This application relates to a method for forming an enclosure for a portable electronic device, the enclosure including a metal substrate that is overlaid by an anodized layer. The method includes dyeing the anodized layer by exposing pores of the anodized layer to a dye. The method further includes sealing the dye within the pores by exposing the anodized layer to a zinc-based sealing solution, where an external surface of the anodized layer having the pores that are sealed includes an amount of zinc between about 3 wt % to about 6 wt %.

Disclosed are methods of anodizing a metal component. In the methods an anodization bath includes an organic acid.

To provide an aluminum surface treatment method for manufacturing a polymer-aluminum joint structure having excellent bond strength. An aluminum surface treatment method for bonding with a polymer composite which is characterized in that it includes (a) a primary anodizing treatment step wherein the aluminum surface is treated by anodic oxidation; (b) a step wherein the aluminum oxide film is removed from the aluminum that has undergone the primary anodizing treatment; and (c) a secondary anodizing treatment step wherein the aluminum from which the aluminum oxide film is removed following the primary anodizing treatment is treated by anodic oxidation again.

To provide an aluminum surface treatment method for manufacturing a polymer-aluminum joint structure having excellent bond strength. An aluminum surface treatment method for bonding with a polymer composite which is characterized in that it includes (a) a primary anodizing treatment step wherein the aluminum surface is treated by anodic oxidation; (b) a step wherein the aluminum oxide film is removed from the aluminum that has undergone the primary anodizing treatment; and (c) a secondary anodizing treatment step wherein the aluminum from which the aluminum oxide film is removed following the primary anodizing treatment is treated by anodic oxidation again.

The present invention is related to the field of metal surface preparation by anodizing processes and refers to a method for producing a corrosion-resistant aluminum-silicon alloy casting and more particularly to the optimization of the anodizing cast aluminum parts with high silicon content, by using a multiple step anodizing cycle. Moreover, the present invention refers to a corrosion-resistant aluminum-silicon alloy casting and its use.

The present invention is related to the field of metal surface preparation by anodizing processes and refers to a method for producing a corrosion-resistant aluminum-silicon alloy casting and more particularly to the optimization of the anodizing cast aluminum parts with high silicon content, by using a multiple step anodizing cycle. Moreover, the present invention refers to a corrosion-resistant aluminum-silicon alloy casting and its use.

Subjecting an aluminum or aluminum alloy substrate to anti-corrosion and anti-wear treatment that is applicable in particular in the field of aviation for protecting certain mechanical parts of airplanes or helicopters that are subjected simultaneously to corrosion and to wear, including applying to the substrate, a sol-gel treatment step forming a sol-gel layer; and after the sol-gel treatment step, a hard oxidation step forming a hard oxide layer.

Subjecting an aluminum or aluminum alloy substrate to anti-corrosion and anti-wear treatment that is applicable in particular in the field of aviation for protecting certain mechanical parts of airplanes or helicopters that are subjected simultaneously to corrosion and to wear, including applying to the substrate, a sol-gel treatment step forming a sol-gel layer; and after the sol-gel treatment step, a hard oxidation step forming a hard oxide layer.

Lithographic printing plate precursors are prepared with a unique aluminum-containing substrate prepared using two separate anodizing processes to provide an inner aluminum oxide layer of average dry thickness (T.sub.i) of 300-3,000 nm and a multiplicity of inner micropores of average inner micropore diameter (D.sub.i) of ≤100 nm. An outer aluminum oxide layer is also provided to have a multiplicity of outer micropores of average outer micropore diameter (D.sub.o) of 15-30 nm and a dry thickness (T.sub.o) of 30-650 nm. A hydrophilic layer disposed on the outer aluminum oxide layer at 0.0002-0.1 g/m.sup.2 has at least a hydrophilic copolymer composed of (a) recurring units having an amide group and (b) recurring units comprising an —OM group directly connected to a phosphorus atom, wherein M represents a hydrogen, sodium, potassium, or aluminum atom.

Various embodiments of the disclosure relate to an electronic device and relate to an electronic device including a housing formed through anodizing and a method for manufacturing the housing of the electronic device. According to an embodiment of the disclosure, there may be provided an electronic device including a housing at least partially including an electrically conductive material, where a surface of the electrically conductive material is formed of an oxide film layer having a plurality of cavities, where the plurality of cavities are colored in a first color and a second color, and where the first color and the second color are mixed when the second color is deposited on the first color.