An electronic device may include electrical components and other components mounted within a housing. The device may have a display on a front face of the device and may have a glass layer that forms part of the housing on a rear face of the device. The glass layer and other glass structures in the electronic device may be provided with coatings. An interior coating on a glass layer may include multiple layers of material such as an adhesion promotion layer, thin-film layers of materials such as silicon, niobium oxide and other metal oxides, and metals to help adjust the appearance of the coating. A metal layer may be formed on top of the coating to serve as an environmental protection layer and opacity enhancement layer. In some configurations, the coating may include four layers.

The present invention provides a plating film that exhibits good adhesion to glass substrates. The present invention is a plating film comprising an oxide layer, an electroless plating film, and an electrolytic copper plating film in this order.

The present invention includes a method of making a slotted waveguide antenna structure with a matched ground plane comprising: forming in a photosensitive glass substrate a coaxial-to-coplanar waveguide (CPW) section connected to a power divider, an emission cavity area for the slotted antenna and one or more vias; depositing a metal ground plane to a first surface of the photosensitive glass substrate; depositing a copper layer on the photosensitive glass substrate with a pattern of slots that form a slot antenna above the emission cavity; forming one or more glass pillars in the emission cavity under the slot antenna; etching away the photosensitive glass in the emission cavity while retaining the one or more glass pillars; connecting a micro coaxial connector to the coaxial-to-coplanar waveguide (CPW) section; and one or more solder bumps at the vias that connect to the ground plane, to form a slotted antenna.

The present invention includes a method of making a slotted waveguide antenna structure with a matched ground plane comprising: forming in a photosensitive glass substrate a coaxial-to-coplanar waveguide (CPW) section connected to a power divider, an emission cavity area for the slotted antenna and one or more vias; depositing a metal ground plane to a first surface of the photosensitive glass substrate; depositing a copper layer on the photosensitive glass substrate with a pattern of slots that form a slot antenna above the emission cavity; forming one or more glass pillars in the emission cavity under the slot antenna; etching away the photosensitive glass in the emission cavity while retaining the one or more glass pillars; connecting a micro coaxial connector to the coaxial-to-coplanar waveguide (CPW) section; and one or more solder bumps at the vias that connect to the ground plane, to form a slotted antenna.

A glass substrate for a high-frequency device, which contains, in terms of mole percent on the basis of oxides: 40 to 75% of SiO.sub.2; 0 to 15% of Al.sub.2O.sub.3; 13 to 23% of B.sub.2O.sub.3; 2.5 to 11% of MgO; and 0 to 13% of CaO, and having a total content of alkali metal oxides in the range of 0.001-5%, where at least one main surface of the glass substrate has a surface roughness of 1.5 um or less in terms of arithmetic average roughness Ra. and the glass substrate has a dielectric dissipation factor at 35 GHz of 0.007 or less.

Embodiments are related generally to conductive interconnects formed on substrates, and more particularly to a glass ceramic, or glass-ceramic substrate having copper interconnects disposed thereon.

The present invention relates to a glass substrate for a high-frequency device, which includes SiO.sub.2 as a main component, the glass substrate having a total content of alkali metal oxides in the range of 0.001-5% in terms of mole percent on the basis of oxides, the alkali metal oxides having a molar ratio represented by Na.sub.2O/(Na.sub.2O+K.sub.2O) in the range of 0.01-0.99, and the glass substrate having a total content of Al.sub.2O.sub.3 and B.sub.2O.sub.3 in the range of 1-40% in terms of mole percent on the basis of oxides and having a molar ratio represented by Al.sub.2O.sub.3/(Al.sub.2O.sub.3+B.sub.2O.sub.3) in the range of 0-0.45, in which at least one main surface of the glass substrate has a surface roughness of 1.5 nm or less in terms of arithmetic average roughness Ra, and the glass substrate has a dielectric dissipation factor at 35 GHz of 0.007 or less.

A process for heating a glass or glass ceramic article with copper-metallized through holes includes heating the article from a first temperature to a second temperature. The first temperature is greater than or equal to 200 C. and less than or equal to 300 C., and the second temperature is greater than or equal to 350 C. and less than or equal to 450 C. An average heating rate during the heating of the article from the first temperature to the second temperature is greater than 0.0 C./min and less than 8.7 C./min. An article includes a glass or glass ceramic substrate having at least one through hole penetrating the substrate in a thickness direction; and copper present in the at least one through hole. The article does not comprise radial cracks.

Vacuum insulating glass or other such vacuum insulating material may be provided with a first plate and a second plate that are arranged in mutually opposed fashion so as to straddle therebetween a space of a gap that is a vacuum layer. The first plate may have, in order of lamination from the exterior, a first electrically conductive layer, and a first charged insulator. The second plate may have, in order of lamination from the exterior, a second electrically conductive layer, and a second charged insulator which is charged with charge of the same polarity as the first charged insulator. A repulsive force that is a Coulomb force which acts between the first charged insulator and the second charged insulator may substantially balance and counteract a tendency of ambient atmospheric pressure to reduce the length of the gap between the first plate and the second plate.

A method of manufacturing a glass article comprising: forming a first layer of a first metal on a glass substrate, the glass substrate comprising silicon dioxide and aluminum oxide; subjecting the glass substrate with the first layer of the first metal to a first thermal treatment; forming a second layer of a second metal over the first layer of the first metal; and subjecting the second layer of the second metal to a second thermal treatment, the first thermal treatment and the second thermal treatment inducing intermixing of the first metal, the second metal, and at least one of aluminum, aluminum oxide, silicon, and silicon dioxide of the glass substrate to form a metallic region comprising the first metal, the second metal, aluminum oxide, and silicon dioxide. The first metal can be silver. The second metal can be copper.