Vacuum insulating glass or other such vacuum insulating material may be provided with a first plate and a second plate that are arranged in mutually opposed fashion so as to straddle therebetween a space of a gap that is a vacuum layer. The first plate may have, in order of lamination from the exterior, a first electrically conductive layer, and a first charged insulator. The second plate may have, in order of lamination from the exterior, a second electrically conductive layer, and a second charged insulator which is charged with charge of the same polarity as the first charged insulator. A repulsive force that is a Coulomb force which acts between the first charged insulator and the second charged insulator may substantially balance and counteract a tendency of ambient atmospheric pressure to reduce the length of the gap between the first plate and the second plate.

Provided is a glass sheet (1) with a film, including a laminated film (2), which includes a plurality of films laminated together, formed on a glass sheet (3). The laminated film (2) includes: an inorganic material film (4), which contains at least a noble metal, formed on the glass sheet (3); a plated metal film (5) formed on the inorganic material film; and a metal film (6) formed on the plated metal film (5). The laminated film (2) is black when viewed from a glass sheet (3) side.

In some embodiments, a method comprises leaching a surface of a glass or glass ceramic substrate to form a leached layer. The glass or glass ceramic substrate comprises a multi-component material. The material has a bulk composition, in mol % on an oxide basis: 51% to 90% SiO.sub.2; 10% to 49% total of minority components RO.sub.x. Leaching comprises selectively removing components RO.sub.x of the glass or glass ceramic substrate preferentially to removal of SiO.sub.2. In the leached layer, the RO.sub.x concentration is 50% or less than the RO.sub.x concentration of the bulk composition.

The present invention relates to a glass substrate for a high-frequency device, which includes SiO.sub.2 as a main component, the glass substrate having a total content of alkali metal oxides in the range of 0.001-5% in terms of mole percent on the basis of oxides, the alkali metal oxides having a molar ratio represented by Na.sub.2O/(Na.sub.2O+K.sub.2O) in the range of 0.01-0.99, and the glass substrate having a total content of Al.sub.2O.sub.3 and B.sub.2O.sub.3 in the range of 1-40% in terms of mole percent on the basis of oxides and having a molar ratio represented by Al.sub.2O.sub.3/(Al.sub.2O.sub.3+B.sub.2O.sub.3) in the range of 0-0.45, in which at least one main surface of the glass substrate has a surface roughness of 1.5 nm or less in terms of arithmetic average roughness Ra, and the glass substrate has a dielectric dissipation factor at 35 GHz of 0.007 or less.

The invention relates to eliminating or dramatically reducing the mechanical distortion induced in photo-definable glass as a function of temperature and time processing during metallization that enable multi-layer and single layer photo-definable structures, that can contain electronic, photonic, or MEMS devices to create unique vertically integrated device or system level structures.

An electronic device, including layers, formed from a material that can remain substantially constant in structure, such as glass. The layer can be preformed with through glass vias that support at least one electrically conductive interconnect. The through glass via can have an edge region that can be substantially coplanar with an exposed surface of the layer.

A conductive laminate includes a first organic film, a fine metal wire arranged on the first organic film, and a second organic film arranged to cover the fine metal wire, in which the fine metal wire includes a blackening layer, an intimate attachment layer, and a metal conductive layer in order from a side of the first organic film, and moisture contents of the first organic film and the second organic film are less than 3.00%.

The disclosure relates to a touch panel. The touch panel includes a substrate having a surface, a metal nanowire film, at least one electrode, and a conductive trace. The metal nanowire film includes a metal nanowire film. The metal nanowire film includes a number of first metal nanowire bundles parallel with and spaced from each other. Each of the number of first metal nanowire bundles includes a number of first metal nanowires parallel with each other. The first distance between adjacent two of the number of first metal nanowires is less than the second distance between adjacent two of the number of first metal nanowire bundles.

The multilayer wiring film which is provided with a wiring layer that is formed of Cu or a Cu alloy and has an electrical resistance of 10 cm or less and a CuX alloy layer that contains Cu and an element X and is arranged above and/or below the wiring layer, and wherein the element X is composed of at least one element selected from the group X consisting of Al, Mn, Zn and Ni, and the metals constituting the CuX alloy layer have a specific composition. The multilayer wiring film is able to provide a multilayer wiring film which has low electrical resistance and is free from film separation during the formation of a SiOx film by a CVD method, said SiOx film serving as an interlayer insulating film, and which is also free from an increase in the electrical resistance even if subjected to a high-temperature heat treatment that is carried out at 400 C. or higher.

A method for producing a pane having an electrically conductive coating is described. The method includes applying an electrically conductive coating onto a substrate, identifying defects of the coating, focusing the radiation of a laser having an annular beam profile on the coating, wherein the annular beam profile surrounds the defect, and producing an annular de-coated region by simultaneously removing the coating in the region of the beam profile.