Anodizing of a shape memory material product or part includes polishing the shape memory material product or part, thereby producing a polished shape memory material product or part, and then anodizing the polished shape memory material product or part. The polishing of the shape memory material product or part includes mechanical polishing or electrochemical polishing. The electrochemical polishing includes placing the shape memory material product or part in an electrolyte and applying a voltage to the shape memory material product or part for a predetermined time. The anodizing of the polished shape memory material product or part includes placing the polished shape memory material product or part in an electrolyte and applying a voltage to the polished shape memory material product or part for a predetermined time period.

Methods for electropolishing and coating aluminum on a surface of an air and/or moisture sensitive substrate, including: in a vessel, submerging the substrate in a first molten salt bath and applying an anodizing current to the substrate at a first temperature to electropolish the surface of the substrate; wherein the first molten salt bath includes one of a first organic salt bath and first inorganic salt bath; wherein, when used, the first organic salt bath includes one of (a) aluminum halide and ionic liquid, (b) a combination of an aluminum halide and halogenatedmethylphenylsulfone (C.sub.6(H.sub.5−y,X.sub.y)SO.sub.2CX.sub.3, where y is a number from 0-5), (c) a combination of an aluminum halide, an ionic liquid, and halogenatedmethylphenylsulfone (C.sub.6(H.sub.5−y,X.sub.y)SO.sub.2CX.sub.3), and (d) AlF.sub.3-organofluoride-hydrofluoric acid adduct; wherein, when used, the first inorganic salt bath includes aluminum halide and alkali metal halide; and wherein the anodizing current is 10-30 mA/cm.sup.2.

Methods for electropolishing and coating aluminum on a surface of an air and/or moisture sensitive substrate, including: in a vessel, submerging the substrate in a first molten salt bath and applying an anodizing current to the substrate at a first temperature to electropolish the surface of the substrate; wherein the first molten salt bath includes one of a first organic salt bath and first inorganic salt bath; wherein, when used, the first organic salt bath includes one of (a) aluminum halide and ionic liquid, (b) a combination of an aluminum halide and halogenatedmethylphenylsulfone (C.sub.6(H.sub.5−y,X.sub.y)SO.sub.2CX.sub.3, where y is a number from 0-5), (c) a combination of an aluminum halide, an ionic liquid, and halogenatedmethylphenylsulfone (C.sub.6(H.sub.5−y,X.sub.y)SO.sub.2CX.sub.3), and (d) AlF.sub.3-organofluoride-hydrofluoric acid adduct; wherein, when used, the first inorganic salt bath includes aluminum halide and alkali metal halide; and wherein the anodizing current is 10-30 mA/cm.sup.2.

Systems and processes for treating surfaces of metal components are provided. The systems can include a container for containing a metal workpiece having a surface with a complex external geometry and for containing a solution that has electrolytes at a flow rate that varies according to a local shape of the surface to thereby treat the surface of the metal workpiece; optionally one or more electrodes for creating an electrical field; and optionally a temperature control device configured to provide a predetermined temperature or range of temperatures. The processes can include providing a metal workpiece having a surface with a complex external geometry; and contacting the workpiece in the presence of a predetermined electrical field at a predetermined temperature with a solution containing electrolytes at a flow rate that varies according to a local shape of the surface to thereby treat the surface of the metal workpiece.

Systems and processes for treating surfaces of metal components are provided. The systems can include a container for containing a metal workpiece having a surface with a complex external geometry and for containing a solution that has electrolytes at a flow rate that varies according to a local shape of the surface to thereby treat the surface of the metal workpiece; optionally one or more electrodes for creating an electrical field; and optionally a temperature control device configured to provide a predetermined temperature or range of temperatures. The processes can include providing a metal workpiece having a surface with a complex external geometry; and contacting the workpiece in the presence of a predetermined electrical field at a predetermined temperature with a solution containing electrolytes at a flow rate that varies according to a local shape of the surface to thereby treat the surface of the metal workpiece.

A supporter of lithium metal, a material of the supporter of lithium metal is at least one of copper, an alloy of the copper, nickel, or an alloy of the nickel, and a surface of the supporter of lithium metal comprises a lithiophilic layer.

A supporter of lithium metal, a material of the supporter of lithium metal is at least one of copper, an alloy of the copper, nickel, or an alloy of the nickel, and a surface of the supporter of lithium metal comprises a lithiophilic layer.

Use of dry electrolytes to polish titanium and other metal and alloy surfaces by ion transport wherein a conducting liquid in the dry electrolyte includes hydrochloric acid (HCl).

Use of dry electrolytes to polish titanium and other metal and alloy surfaces by ion transport wherein a conducting liquid in the dry electrolyte includes hydrochloric acid (HCl).

The purpose of the present invention is to further level the amount of polishing during electrolytic polishing of the inside of a hollow pipe. A holding frame for vertically holding a hollow pipe is pivotally supported on a rack so as to be vertically invertible about the vertical center of the hollow pipe. An electrode is inserted through the hollow pipe and a liquid buffer is disposed on each end of the hollow pipe. A valve mechanism is capable of switching a liquid supply/discharge circuit so as to supply an electrolyte via the liquid buffer positioned at the bottom and discharge the electrolyte via the liquid buffer positioned at the top whether it is before or after the inversion of the holding frame (inversion of the hollow pipe). During an electrolyte supply period before and after the inversion, an electrolytic treatment is as a matter of course carried out for a predetermined length of time. Although said switching by the valve mechanism may be manually performed, a control means may also be used.