C25D7/0642

Electrolytic process for deposition of chemical conversion coatings

This invention is directed to a process of coating metal in a trivalent chromium conversion-electrolyte coating wherein the metal anode or cathode is subjected to a current density ranging up to about 3.0 amperes per square foot for a period ranging up to 60 minutes.

ELECTROLYTIC PROCESS FOR DEPOSITION OF CHEMICAL CONVERSION COATINGS

This invention is directed to a process of coating metal in a trivalent chromium conversion-electrolyte coating wherein the metal anode or cathode is subjected to a current density ranging up to about 3.0 amperes per square foot for a period ranging up to 60 minutes.

Methods for alkaliating roll anodes

The present invention relates to processes that may be used singly or in combination to prevent lithium (or alkali metal) plating or dendrite buildup on bare substrate areas or edges of electrode rolls during alkaliation of a battery or electrochemical cell anode composed of a conductive substrate and coatings, in which the electrode rolls may be coated on one or both sides and may have exposed substrate on edges, or on continuous or discontinuous portions of either or both substrate surfaces.

PLATING PROCESSING APPARATUS

A plating processing apparatus in which a plating object is immersed in a plating solution to form a plating layer on a surface of the plating object, the plating processing apparatus including a plating tank containing the plating solution, a power supply roller rotated while supplying electric power to the plating object, and conveying the plating object to be immersed into the plating solution contained in the plating tank and then moved to the outside of the plating solution, an anode case disposed inside the plating tank and held in electrical contact with the plating solution contained in the plating tank, a control panel controlling electric power supplied to the power supply roller and the anode case, a first busbar electrically connecting the power supply roller and the control panel, and a second busbar electrically connecting the anode case and the control panel, wherein the first busbar and the second busbar are each constituted by a plurality of busbar members each of which includes a copper-made base member and a titanium-made coating layer covering a surface of the base member, the first busbar and the second busbar include a first connection portion in which the busbar members are connected to each other and a second connection portion in which the busbar member is connected to the power supply roller, the anode case, or the control panel, and a portion of the busbar member other than the first connection portion and the second connection portion includes a gap between the base member and the coating layer.

Apparatus for fabricating electrode structure

An apparatus for fabricating an electrode structure includes a high voltage unit, a plating material part facing the high voltage unit, and a transfer roll to which a negative voltage is applied. The high voltage unit includes a high voltage roll, and an insulating sheath configured to cover a surface of the high voltage roll. The high voltage roll is applied with a voltage of about 1 kV to about 100 kV, the plating material part is applied with a positive voltage, and the high voltage unit and the transfer roll rotate.

METHOD FOR PASSIVATION OF THE SURFACE OF BLACKPLATE OR TINPLATE AND ELECTROLYSIS SYSTEM FOR PERFORMANCE OF THE METHOD

A method for passivation of the surface of blackplate or tinplate by electrolytic deposition of a chromium oxide-containing passivation layer on the surface. The electrolytic deposition of the chromium-containing passivation layer occurs from an electrolyte solution that contains a trivalent chromium compound as well as at least one salt to increase the conductivity and at least one acid or a base to adjust a desired pH value. The electrolyte solution contains no additional components apart from the trivalent chromium compound as well as the at least one salt and the at least one acid or base and is especially free of organic complexing agents and free of buffering agents.

FILM FORMING APPARATUS FOR FORMING METAL FILM
20200299855 · 2020-09-24 · ·

Provided is a film forming apparatus for forming a metal film, capable of uniformly pressurizing a substrate surface with an electrolyte membrane subjected to the fluid pressure of an electrolytic solution containing metal ions during film formation even when an insoluble anode is used. A housing of the apparatus includes a partition member between the anode and the electrolyte membrane, for partitioning a housing chamber into first and second housing chambers. The partition member includes a porous body impregnated with cation exchange resin. The first housing chamber houses the anode insoluble in a first electrolytic solution. The second housing chamber has formed therein a hermetically sealed space in which a second electrolytic solution containing metal ions is enclosed within the housing, by the electrolyte membrane and the partition member. The apparatus is also provided with a pump (pressure unit) that pressurizes the second electrolytic solution in the second housing chamber.

Copper foil having improved adhesive force, electrode including the same, secondary battery including the same, and method of manufacturing the same
10741848 · 2020-08-11 · ·

Provided is a copper foil. The copper foil includes a copper layer and a protective layer disposed on the copper layer, wherein a surface of the protective layer has a maximum height roughness (R.sub.max) of 0.6 m to 3.5 m, a peak density (PD) of 5 to 110, and an oxygen atomic amount of 22 at % (atomic %) to 67 at %.

ELECTRONIC COMPONENT AND METHOD THEREOF
20200203720 · 2020-06-25 · ·

An electronic component includes an element main body and at least a pair of outer electrodes on the element main body. The outer electrodes each include an underlying electrode layer positioned so as to be in contact with the element main body and a plating layer positioned so as to be in contact with the underlying electrode layer. The plating layer includes a NiSn alloy plating layer positioned so as to be in contact with the underlying electrode layer.

Methods for alkaliating roll anodes

The present invention relates to processes that may be used singly or in combination to prevent lithium (or alkali metal) plating or dendrite buildup on bare substrate areas or edges of electrode rolls during alkaliation of a battery or electrochemical cell anode composed of a conductive substrate and coatings, in which the electrode rolls may be coated on one or both sides and may have exposed substrate on edges, or on continuous or discontinuous portions of either or both substrate surfaces.