A coated article includes a substrate, a functional layer over at least a portion of the substrate, and a protective coating over at least a portion of the functional layer, wherein an uppermost layer of the functional layer is a metal oxide layer, and wherein the protective coating comprises a metal nitride layer and a metal oxynitride layer that is disposed between and in contact with at least part of the metal nitride layer and the metal oxide layer of the functional layer.

A glazing includes at least one transparent substrate comprising a first major surface and an opposing second major surface, wherein said first major surface is coated with an electrically conductive layer and the electrically conductive layer is absent in one or more regions of the first major surface. At least a portion of the one or more regions of the first major surface, and/or corresponding regions of the opposing second major surface, bears a low-emissivity material, and the one or more regions permit the passage of electromagnetic radiation through the glazing.

The present disclosure relates generally to methods for the integration of electrochromic films onto a substrate, such as a glass window, and the systems/structures formed via such methods.

A projection arrangement for a head-up display (HUD), includes a composite pane, including an outer and an inner pane connected to one another via a thermoplastic intermediate layer, with an HUD region; an electrically conductive coating on the surface of the outer pane or of the inner pane facing or within the intermediate layer; and a projector directed toward the HUD region. The radiation of the projector is p-polarised. The composite pane has reflectance of at least 10% relative to p-polarised radiation in the spectral range from 450 nm to 650 nm. The electrically conductive coating includes at least four electrically conductive layers, which are each arranged between two dielectric layers or layer sequences. The sum of the thicknesses of all electrically conductive layers is at most 30 nm and at least one of the electrically conductive layers has a thickness of at most 5 nm.

An article including a glass or glass ceramic substrate, a noble metal layer, an adhesion promoting layer positioned between and bonded to the substrate and the noble metal layer, and a conductive metal layer positioned on and bonded to the noble metal layer. The adhesion promoting layer includes a siloxy group bonded with the substrate and a thiol group bonded to the noble metal layer. A method for manufacturing an article including applying an adhesion promoting layer comprising mercaptosilane to at least a portion of a glass or glass ceramic substrate, wherein siloxane bonds are formed between the mercaptosilane and the substrate, applying a noble metal layer to the adhesion promoting layer, the noble metal layer bonds with a thiol present in the mercaptosilane, thermally treating the noble metal layer, and applying a conductive metal layer to the noble metal layer.

A method for bonding a conductive metal to an oxide substrate includes applying a porous coating to a surface of the oxide substrate, the porous coating including a porous oxide and catalyst nanoparticles dispersed therein, and depositing a conductive metal onto the porous coating. A portion of the conductive metal may be deposited within the pores of the porous coating to couple the conductive metal to the porous coating. Articles are also disclosed that include the oxide substrate, the porous coating coupled to a surface of the oxide substrate, and the conductive metal coupled to the porous coating. The porous coating may include a porous oxide and catalyst nanoparticles dispersed within the metal oxide. A portion of the conductive metal may be deposited within the pores of the porous coating to interlock the conductive metal to the porous coating.

A process for obtaining an item including a substrate made of glass or glass ceramic coated on at least one portion of at least one of its faces with a stack of thin-layers including no silver layers and including at least one thin layer of a transparent electrically conductive oxide, the process including: a step of depositing the stack, in which step the thin layer of a transparent electrically conductive oxide and at least one thin homogenizing layer are deposited, the thin homogenizing layer being a metal layer or a layer based on a metal nitride other than aluminum nitride, or a layer based on metal carbide; then a heat treatment step in which the stack is exposed to radiation.

An electro-optic assembly includes a first partially reflective, partially transmissive substrate defining a first surface and a second surface. A second partially reflective, partially transmissive substrate defines a third surface and a fourth surface. A space is defined between a first substrate and a second substrate. A seal is disposed about a perimeter of the first and second substrates. An electro-optic material is disposed between the second surface of the first substrate and the third surface of the second substrate. The electro-optic assembly is operable to change at least one of a reflectance state and a transmittance state in either a discrete or continuous manner. A transparent electrode coating is disposed between the second surface and the third surface. The transparent electrode coating includes an insulator layer, metal layer, and insulator layer (IMI) structure. The reflectance off of the transparent electrode coating is less than about 2%.

A glass sensor substrate including metallizable through vias and related process is provided. The glass substrate has a first major surface, a second major surface and an average thickness of greater than 0.3 mm. A plurality of etch paths are created through the glass substrate by directing a laser at the substrate in a predetermined pattern. A plurality of through vias through the glass substrate are etched along the etch paths using a hydroxide based etching material. The hydroxide based etching material highly preferentially etches the substrate along the etch path. Each of the plurality of through vias is long compared to their diameter for example such that a ratio of the thickness of the glass substrate to a maximum diameter of each of the through vias is greater than 8 to 1.

The present disclosure relates generally to methods for the integration of electrochromic films onto a substrate, such as a glass window, and the systems/structures formed via such methods.