Implementations of the present disclosure generally relate to liner layers and methods of forming liner layers for through glass vias. In one or more implementations, a liner layer is deposited on a glass substrate having a plurality of vias disposed through the glass substrate. The method includes depositing an adhesion layer onto and in a via of the plurality of vias to form the adhesion layer, the adhesion layer having a thickness of about 100 Angstroms to about 550 Angstroms, a tensile stress of about 30 MPa to about 80 MPa, and a Young's modulus of about 115 GPa to about 200 GPa and depositing a second layer onto the adhesion layer, the second layer having a thickness of about 2,000 Angstroms to about 60,000 Angstroms, a compressive stress greater than about 50 MPa, and a Young's modulus of about 35 GPa to about 70 GPa.