A component for an electronic device can include a part including a first metal and a second metal diffusion bonded to the first metal. The first metal can be aluminum and the second metal can be different from the first metal. A porous aluminum oxide layer can overlie a portion of the first metal and can be disposed adjacent to an interface between the first metal and the second metal. The component can further include a non-metallic material bonded to the part and extending into pores defined by the porous aluminum oxide layer.

Proposed are a manufacturing method of an anodic oxide film structure, and an anodic oxide film structure. More particularly, proposed are a manufacturing method of an anodic oxide film structure, and an anodic oxide film structure, wherein production yield of the entire product can be improved by repairing a defective region to be made normal.

Exemplary methods of coating a semiconductor component substrate may include submerging the semiconductor component substrate in an alkaline electrolyte. The alkaline electrolyte may include yttrium. The methods may include igniting a plasma at a surface of the semiconductor component substrate for a period of time less than or about 12 hours. The methods may include forming a yttrium-containing oxide on the semiconductor component substrate. A surface of the yttrium-containing oxide may be characterized by a yttrium incorporation of greater than or about 10 at. %.

A process for making a card includes the steps of forming a core layer having a first surface and a second surface, disposing an uncured decorative ceramic layer of ceramic particles disposed in a resin binder over the first surface of the core layer, such as by spray coating, and curing the uncured decorative ceramic layer to form a cured decorative ceramic layer. Card products of the process may have a core layer of metal, ceramic, or a combination thereof that form a bulk of the card.

A process for making a card includes the steps of forming a core layer having a first surface and a second surface, disposing an uncured decorative ceramic layer of ceramic particles disposed in a resin binder over the first surface of the core layer, such as by spray coating, and curing the uncured decorative ceramic layer to form a cured decorative ceramic layer. Card products of the process may have a core layer of metal, ceramic, or a combination thereof that form a bulk of the card.

Method for manufacturing a fire-resistant part of an air conditioning system for an air or rail transport vehicle, characterized in that it includes at least the following steps: a step of obtaining a part including at least one aluminum alloy surface portion, and a step of treating the aluminum alloy surface portion by use of micro-arc oxidation in order to produce a ceramic coating on the surface portion.

A method of providing a workpiece with an anodised aluminium surface with varying colour. The anodised surface is added colour, such as evenly, so that a colour concentration profile exists through the depth, where after a portion of the outer layer is removed to arrive at colour corresponding to a particular depth.

Provided herein are methods and systems for electrolytic processing of metallic substrates, such as aluminum alloys. The disclosure provides methods of making an anodized substrate by anodizing a metallic substrate in an electrolyte solution comprising phosphoric acid. In particular, the disclosure describes various conditions for anodizing the metallic substrate, including temperature, acid concentration, and voltage. The disclosure also provides systems for carrying out described methods.

Provided herein are methods and systems for electrolytic processing of metallic substrates, such as aluminum alloys. The disclosure provides methods of making an anodized substrate by anodizing a metallic substrate in an electrolyte solution comprising phosphoric acid. In particular, the disclosure describes various conditions for anodizing the metallic substrate, including temperature, acid concentration, and voltage. The disclosure also provides systems for carrying out described methods.

Proposed are a manufacturing method of an anodic oxide film structure, and an anodic oxide film structure. More particularly, proposed are a manufacturing method of an anodic oxide film structure, and an anodic oxide film structure, wherein production yield of the entire product can be improved by repairing a defective region to be made normal.