A container such as a barrel or drum is provided for processing of solid material or parts with a liquid. The container is designed with grooves leading to holes or slots in the side that draw liquid into the container due to the rotation of the container when it is immersed in a tank of liquid. The holes or slots have a small dimension in the direction of rotation to minimize the probability of solid material coming out of the container. The fluid flow caused by the rotation serves to increase the rate of solution replacement inside the container as well as to keep the solid material from falling out through the holes or slots. The container disclosed is useful in processes in the plating, etching, leaching, and surface finishing industries.

A container such as a barrel or drum is provided for processing of solid material or parts with a liquid. The container is designed with grooves leading to holes or slots in the side that draw liquid into the container due to the rotation of the container when it is immersed in a tank of liquid. The holes or slots have a small dimension in the direction of rotation to minimize the probability of solid material coming out of the container. The fluid flow caused by the rotation serves to increase the rate of solution replacement inside the container as well as to keep the solid material from falling out through the holes or slots. The container disclosed is useful in processes in the plating, etching, leaching, and surface finishing industries.

The variation between different product lots is reduced for plating growth dimensions of plated films to serve as external electrodes. The correlation is grasped in advance among the surface resistance value of a ceramic body, the applying charge amount for electrolytic plating, an actual plating growth dimension obtained when the ceramic body with the surface resistance value is subjected to plating with the foregoing applying charge amount. The surface resistance value is measured for the ceramic body on which plated films to serve as external electrodes are to be formed by applying electrolytic plating, and the applying charge amount required for plating is determined by applying the surface resistance value and a designed value for an intended plating growth dimension to the correlation mentioned above. Thereafter, in order to form the plated films, the ceramic body is subjected to electrolytic plating, with the applying charge amount determined.

A horizontal electroplating production line includes a horizontal electroplating apparatus and a circuit board feeding device. The horizontal electroplating apparatus includes a first frame, an electroplating tank and a horizontal electroplating conveying device arranged at the first frame, the electroplating tank extends along a first direction, the horizontal electroplating conveying device is configured to clamp a circuit board and move the circuit board in the electroplating tank for electroplating, the circuit board feeding device includes a second frame and a feeding conveying mechanism arranged at the second frame, the feeding conveying mechanism is a conveying line with a certain length, and the feeding conveying mechanism is configured to place the circuit board horizontally and convey the circuit board to the horizontal electroplating conveying device of the electroplating apparatus.

A horizontal electroplating production line includes a horizontal electroplating apparatus and a circuit board feeding device. The horizontal electroplating apparatus includes a first frame, an electroplating tank and a horizontal electroplating conveying device arranged at the first frame, the electroplating tank extends along a first direction, the horizontal electroplating conveying device is configured to clamp a circuit board and move the circuit board in the electroplating tank for electroplating, the circuit board feeding device includes a second frame and a feeding conveying mechanism arranged at the second frame, the feeding conveying mechanism is a conveying line with a certain length, and the feeding conveying mechanism is configured to place the circuit board horizontally and convey the circuit board to the horizontal electroplating conveying device of the electroplating apparatus.