To provide a Sn-based plated steel sheet capable of exhibiting superior corrosion resistance, yellowing resistance, coating film adhesiveness, and sulphide stain resistance without using a chromate film. A Sn-based plated steel sheet of the present invention includes: a steel sheet; a Sn-based plating layer located on at least one surface of the steel sheet; and a coating layer located on the Sn-based plating layer, wherein the Sn-based plating layer contains 1.0 g/m.sup.2 to 15.0 g/m.sup.2 of Sn per side in terms of metal Sn, the coating layer contains zirconium oxide, and a content of the zirconium oxide is 1.0 mg/m.sup.2 to 10.0 mg/m.sup.2 per side in terms of metal Zr, the zirconium oxide includes zirconium oxide with an amorphous structure, and a crystalline layer whose main component is zirconium oxide with a crystalline structure is present on an upper layer of the zirconium oxide with the amorphous structure.

The invention relates to sheet metal packaging products, in particular tinplate or electrolytically chrome-plated sheet steel (ECCS), consisting of a sheet steel substrate (S) with a thickness in the region of 0.1 mm to 0.6 mm and a coating (B), in particular made of tin and/or chromium or chromium and chromium oxide, that is electrolytically deposited on at least one side of the sheet metal substrate. In addition, at least one surface of the sheet metal packaging product provided with the coating (B) has a surface profile with periodically repeating structure elements in at least one direction, wherein an autocorrelation function resulting from the surface profile has a plurality of side lobes with a height of at least 20%, preferably at least 30% of the height of the main lobe. These sheet metal packaging products have improved and novel surface properties.

A PCB terminal is provided with a rod-like base material and a plating layer covering a predetermined region of the base material. A constituent material of the base material is a copper alloy containing 20% by mass or more of zinc. The plating layer includes a first coating portion and a second coating portion. The first coating portion includes an entire peripheral layer entirely covering a region on side of a first end part, out of both end parts of the base material, in a circumferential direction of the base material. The second coating portion partially covers a region on side of a second end part, out of the both end parts of the base material, in the circumferential direction of the base material. The entire peripheral layer includes a tin-based layer and a barrier layer.

A Sn-plated steel sheet including a base plated steel sheet having a steel sheet, a Sn-plated layer on at least one surface of the steel sheet, and a film layer containing a zirconium oxide and a tin oxide. An adhesion amount of Sn per surface of the Sn-plated steel sheet is 0.1 g/m.sup.2 or more and 15 g/m.sup.2 or less, an amount of the zirconium oxide in the film layer is in a range of 1 mg/m.sup.2 or more and 30 mg/m.sup.2 or less in terms of an amount of metal Zr, a peak position of a binding energy of Sn3d.sub.5/2 of the tin oxide is 1.4 eV or more and less than 1.6 eV from a peak position of a binding energy of metal Sn, and a quantity of electricity required for reduction of the tin oxide is more than 5.0 mC/cm.sup.2 and 20 mC/cm.sup.2 or less.

Provided is a slide member having an overlay on a bearing alloy. The overlay has a thickness T and has a sliding surface and an interface with respect to the bearing alloy. The overlay includes an intermetallic compound and a matrix of Bi or a Bi alloy. In a thickness domain constituting 70%-75% of the thickness T of the overlay from the sliding surface to the interface, the volume proportion of the intermetallic compound is 10%-70%.

An anti-corrosion terminal material including a base material made of copper or copper alloy and a coating film laminated on the base material: the coating film includes: a first coating film, provided with a zinc layer made of zinc alloy and a tin layer made of tin or tin alloy which are laminated in this order, and formed at a planned core contact part; and a second coating film including the tin layer but not comprising the zinc layer, which is provided at a planned contact part being a contact part when the terminal is formed: and the zinc layer has a thickness not less than 0.1 μm and not more than 5.0 μm and zinc concentration not less than 30% by mass and not more than 95% by mass, and has any one or more of nickel, iron, manganese, molybdenum, cobalt, cadmium, lead and tin as a balance.

A method of manufacturing a bright surface product comprises a step of performing electroless plating to form a first metal film on a base coat layer formed on a substrate, a step of performing electrolytic plating to form a second metal film thereon so that the bonding strength between each film of a multi-layered metal film comprising the first metal film and the second film is higher than the bonding strength between the base coat layer and the first metal layer, a step of integrally and discontinuously segmentalizing the multi-layered metal film with cracks to form an island-like metal film comprising a collection of fine multi-layered metal regions with island-like structures; and a step of forming a translucent top coat layer to cover the fine multi-layered metal regions of the island-like metal film and enter into the cracks to make contact with the base coat layer.

Provided is a metal material including a substrate and an Ag—Sn covering layer that covers a surface of the substrate, in which the Ag—Sn covering layer contains Ag and Sn and has an Ag—Sn alloy exposed on a surface thereof, and an average crystal grain size in a cross section in parallel with a surface of the Ag—Sn covering layer is less than 0.28 μm. Provided is also a metal material, produced by forming a metal layer including Ag and Sn, on a surface of a substrate, and heating the resultant at a temperature equal to or more than the melting point of Sn, and including an Ag—Sn covering layer containing Ag and Sn and having an Ag—Sn alloy exposed on a surface thereof, on the surface of the substrate.

A pin terminal includes a bar-like base material and a plating layer covering a predetermined region of the base material. A constituent material of the base material is pure copper or a copper alloy. The plating layer includes a tin-based layer made of metal containing tin. One end side of the base material includes a tip covering portion covering an entire region in a circumferential direction of the base material. The tin-based layer includes the tip covering portion. The tip covering portion includes a thin film portion and a thick film portion at positions different in the circumferential direction of the base material. The thin film portion includes an outer layer and an inner layer provided in contact with the base material. A constituent material of the outer layer is pure tin, and that of the inner layer is an alloy containing tin and copper.

A structure including an Sn layer or an Sn alloy layer includes a substrate, an Sn layer or Sn alloy layer formed above the substrate, and an under barrier metal formed between the substrate and the Sn layer or Sn alloy layer. The under barrier metal is an Ni alloy layer containing Ni, and at least one selected from W, Ir, Pt, Au, and Bi, and can sufficiently inhibit generation of an intermetallic compound through a reaction, caused due to metal diffusion of a metal contained in the substrate, between the metal and Sn contained in the Sn layer or Sn alloy layer.