, forming a developed terminal material by punching the sheet material into a developed view geometry of a terminal, forming the developed terminal material into a terminal, and performing an aging treatment on the terminal at 150-190 C. for 60-600 minutes.

Electrochemical device or photo-electrochemical device comprising an electrolyte containing a bistriflimide anion, hereafter named as TFSI, at least two electrodes, each of these electrodes being in contact with a current collector comprising a metal support characterized in that at least one electrode has a current collector the metal support of which comprises an electro-active surface which is functionalized with linear or branched fluorinated carbon chains, such as perfluoroalkyl chains, in the form of a molecular layer which improves the corrosion resistance of said functionalized surface compared to a non-functionalized surface, wherein not impairing the passage of electrons between said electrode and its current collector, the functionalized surface being at the interface between said electrode and its current collector.

Electrochemical device or photo-electrochemical device comprising an electrolyte containing a bistriflimide anion, hereafter named as TFSI, at least two electrodes, each of these electrodes being in contact with a current collector comprising a metal support characterized in that at least one electrode has a current collector the metal support of which comprises an electro-active surface which is functionalized with linear or branched fluorinated carbon chains, such as perfluoroalkyl chains, in the form of a molecular layer which improves the corrosion resistance of said functionalized surface compared to a non-functionalized surface, wherein not impairing the passage of electrons between said electrode and its current collector, the functionalized surface being at the interface between said electrode and its current collector.

The present invention provides: a surface-treated material that can simply and in a short time period form a surface treatment film having an adequate adhesiveness particularly on an electroconductive substrate which is mainly formed of a base metal having a large ionization tendency and is considered to resist having a sound plating film formed thereon; and a component produced by using the same.

A surface-treated material (10) of the present invention comprises an electroconductive substrate (1) and a surface treatment film (2) formed of at least one or more layers of metal layers (3 and 4) which are formed on the electroconductive substrate (1), and among the at least one or more layers of metal layers (3 and 4), a lowermost metal layer (3) which is directly formed on the electroconductive substrate (1) comprises a plurality of metal-buried portions (3a) that are scattered in the electroconductive substrate (1) and continuously extend from a surface of the electroconductive substrate (1) toward an inside thereof.

The present invention provides: a surface-treated material that can simply and in a short time period form a surface treatment film having an adequate adhesiveness particularly on an electroconductive substrate which is mainly formed of a base metal having a large ionization tendency and is considered to resist having a sound plating film formed thereon; and a component produced by using the same.

A surface-treated material (10) of the present invention comprises an electroconductive substrate (1) and a surface treatment film (2) formed of at least one or more layers of metal layers (3 and 4) which are formed on the electroconductive substrate (1), and among the at least one or more layers of metal layers (3 and 4), a lowermost metal layer (3) which is directly formed on the electroconductive substrate (1) comprises a plurality of metal-buried portions (3a) that are scattered in the electroconductive substrate (1) and continuously extend from a surface of the electroconductive substrate (1) toward an inside thereof.