A method for manufacturing an ultra small grain-size nanocrystalline diamond film having a SiV photoluminescence, comprises: (1) manufacturing, on a single crystal silicon substrate, a nanocrystalline diamond film having a SiV photoluminescence by using a microwave plasma chemical vapor deposition method; (2) performing oxygen plasma etching treatment on the nanocrystalline diamond film obtained in step (1) for 5-30 min by using an oxygen plasma bombardment method in a mixed gas plasma having an oxygen-nitrogen gas volume ratio of 1:4-6 and at an atmospheric pressure of 0.5-6 torr and a microwave power of 600-1000 W, thereby obtaining the ultra small grain-size nanocrystalline diamond film having the SiV photoluminescence.

It is an object to provide a method for producing a diamond substrate effective for reducing various defects including dislocation defects and a foundation substrate used for the same. This object is achieved by a foundation substrate for forming a diamond film by a chemical vapor deposition method, wherein an off angle is provided to the surface of the foundation substrate with respect to a predetermined crystal plane orientation.

Disclosed herein are laser-assisted metal-organic chemical vapor deposition devices and methods of use thereof.

A substrate processing apparatus includes a reaction chamber including an inlet through which a reaction gas is supplied and an outlet through which residue gas is exhausted; a plurality of ionizers located at a front end of the inlet and configured to ionize the reaction gas supplied through the inlet; and a heater configured to heat the reaction chamber. The plurality of ionizers include a first ionizer configured to ionize the reaction gas positively; and a second ionizer configured to ionize the reaction gas negatively.

A method for growing at least one III/V nano-ridge on a silicon substrate in an epitaxial growth chamber. The method comprises: patterning an area on a silicon substrate thereby forming a trench on the silicon substrate; growing the III/V nano-ridge by initiating growth of the III/V nano-ridge in the trench, thereby forming and filling layer of the nano-ridge inside the trench, and by continuing growth out of the trench on top of the filling layer, thereby forming a top part of the nano-ridge, wherein at least one surfactant is added in the chamber when the nano-ridge is growing out of the trench.

A method of manufacturing a semiconductor wafer in a reaction apparatus includes channeling a process gas into a reaction chamber of the reaction apparatus, heating the semiconductor wafer with a high intensity lamp positioned below the reaction chamber, blocking radiant heat from the high intensity lamp from heating a center region of the semiconductor wafer with a cap positioned on a shaft within the reaction chamber, the cap including a tube and a disc attached to the tube, where the disc generates a uniform temperature distribution on the semiconductor wafer, and depositing a layer on the semiconductor wafer with the process gas, where the uniform temperature distribution forms a uniform thickness of the layer on the semiconductor wafer.

The invention discloses a process to produce diamonds by microwave plasma chemical vapor deposition (MPCVD). The process uses calibration gas comprising a mixture of 3% to 12% argon per unit of hydrogen, less than 1% oxygen per unit of hydrogen and less than 500 ppm nitrogen in a chamber having diamond seed(s) in an atmosphere of hydrogen plasma.

A method of coating a non-refractory and/or non-planar substrate (8) with synthetic diamond material using a microwave plasma chemical vapour deposition (CVD) synthesis technique, the method comprising: forming a composite substrate assembly (1) comprising: a support substrate (2) comprising an upper surface; one or more electrically conductive refractory guards (6) disposed over the upper surface of the support substrate and extending to a height h.sub.g above the upper surface of the support substrate; and one or more non-refractory and/or non-planar substrates disposed over the upper surface of the support substrate and extending to a height h.sub.s above the upper surface of the support substrate, wherein the height h.sub.s is less than the height h.sub.g, wherein a difference in height h.sub.g−h.sub.s lies in a range 0.2 mm to 10 mm; placing the composite substrate assembly within a plasma chamber of a microwave plasma CVD reactor; feeding process gases into the plasma chamber including a carbon containing gas and a hydrogen containing gas; feeding microwaves in the plasma chamber to form a microwave plasma at a location over the composite substrate assembly; and growing synthetic diamond material on the one or more non-refractory and/or non-planar substrates.

A composition (or an aggregate) comprising a h-BN/BNNT structure that comprises a boron nitride nanotube structure and at least a first hexagonal boron nitride structure. Also, a composition comprising at least a first epitaxial h-BN/BNNT structure and at least one metal adhered to the first epitaxial h-BN/BNNT structure. Also, a composition (or an aggregate) that comprises independent boron nitride nanotubes, in which a total mass percentage of independent hexagonal boron nitride and residual boron in the composition is not more than 35%. Also, a material comprising at least a first hexagonal boron nitride structure and at least a first boron nitride nanotube structure, wherein atoms in the first hexagonal boron nitride structure are epitaxially aligned with atoms in the first boron nitride nanotube structure that are closest to the first hexagonal boron nitride structure.

Embodiments provide a method of growing an epitaxial layer on a wafer, the method including steps of (a) introducing at least one wafer into a process chamber, (b) loading the wafer into an area adjacent to a susceptor while supporting the wafer using a lift pin, (c) preheating the wafer, and (d) placing the wafer in a pocket of the susceptor and heating the wafer to deposit an epitaxial layer on the wafer, wherein outputs of first lamps above the susceptor and second lamps under the susceptor in the steps (a) and (b) are set to be different from outputs of the first lamps and the second lamps in the steps (c) and (d).