A method for manufacturing an electroplated steel sheet by continuously performing electroplating on a steel sheet, the method including disposing a slit gas nozzle having an ejection port having a width wider than a width of the steel sheet in a width direction of the steel sheet on a side of an exit of an electroplating cell for the steel sheet to pass through, and ejecting a gas through the slit gas nozzle toward the steel sheet.

A multi-walled pipe and a method for its manufacture involves a steel sheet forming a steel source layer to which a nickel source layer is applied on at least one or both sides. A solder source layer is applied to the one nickel source layer, or one of the two, or both, nickel source layers. The multi-walled pipe is formed from a strip of the coated metal sheet by rolling. The walls of the pipe are soldered by heating. In one form, the heating takes place by radiation. In another, it takes place by induction.

Methods for producing steel components with well-adhering metallic coatings that provide protection from corrosion offer flexibility in processing qualities. In one example, a flat steel product comprising a steel material that is hardenable by quenching in a hot forming operation and that has a yield point of 150-1100 MPa and a tensile strength of 300-1200 MPa may be coated electrolytically with a thin zinc layer. From the flat steel product, a blank may then be obtained that is heated directly to at least 800 C. and then formed into the steel component. Alternatively, the blank may initially be formed into the steel component and then heated to at least 800 C. Either way, the steel component may then be hardened by sufficiently rapid cooling from a sufficiently high temperature.

A surface-treated steel sheet includes a steel sheet; and a plating layer which is formed on one surface or both surfaces of the steel sheet and which includes zinc and one of the group consisting of vanadium and zirconium, wherein the plating layer includes dendrite-shaped crystals including metallic zinc, and intercrystal filling regions which fill spaces between the dendrite-shaped crystals and show amorphous diffraction patterns when electron beam diffraction is carried out, wherein when the plating layer includes the vanadium, the intercrystal filling regions include a hydrated vanadium oxide or a vanadium hydroxide, and, wherein when the plating layer includes zirconium, the intercrystal filling regions include a hydrated zirconium oxide or a zirconium hydroxide.

Provided is an ultrathin copper foil which has improved thickness accuracy of an ultrathin copper layer on a supporting copper foil. An ultrathin copper foil which is provided with a supporting copper foil, a releasing layer that is laminated on the supporting copper foil, and an ultrathin copper layer that is laminated on the releasing layer. The thickness accuracy of the ultrathin copper layer as determined by a weight thickness method is 3.0% or less.

A copper foil having a matte side with nickel plated thereon in an amount of nickel in the range of 100,000-300,000 s/dm.sup.2. The plated copper foils have particular utility in Positive Temperature Coefficient (PTC) devices. The plated copper foils have a surface hardness of from 50 to 200, a tensile strength greater than 45 kg/mm.sup.2 and a shiny side surface roughness (Rz) not exceeding 2.0 m. The surface roughness of the matte side of the copper foil is in the range of 6 to 10 m. Copper nodules are present on the matte side of the copper foil between the copper foil and the nickel plating. Methods of producing the copper foil and PTC devices incorporating the copper foil are described.

In order to remove treatment liquid (21) from a planar material to be treated (10), which is transported in an assembly for the electrolytic or wet-chemical treatment of the material to be treated (10), or to promote the exchange of material on the surface of the material to be treated (10), a roll with a roll surface (4, 14) is provided. The roll surface (4, 14) is arranged relative to a transport path of the material to be treated (10) so that a gap (8, 18) remains between the roll surface (4, 14) and a useful region of the material to be treated (10) opposing the roll surface (4, 14), which extends over the useful region. The roll is driven rotatably so that at the gap (8, 18) a relative speed is produced between the roll surface (4, 14) and the material to be treated (10).

A copper foil having a matte side with nickel plated thereon in an amount of nickel in the range of 100,000-300,000 s/dm.sup.2. The plated copper foils have particular utility in Positive Temperature Coefficient (PTC) devices. The plated copper foils have a surface hardness of from 50 to 200, a tensile strength greater than 45 kg/mm.sup.2 and a shiny side surface roughness (Rz) not exceeding 2.0 m. The surface roughness of the matte side of the copper foil is in the range of 6 to 10 m. Copper nodules are present on the matte side of the copper foil between the copper foil and the nickel plating. Methods of producing the copper foil and PTC devices incorporating the copper foil are described.

A method for producing a steel substrate coated with a chromium metal-chromium oxide (CrCrOx) coating layer in a continuous high speed plating line, operating at a line speed (v1) of at least 100 m.Math.min.sup.1, wherein one or both sides of the electrically conductive substrate in the form of a strip, moving through the line, is coated with a chromium metal-chromium oxide (CrCrOx) coating layer from a single electrolyte by using a plating process. A coated steel substrate and a packaging made thereof.

Provided are a manufacturing method and a manufacturing apparatus for an aluminum film in which moisture and oxygen do not intrude into a plating chamber. A manufacturing method for an aluminum film, in which aluminum is electrodeposited on a surface of a long, porous resin substrate imparted with electrical conductivity in a molten salt electrolytic solution, includes a step of transferring the substrate W into a plating chamber 1 through a sealing chamber 4 disposed on the entrance side of the plating chamber; a step of electrodepositing an aluminum film on the surface of the substrate W in the plating chamber 1; and a step of transferring the substrate having the aluminum film electrodeposited thereon from the plating chamber 1 through a sealing chamber 5 disposed on the exit side of the plating chamber 1, in which an inert gas is supplied into the plating chamber such that the plating chamber has a positive pressure relative to outside air, and the inert gas is forcibly discharged from an inert gas exhaust pipe 7 provided on each of the two sealing chambers.