An electronic device according to various embodiments of the disclosure may include a housing including a first plate forming an outer face. The first plate may include a glass plate including a first surface outwardly facing the housing and a second surface inwardly facing the housing, a coating layer including an anti-reflection coating and/or an anti-finger coating above the first surface while forming the outer face, a first layer formed between the first surface of the first glass plate and the coating layer, having a first thickness, and including a first inorganic material, a second layer formed between the first layer and the coating layer, having a second thickness, and including a second inorganic material different from the first inorganic material, a third layer formed between the second layer and the coating layer, having a third thickness thicker than each of the first thickness and the second thickness, and including a third inorganic material, and an opaque layer formed on the second surface. Various other embodiments may also be possible.

An electronic device may include electrical components and other components mounted within a housing. The device may have a display on a front face of the device and may have a glass layer that forms part of the housing on a rear face of the device. The glass layer and other glass structures in the electronic device may be provided with coatings. An interior coating on a glass layer may include multiple layers of material such as an adhesion promotion layer, thin-film layers of materials such as silicon, niobium oxide and other metal oxides, and metals to help adjust the appearance of the coating. A metal layer may be formed on top of the coating to serve as an environmental protection layer and opacity enhancement layer. In some configurations, the coating may include four layers.

A method of fabricating a semiconductor device, which includes a separation step and has a high yield, is provided. A metal layer is formed over a substrate, fluorine is supplied to the metal layer, and the metal layer is then oxidized, whereby a metal compound layer is formed. A functional layer is formed over the metal compound layer, heat treatment is performed on the metal compound layer, and the functional layer is separated from the substrate with use of the metal compound layer. By performing first plasma treatment using a gas containing fluorine, fluorine can be supplied to the metal layer. By performing second plasma treatment using a gas containing oxygen, the metal layer supplied with fluorine can be oxidized.

Certain example embodiments relate to the use of a ceramic frit that dissolves an already-applied thin film coating (disposed via a physical vapor deposition (PVD) process such as sputtering, or other suitable process). In certain example embodiments, the ceramic frit is aggressive in chemically removing the coating on which it is disposed, e.g., when exposed to high temperatures. The frit advantageously fuses well with the glass, provides aesthetically desired colorations, and/or enables components (e.g., insulated glass (IG) unit spacers) to be reliably mounted thereon, in certain example embodiments. Associated coated articles, IG units, methods, etc., are also contemplated herein.

A coated article includes a substrate, a first dielectric layer, a first metallic layer, a second dielectric layer, a second metallic layer, a third dielectric layer, a third metallic layer, a fourth dielectric layer, a fourth metallic layer and a fifth dielectric layer. At least one of the metallic layers is a discontinuous metallic layer having discontinuous metallic regions. An optional primer is positioned over any one of the metallic layers. Optionally a protective layer is provided as the outer most layer over the fifth dielectric layer.

A material includes a transparent substrate coated with a stack of thin layers including at least one silver-based functional metallic layer, at least one blocking layer located directly in contact with a silver-based functional metallic layer, and at least one zinc-based metallic layer located above or below this silver-based functional metallic layer, directly in contact or separated by one or more layers having a total thickness of less than or equal to 20 nm.

A material includes a transparent substrate coated with a stack of thin layers I including a lower coating including at least one absorbent layer, a single silver-based functional metal layer and an upper coating including at least one dielectric layer. The absorbent layer is separated from the substrate and from the functional layer by one or more dielectric layers. The material, once fitted in a double glazing, makes it possible to obtain a high selectivity, in particular of greater than 1.45, an interior and exterior light reflection of less than 25% and bluish hues in exterior reflection and in interior reflection.

Methods of processing coated articles, such as transparencies, are provided comprising flash annealing one or more layers of the coated article. The one or more layers may be reflective metallic layers, such as silver layers, or comprise a transparent conductive oxide, such as indium tin oxide, or a semiconductor.

A material includes one or more transparent substrates including two main faces, wherein one of the faces of one of the substrates is coated with a functional coating which can have an effect on solar radiation and/or infrared radiation, and a face not coated with the functional coating of one of the substrates includes an absorbent color-adjustment coating including an absorbent layer which absorbs solar radiation in the visible part of the spectrum.

The present disclosure relates to a method for manufacturing a decoration element, the method including depositing a light reflective layer having a structure of two or more islands separated from each other on one surface of a light absorbing layer; and dry etching the light absorbing layer using the island as a mask, wherein a resistance value of the decoration element after the dry etching of the light absorbing layer increases by two times or more compared to before the dry etching of the light absorbing layer.