A method of adhering a cover layer to a substrate includes forming an array of nano-structures on a substrate. A flowable material is applied to the substrate, the flowable material substantially enveloping the nano-structures on the substrate. The flowable material is solidified to form a cover layer on the substrate, the cover layer being anchored to the substrate via the nano-structures.

A method of adhering a cover layer to a substrate includes forming an array of nano-structures on a substrate. A flowable material is applied to the substrate, the flowable material substantially enveloping the nano-structures on the substrate. The flowable material is solidified to form a cover layer on the substrate, the cover layer being anchored to the substrate via the nano-structures.

A method and apparatus for processing an object (4), for example an aluminium aircraft part, the method comprising: performing a first conversion coating process to dispose a first conversion coating (10) onto at least part of a surface of the object (4); partially masking the first conversion coating (10) disposed on the object (4); performing an etching process to remove, from the object (4), an unmasked portion of the first conversion coating (10) while retaining the masked portion of the first conversion coating (10) on the object (4); and performing a second conversion coating process to dispose a second conversion coating (12) onto a region of the surface of the object (4) from which the unmasked portion of the first conversion coating (10) was removed. A paint layer (14) may then be applied to, e.g., the second conversion coating (12).

A housing of an electronic device is provided. The housing includes a first surface, a second surface, a side surface surrounding at least a portion of a space formed between the first surface and the second surface, a first surface layer formed by applying a first texture and a first color to a first area of at least one of the first surface, the second surface, and the side surface of the housing, and a second surface layer formed by applying a second texture and a second color to a second area within the first area, wherein at least one of the first surface layer and the second surface layer includes an oxide film layer.

A method for creating oil-filled porous anodic oxide coatings for metallic surfaces is disclosed. The coating has anti-corrosion and omniphobic properties to resist both underwater and atmospheric conditions. To realize oil-impregnated three-dimensional bottle-shaped pores in the oxide layer in anodizing aluminum, the following steps may be taken. First, the target surface may be cleaned and electropolished. Then, a first anodizing step at a lower voltage is applied to create relatively small-diameter pores in the entrance (i.e., top) region of the oxide layer, followed by a second anodizing step at a higher voltage to subsequently create larger-diameter pores in the base (i.e., bottom) region of the oxide layer. Pore widening follows to enlarge the overall pore diameters. To fill the porous coating with an oil, a solvent exchange method may be utilized.

A method for manufacturing a mold includes (a) anodizing an aluminum substrate at a voltage of 60 V to 120 V in an electrolytic solution in which two or more species of acid are mixed, and forming an oxide film having a plurality of minute holes on a surface of the aluminum substrate; and (b) removing at least a portion of the oxide film. The electrolytic solution used in (a) satisfies the relation (D1)/2<D2, where D1 is the current density when the aluminum substrate is anodized under the same conditions as in (a) in an electrolytic solution of only the acid (A) having the highest acid dissociation constant (Ka) of the two or more species of acid, and D2 is the current density when the aluminum substrate is anodized under the same conditions (a) in the same electrolytic solution as that of (a).

A method for manufacturing a mold includes (a) anodizing an aluminum substrate at a voltage of 60 V to 120 V in an electrolytic solution in which two or more species of acid are mixed, and forming an oxide film having a plurality of minute holes on a surface of the aluminum substrate; and (b) removing at least a portion of the oxide film. The electrolytic solution used in (a) satisfies the relation (D1)/2<D2, where D1 is the current density when the aluminum substrate is anodized under the same conditions as in (a) in an electrolytic solution of only the acid (A) having the highest acid dissociation constant (Ka) of the two or more species of acid, and D2 is the current density when the aluminum substrate is anodized under the same conditions (a) in the same electrolytic solution as that of (a).

The present invention is to provide a microstructure capable of improving the withstand voltage of an insulating substrate while securing fine conductive paths, a multilayer wiring board, a semiconductor package, and a microstructure manufacturing method. The microstructure of the present invention has an insulating substrate having a plurality of through holes, and conductive paths consisting of a conductive material containing metal filling the plurality of through holes, in which an average opening diameter of the plurality of through holes is 5 nm to 500 nm, an average value of the shortest distances connecting the through holes adjacent to each other is 10 nm to 300 nm, and a moisture content is 0.005% or less with respect to the total mass of the microstructure.

Processes for enhancing the corrosion resistance of anodized substrates are disclosed. In some embodiments, the process involves a second anodizing operation that targets an area of the substrate that is left inadequately protected by a first anodizing operation, and also targets defects that may have been arisen from intermediate processing operations such as laser-marking operations. The second anodizing operation can be conducted in a non-pore-forming electrolyte, and grows a thick protective barrier film over inadequately protected areas of the substrate, such as laser-marking treated areas.

Processes for enhancing the corrosion resistance of anodized substrates are disclosed. In some embodiments, the process involves a second anodizing operation that targets an area of the substrate that is left inadequately protected by a first anodizing operation, and also targets defects that may have been arisen from intermediate processing operations such as laser-marking operations. The second anodizing operation can be conducted in a non-pore-forming electrolyte, and grows a thick protective barrier film over inadequately protected areas of the substrate, such as laser-marking treated areas.