A two-step process, consisting of a photoelectrosynthetic process combined with a thermochemical process, is configured to produce a reduction product (e.g., methane gas, methanol, or carbon monoxide) from carbon dioxide and liquid waste streams. In a first step, photoelectrosynthetically active heterostructures (PAHs) and sunlight are used to drive oxidation/reduction reactions in which one primary product is hydrogen gas. In the second step, hydrogen generated in the first step is thermally catalytically reacted with carbon dioxide to form a reduction product from carbon dioxide (e.g., CO, formaldehyde, methane, or methanol). Synthesis gas (CO and H.sub.2) can be further reacted to form alkanes. The methods and systems may employ PAHs known in the art or improved PAHs having lower costs, improved stability, solar energy conversion efficiency, and/or other desired attributes as disclosed herein.

Methods described herein manage wafer entry into an electrolyte so that air entrapment due to initial impact of the wafer and/or wafer holder with the electrolyte is reduced and the wafer is moved in such a way that an electrolyte wetting wave front is maintained throughout immersion of the wafer also minimizing air entrapment.

The disclosure discloses a method for manufacturing a solar cell, a solar module, and a power generation system. The manufacturing method includes the following steps: S1: perforating film layer in a first region and/or a second region of a solar cell where an electrode is to be disposed, thus forming a plurality holes; S2: growing a plurality seed layers on the solar cell, contacting with the first region and/or the second region through the plurality of holes or grooves in S1; and S3: horizontally transporting a to-be-electroplated solar cell on a horizontal electroplating device, to form a cathode on the seed layer, where an anode terminal is disposed in an electroplating liquid in an electroplating bath, and a moving mechanism disposed in the electroplating bath drives the solar cell to move from inlet to outlet, thus achieving electroplating.

Disclosed are a method and apparatus for electroplating a solar cell precursor. The method includes providing a mask opening on a surface of a cell precursor to be electroplated, such that a conductive material layer of the cell precursor is exposed at a bottom of the mask opening. The method further includes directly or indirectly connecting a first end portion of a conductive piece to the conductive material layer of the cell precursor, such that an electrical connection is formed between the conductive piece and the cell precursor. The conductive piece is a flexible structure capable of being bent.

The disclosure discloses a manufacturing method and apparatus for an electronic component, and belongs to the technical field of manufacture of photovoltaic devices. The manufacturing method includes: putting a semiconductor device into a cathode region, and driving the semiconductor device to move in the cathode region, at the same time, connecting line plating rollers to a power source, and driving the line plating rollers to rotate, so that a surface of the semiconductor device is plated with metal lines in a movement direction thereof by conductive parts located in a circumferential direction of an outer side of each of the line plating rollers; the conductive parts include line plating regions and deplating regions; an anode is disposed on outer sides of the deplating regions and is electrically connected to a positive electrode of the power source by the conductive parts in the deplating regions.

A method for depositing a metallic material on a surface of a substrate comprising the steps of: providing the substrate having opposite first and second major surfaces; providing an arrangement for depositing a metallic material on a surface of the substrate, the arrangement comprising: a support structure having an electrode, a counter electrode, and an electrolyte for depositing metal ions onto one or more portions of the first major surface of the at least one substrate; attaching the substrate to the support structure wherein the electrode is in electrical contact with the substrate; contacting the substrate and the counter electrode with the electrolyte; and thereafter passing an electrical current through the electrolyte between the first major surface of the at least one substrate and the counter electrode such that the metallic material is deposited at at least some areas of the first major surface of the at least one substrate.

Electroplating of aluminum may be utilized to form electrodes for solar cells. In contrast to expensive silver electrodes, aluminum allows for reduced cell cost and addresses the problem of material scarcity. In contrast to copper electrodes which typically require barrier layers, aluminum allows for simplified cell structures and fabrication steps. In the solar cells, point contacts may be utilized in the backside electrodes for increased efficiency. Solar cells formed in accordance with the present disclosure enable large-scale and cost-effective deployment of solar photovoltaic systems.

Electroplating of aluminum may be utilized to form electrodes for solar cells. In contrast to expensive silver electrodes, aluminum allows for reduced cell cost and addresses the problem of material scarcity. In contrast to copper electrodes which typically require barrier layers, aluminum allows for simplified cell structures and fabrication steps. In the solar cells, point contacts may be utilized in the backside electrodes for increased efficiency. Solar cells formed in accordance with the present disclosure enable large-scale and cost-effective deployment of solar photovoltaic systems.