Patent classifications
C30B13/24
LASER IRRADIATION APPARATUS, LASER IRRADIATION METHOD, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
A laser irradiation apparatus includes: a laser generation apparatus configured to generate first laser light for performing heat treatment of an object to be processed; a measurement-laser emission unit configured to emit linearly-polarized second laser light toward an irradiation area on the object to be processed to which the first laser light is applied; a first polarizing plate configured to let, of the whole reflected light of the second laser light reflected by the object to be processed, a part of the reflected light that has a first polarization direction pass therethrough; and a measurement-laser detection unit configured to detect the reflected light that has passed through the first polarizing plate.
SINGLE CRYSTAL INGOT USING BARIUM ZIRCONIUM OXIDE AND PREPARATION METHOD THEREFOR
Disclosed is a method of preparing single crystal ingot of barium zirconium oxide. The method includes preparing a cylindrical BaZrO.sub.3 ceramic by pulverizing a BaZrO.sub.3 compound into a powder and sintering the same into a cylindrical ceramic form, ii) fixing two cylindrical BaZrO.sub.3 ceramics to an optical floating zone furnace, joining the two cylindrical BaZrO.sub.3 ceramics together and melting the junction at a temperature of 2,600 to 3,500 C. using light emitted from a xenon lamp or laser, and after the melting, moving the two cylindrical BaZrO.sub.3 ceramics in a direction parallel to an axis of rotation thereof, enabling the molten junction to be solidified, and thereby growing a single crystal.
SINGLE CRYSTAL INGOT USING BARIUM ZIRCONIUM OXIDE AND PREPARATION METHOD THEREFOR
Disclosed is a method of preparing single crystal ingot of barium zirconium oxide. The method includes preparing a cylindrical BaZrO.sub.3 ceramic by pulverizing a BaZrO.sub.3 compound into a powder and sintering the same into a cylindrical ceramic form, ii) fixing two cylindrical BaZrO.sub.3 ceramics to an optical floating zone furnace, joining the two cylindrical BaZrO.sub.3 ceramics together and melting the junction at a temperature of 2,600 to 3,500 C. using light emitted from a xenon lamp or laser, and after the melting, moving the two cylindrical BaZrO.sub.3 ceramics in a direction parallel to an axis of rotation thereof, enabling the molten junction to be solidified, and thereby growing a single crystal.
Method, use and apparatus for producing a single-crystalline work piece
A method for producing or repairing a three-dimensional work piece, the method comprising the following steps: providing at least one substrate (15); depositing a first layer of a raw material powder onto the substrate (15); and irradiating selected areas of the deposited raw material powder layer with an electromagnetic or particle radiation beam (22) in a site selective manner in accordance with an irradiation pattern which corresponds to a geometry of at least part of a layer of the three-dimensional work piece to be produced, wherein the irradiation is controlled so as to produce a metallurgical bond between the substrate (15) and the raw material powder layer deposited thereon. Moreover, a use and apparatus are likewise disclosed.
Method, use and apparatus for producing a single-crystalline work piece
A method for producing or repairing a three-dimensional work piece, the method comprising the following steps: providing at least one substrate (15); depositing a first layer of a raw material powder onto the substrate (15); and irradiating selected areas of the deposited raw material powder layer with an electromagnetic or particle radiation beam (22) in a site selective manner in accordance with an irradiation pattern which corresponds to a geometry of at least part of a layer of the three-dimensional work piece to be produced, wherein the irradiation is controlled so as to produce a metallurgical bond between the substrate (15) and the raw material powder layer deposited thereon. Moreover, a use and apparatus are likewise disclosed.
Additively manufactured single-crystal metallic components, and methods for producing the same
Some variations provide a method of making an additively manufactured single-crystal metallic component, comprising: providing a feedstock comprising a first metal or metal alloy; providing a build plate comprising a single crystal of a second metal or metal alloy; exposing the feedstock to an energy source for melting the feedstock, generating a melt layer on the build plate; and solidifying the melt layer, generating a solid layer (on the build plate) of a metal component. The solid layer is also a single crystal of the first metal or metal alloy. The method may be repeated many times to build the part. Some variations provide a single-crystal metallic component comprising a plurality of solid layers in an additive-manufacturing build direction, wherein the plurality of solid layers forms a single crystal of a metal or metal alloy with a continuous crystallographic texture. The crystal orientation may vary along the additive-manufacturing build direction.
Additively manufactured single-crystal metallic components, and methods for producing the same
Some variations provide a method of making an additively manufactured single-crystal metallic component, comprising: providing a feedstock comprising a first metal or metal alloy; providing a build plate comprising a single crystal of a second metal or metal alloy; exposing the feedstock to an energy source for melting the feedstock, generating a melt layer on the build plate; and solidifying the melt layer, generating a solid layer (on the build plate) of a metal component. The solid layer is also a single crystal of the first metal or metal alloy. The method may be repeated many times to build the part. Some variations provide a single-crystal metallic component comprising a plurality of solid layers in an additive-manufacturing build direction, wherein the plurality of solid layers forms a single crystal of a metal or metal alloy with a continuous crystallographic texture. The crystal orientation may vary along the additive-manufacturing build direction.
Ordered growth of large crystal graphene by laser-based localized heating for high throughput production
A method of making an ordered graphene structure includes exposing a substrate to a laser beam to locally melt a portion of the substrate, exposing the substrate to a laser beam in the presence of a carbon source, to form a nucleation site for a graphene crystal, and either a) moving either the substrate or the laser beam relative to the other, or b) decreasing the laser beam power, in order to increase the size of the graphene crystal, thereby forming an ordered graphene structure. The ordered structure can be a plurality of columns, hexagons, or quadrilaterals. Each ordered structure can have a single crystal of graphene. A polymer coating can be formed on the ordered graphene structure to form a coated graphene structure.
Ordered growth of large crystal graphene by laser-based localized heating for high throughput production
A method of making an ordered graphene structure includes exposing a substrate to a laser beam to locally melt a portion of the substrate, exposing the substrate to a laser beam in the presence of a carbon source, to form a nucleation site for a graphene crystal, and either a) moving either the substrate or the laser beam relative to the other, or b) decreasing the laser beam power, in order to increase the size of the graphene crystal, thereby forming an ordered graphene structure. The ordered structure can be a plurality of columns, hexagons, or quadrilaterals. Each ordered structure can have a single crystal of graphene. A polymer coating can be formed on the ordered graphene structure to form a coated graphene structure.
Float zone silicon wafer manufacturing system and related process
The process for manufacturing a silicon wafer includes steps for mounting a float zone silicon work piece for exfoliation, energizing a microwave device for generating an energized beam sufficient for penetrating an outer surface layer of the float zone silicon work piece, exfoliating the outer surface layer of the float zone silicon work piece with the energized beam, and removing the exfoliated outer surface layer from the float zone silicon work piece as the silicon wafer having a thickness less than 100 micrometers.