A microelectronic article includes a glass-based substrate having a first surface and a second surface, a first polymer layer disposed on the first surface, a second polymer layer disposed on the second surface, at least one redistribution layer disposed on the first polymer layer, the second polymer layer, or both, and a metallized through glass via extending from the first surface to the second surface. The first polymer layer and the second polymer layer include pores and have a porosity of from 5% to 70% and a Young's modulus of greater than 1 GPa. The at least one redistribution layer includes a metal material and a dielectric material.