Patent classifications
C25D11/16
Aluminum alloy resin composite and method of preparing the same
A method of preparing an aluminum alloy resin composite comprises: providing an aluminum alloy substrate having an oxide layer on a surface thereof, wherein the oxide layer has one or more nanopores; forming one or more corrosion pores on an outer surface of the oxide layer by using a corrosion agent, wherein the corrosion agent is at least one selected from a group of ammonia, ammonium salt, hydrazine, hydrazine derivative, and water-soluble amine compound; and injection molding a resin composition to the surface of the aluminum alloy substrate.
Aluminum alloy resin composite and method of preparing the same
A method of preparing an aluminum alloy resin composite comprises: providing an aluminum alloy substrate having an oxide layer on a surface thereof, wherein the oxide layer has one or more nanopores; forming one or more corrosion pores on an outer surface of the oxide layer by using a corrosion agent, wherein the corrosion agent is at least one selected from a group of ammonia, ammonium salt, hydrazine, hydrazine derivative, and water-soluble amine compound; and injection molding a resin composition to the surface of the aluminum alloy substrate.
Microstructure, multilayer wiring board, semiconductor package and microstructure manufacturing method
The present invention is to provide a microstructure capable of improving the withstand voltage of an insulating substrate while securing fine conductive paths, a multilayer wiring board, a semiconductor package, and a microstructure manufacturing method. The microstructure of the present invention has an insulating substrate having a plurality of through holes, and conductive paths consisting of a conductive material containing metal filling the plurality of through holes, in which an average opening diameter of the plurality of through holes is 5 nm to 500 nm, an average value of the shortest distances connecting the through holes adjacent to each other is 10 nm to 300 nm, and a moisture content is 0.005% or less with respect to the total mass of the microstructure.
Aluminum alloy anodization
The present disclosure describes methods for anodizing aluminum alloys, including 7000 series aluminum alloys, and creating metal components, including aircraft landing gear components, from the aluminum alloys.
Aluminum alloy anodization
The present disclosure describes methods for anodizing aluminum alloys, including 7000 series aluminum alloys, and creating metal components, including aircraft landing gear components, from the aluminum alloys.
Metal composite and method of preparing the same, metal-resin composite and method of preparing the same
A metal composite, a method of preparing the metal composite, a metal-resin composite, and a method of preparing the metal-resin composite are provided. The metal composite comprises: a metal substrate comprising a first layer formed on a surface of the metal substrate and an anodic oxidation layer formed on the first layer. The first layer comprises a first pore having an average diameter of about 10 nanometers to about 1 millimeter, and the metal composite comprises aluminum alloy or aluminum. The anodic oxidation layer comprises a second layer contacted with the first layer of the metal substrate and a third layer formed on an outer surface of the second layer, and the second layer comprises a second pore having an average diameter of about 10 nanometers to about 800 microns, and the third layer comprises a third pore having an average diameter of about 10 nanometers to about 800 microns.
Metal composite and method of preparing the same, metal-resin composite and method of preparing the same
A metal composite, a method of preparing the metal composite, a metal-resin composite, and a method of preparing the metal-resin composite are provided. The metal composite comprises: a metal substrate comprising a first layer formed on a surface of the metal substrate and an anodic oxidation layer formed on the first layer. The first layer comprises a first pore having an average diameter of about 10 nanometers to about 1 millimeter, and the metal composite comprises aluminum alloy or aluminum. The anodic oxidation layer comprises a second layer contacted with the first layer of the metal substrate and a third layer formed on an outer surface of the second layer, and the second layer comprises a second pore having an average diameter of about 10 nanometers to about 800 microns, and the third layer comprises a third pore having an average diameter of about 10 nanometers to about 800 microns.
Method for manufacturing aluminum alloy anodized film having superhydrophobic surface
The present invention relates to a method for manufacturing an aluminum alloy anodized film having a superhydrophobic surface and an aluminum alloy having an anodized film with a superhydrophobic surface manufactured by the method. The present invention has an economical effect that an aluminum alloy, in which a three-dimensional shaped anodized film structure formed on the surface thereof is controlled in various forms, such as a pillar-on-pore structure, may be manufactured at low costs within a short time. The aluminum alloy with the controlled anodized film structure has excellent superhydrophobicity, corrosion resistance, and thermal conductivity, and thus may be used in various industrial fields, such as electronic device housings, LED lighting covers, heat exchangers, pipes, road structures, automobiles, aircrafts, ships, and generators.
Method for manufacturing aluminum alloy anodized film having superhydrophobic surface
The present invention relates to a method for manufacturing an aluminum alloy anodized film having a superhydrophobic surface and an aluminum alloy having an anodized film with a superhydrophobic surface manufactured by the method. The present invention has an economical effect that an aluminum alloy, in which a three-dimensional shaped anodized film structure formed on the surface thereof is controlled in various forms, such as a pillar-on-pore structure, may be manufactured at low costs within a short time. The aluminum alloy with the controlled anodized film structure has excellent superhydrophobicity, corrosion resistance, and thermal conductivity, and thus may be used in various industrial fields, such as electronic device housings, LED lighting covers, heat exchangers, pipes, road structures, automobiles, aircrafts, ships, and generators.
ALUMINUM ALLOY AND METHOD OF ANODIZING SAME
An aluminum alloy is described and has compositions with mass percentage content consisting of: 5.0%-5.4% Zn; 0.9%-1.2% Mg; Cu<0.05%; Si<0.05%; Fe<0.1%; Mn<0.05%; Zr<0.1%; Ti<0.05%; other impurities <0.15%; and the remaining composition being Al. An anodizing method of the aluminum alloy described above is described and has: a degreasing treatment, a first black-film stripping treatment, a chemical polishing treatment, a second black-film stripping treatment, an anodizing treatment, a hole filling treatment and a drying treatment which are performed in turn. The aluminum alloy has a higher strength while eliminating an influence of a formed compound phase on a material texture.