The present application provides a method for improving a pit defect formed after a copper electroplating process, comprising: forming a dielectric layer on a wafer; etching the dielectric layer to form a trench; forming a seed barrier layer on the surface of the trench; pre-cleaning the wafer to increase the wetness of the trench on the wafer; filling the trench with copper by means of electroplating; polishing the upper surface of the trench to planarize the upper surface of the trench. The wetness of the wafer surface can be increased by pre-cleaning a via. An excessively dry wafer surface leads to a poor wetness effect when the wafer enters water, a bubble is difficult to be discharged, a void is easy to be generated in electroplating. By the pre-cleaning step, the problem of a poor wetness effect occurring when the wafer enters water can be effectively improved.

A terminal material for a connector provided with a base material in which at least a surface layer is made of copper or copper alloy, a nickel-plating layer made of nickel or nickel alloy and formed on a surface of the base material, a silver-nickel alloy plating layer made of silver-nickel alloy and formed on at least a part of the nickel-plating layer, and a silver-plating layer made of silver and formed on the silver-nickel alloy plating layer; the silver-nickel alloy plating layer has a film thickness 0.05 .Math.m or more and less than 0.50 .Math.m and a nickel content 0.03 at% or more and 1.00 at% or less.

Electroplating methods enable the plating of photoresist defined features which have substantially uniform morphology. The electroplating methods include copper electroplating baths with reaction products of pyrazole compounds and bisepoxides to electroplate the photoresist defined features. Such features include pillars, bond pads and line space features.

A copper foil with a release layer is provided that capable of forming a circuit, of such as an embedded trace substrate, by a subtractive method in a simple process. A copper foil with a release layer, containing, in this order, a release layer; a barrier layer having dissolution resistance to a copper etchant; and a copper foil.

The present invention relates to a very specific electroplating bath for depositing a black chromium layer, a respective method thereof, and a respective substrate with said black chromium layer thereon. The substrate comprising said black chromium layer is excellently suited for decorative purposes.

Embodiments of the present methods deposit smooth, semi-bright nickel coatings from a nickel bath at room temperature, with relatively high concentrations (between about 5 and about 10%) of an organic modifier (such as butanol) under acidic conditions and using a modified pulse potential. The methods for electrodepositing nickel coatings result in nickel coatings that have improved internal structure and corrosion resistance.

A combined oil control ring comprising a pair of annular side rails each having a gap, and an axially corrugated spacer expander arranged between the side rails; the corrugated spacer expander having on the inside seating tabs for pushing inner peripheral surfaces of the side rails; the side-rail-pushing surface of each seating tab being provided with a nitrided layer; an entire surface of each spacer expander except for those provided with the nitrided layer being coated with a plating film; and the plating film having Vickers hardness HV0.01 of 300 or less.

A method and an electrocatalytic electrode for electrochemically reducing carbon dioxide to methanol are provided. An exemplary electrocatalytic electrode includes copper (I) oxide crystals electrodeposited over an atomically smooth copper electrode.

A method for manufacture of a gold-plated slipring contact, comprising steps of galvanic deposition of a copper layer on the electrically-conductive substrate; of a nickel and/or nickel phosphor layer on the copper layer; and of a gold layer on the nickel and/or nickel phosphor layer. While galvanically applying the copper layer on the substrate, the used galvanic bath explicitly does not include at least one of 3-carboxy-1-(phenylmethyl)pyridinium chloride sodium salt, cationic polymers with urea groups, 1-(3-sulfopropyl)pyridinium betaine, 1-(2-hydroxy-3-sulfopropyl)-pyridinium betaine, propargyl(3-sulfopropyl)ether sodium salt, sodium saccharin, sodium allylsulfonate, N,N-dimethyl-N-(3-cocoamidopropyl)-N-(2-hydroxy-3-sulfopropyl)ammonium betaine, polyamines, 1H-imidazole-polymer with (chloromethyl)oxiran, 3-carboxy-1-(phenylmethyl)pyridinium chloride sodium salt, 1-benzyl-3-sodium carboxy-pyridinium chloride, arsenic trioxide, potassium antimony tartrate, potassium tellurate, alkali arsenite, potassium tellerite, potassium seleno cyanate, alkali antimonyl tartrate, sodium selenite, thallium sulfate, and carbon disulfide, to create the outer surface of the contact that is at least an order of magnitude rougher than a surface of a conventionally-fabricated contact.

The present invention relates to a galvanic process additivated with nanotechnology, wherein silver nanoparticles are added to the composition of a galvanic bath (10b), capable of forming a nickel layer (101), onto which a chrome layer (102) is deposited to form a material with antibacterial properties, which may be applied in manufacturing the most varied devices or materials.