A decoration panel for home appliances having excellent reflectivity and durability, the decoration panel being applicable to outer sides of various home appliances, a home appliance including the decoration panel, and a method for manufacturing the decoration panel. More specifically, the decoration panel for home appliances includes: an aluminum substrate with one surface in which an engraved pattern having a preset width and a preset depth is formed, the engraved pattern having micro unevenness formed in a surface of the engraved pattern; a porous aluminum oxide layer formed on the engraved pattern; and a sealing layer formed to close a plurality of pores of the porous aluminum oxide layer, wherein an edge of the aluminum substrate is in a Chamfering (C) shape or a Rounding (R) shape.

A decoration panel for home appliances having excellent reflectivity and durability, the decoration panel being applicable to outer sides of various home appliances, a home appliance including the decoration panel, and a method for manufacturing the decoration panel. More specifically, the decoration panel for home appliances includes: an aluminum substrate with one surface in which an engraved pattern having a preset width and a preset depth is formed, the engraved pattern having micro unevenness formed in a surface of the engraved pattern; a porous aluminum oxide layer formed on the engraved pattern; and a sealing layer formed to close a plurality of pores of the porous aluminum oxide layer, wherein an edge of the aluminum substrate is in a Chamfering (C) shape or a Rounding (R) shape.

The present technology provides a hard-anodized pan that has a steel induction plate and a hybrid coating composition of round ceramic particles. The pan is formed of aluminum with an induction plate affixed. The aluminum is formed into the desired pan shape. The aluminum is sandblasted with beads of a particular size. The sandblasted pan is hard-anodized. The pan is coated with a hybrid coating of round ceramic particles to provide scratch-resistance and a non-stick quality. The pan is coated with a non-stick topcoat.

The present technology provides a hard-anodized pan that has a steel induction plate and a hybrid coating composition of round ceramic particles. The pan is formed of aluminum with an induction plate affixed. The aluminum is formed into the desired pan shape. The aluminum is sandblasted with beads of a particular size. The sandblasted pan is hard-anodized. The pan is coated with a hybrid coating of round ceramic particles to provide scratch-resistance and a non-stick quality. The pan is coated with a non-stick topcoat.

Porous solid materials are provided. The porous solid materials include a plurality of interconnected wires forming an ordered network. The porous solid materials may have a predetermined volumetric surface area ranging between 2 m.sup.2/cm.sup.3 and 90 m.sup.2/cm.sup.3, a predetermined porosity ranging between 3% and 90% and an electrical conductivity higher than 100 S/cm. The porous solid materials may have a predetermined volumetric surface area ranging between 3 m.sup.2/cm.sup.3 and 72 m.sup.2/cm.sup.3, a predetermined porosity ranging between 80% and 95% and an electrical conductivity higher than 100 S/cm. The porous solid materials (100) may have a predetermined volumetric surface area ranging between 3 m.sup.2/cm.sup.3 and 85 m.sup.2/cm.sup.3, a predetermined porosity ranging between 65% and 90% and an electrical conductivity higher than 2000 S/cm. Methods for the fabrication of such porous solid materials and devices including such porous solid material are also disclosed.

Porous solid materials are provided. The porous solid materials include a plurality of interconnected wires forming an ordered network. The porous solid materials may have a predetermined volumetric surface area ranging between 2 m.sup.2/cm.sup.3 and 90 m.sup.2/cm.sup.3, a predetermined porosity ranging between 3% and 90% and an electrical conductivity higher than 100 S/cm. The porous solid materials may have a predetermined volumetric surface area ranging between 3 m.sup.2/cm.sup.3 and 72 m.sup.2/cm.sup.3, a predetermined porosity ranging between 80% and 95% and an electrical conductivity higher than 100 S/cm. The porous solid materials (100) may have a predetermined volumetric surface area ranging between 3 m.sup.2/cm.sup.3 and 85 m.sup.2/cm.sup.3, a predetermined porosity ranging between 65% and 90% and an electrical conductivity higher than 2000 S/cm. Methods for the fabrication of such porous solid materials and devices including such porous solid material are also disclosed.

At least one embodiment relates to a method for transforming at least part of a valve metal layer into a template that includes a plurality of spaced channels aligned longitudinally along a first direction. The method includes a first anodization step that includes anodizing the valve metal layer in a thickness direction to form a porous layer that includes a plurality of channels. Each channel has channel walls and a channel bottom. The channel bottom is coated with a first insulating metal oxide barrier layer as a result of the first anodization step. The method also includes a protective treatment. Further, the method includes a second anodization step after the protective treatment. The second anodization step substantially removes the first insulating metal oxide barrier layer, induces anodization, and creates a second insulating metal oxide barrier layer. In addition, the method includes an etching step.

At least one embodiment relates to a method for transforming at least part of a valve metal layer into a template that includes a plurality of spaced channels aligned longitudinally along a first direction. The method includes a first anodization step that includes anodizing the valve metal layer in a thickness direction to form a porous layer that includes a plurality of channels. Each channel has channel walls and a channel bottom. The channel bottom is coated with a first insulating metal oxide barrier layer as a result of the first anodization step. The method also includes a protective treatment. Further, the method includes a second anodization step after the protective treatment. The second anodization step substantially removes the first insulating metal oxide barrier layer, induces anodization, and creates a second insulating metal oxide barrier layer. In addition, the method includes an etching step.

In an embodiment, a housing for an electronic device is colored through an anodizing process. The electronic device includes the housing, which includes a front plate; a rear plate facing away from the front plate; a side member surrounding a space between the front plate and the rear plate; and a support member which is disposed in the space. A portion of the housing is a conductive member formed of an electrically conductive material, which is divided into a first portion and a second portion which is electrically isolated from the first portion. The first portion is colored by a primary anodizing process with a first color, and the second portion is colored by a secondary anodizing process with a second color different from the first color.

In an embodiment, a housing for an electronic device is colored through an anodizing process. The electronic device includes the housing, which includes a front plate; a rear plate facing away from the front plate; a side member surrounding a space between the front plate and the rear plate; and a support member which is disposed in the space. A portion of the housing is a conductive member formed of an electrically conductive material, which is divided into a first portion and a second portion which is electrically isolated from the first portion. The first portion is colored by a primary anodizing process with a first color, and the second portion is colored by a secondary anodizing process with a second color different from the first color.