A superstrate can include a body having a surface; a buffer layer overlying the surface; and a protective layer overlying the buffer layer, wherein the protective layer has a surface roughness that is equal to or less than a surface roughness of the surface of the body. The protective layer can include a material that can be selectively removed with respect to the buffer layer, and the buffer layer can include a material that can be selectively removed with respect to the body of the superstrate. The superstrate can be used for more planarization or other processing sequences before the body needs to be replaced, as any defects that may form extend into the protective layer or buffer layer and not reach the body. The layers can be removed and replaced by corresponding new layers without significantly adversely affecting the body.

Aspects of the present disclosure relate generally to methods and apparatus of processing transparent substrates, such as glass substrates. In one implementation, a film stack for optical devices includes a glass substrate including a first surface and a second surface. The film stack includes a device function layer formed on the first surface, a hard mask layer formed on the device function layer, and a substrate recognition layer formed on the hard mask layer. The hard mask layer includes one or more of chromium, ruthenium, or titanium nitride. The film stack includes a backside layer formed on the second surface. The backside layer formed on the second surface includes one or more of a conductive layer or an oxide layer.

Aspects of the present disclosure relate generally to methods and apparatus of processing transparent substrates, such as glass substrates. In one implementation, a film stack for optical devices includes a glass substrate including a first surface and a second surface. The film stack includes a device function layer formed on the first surface, a hard mask layer formed on the device function layer, and a substrate recognition layer formed on the hard mask layer. The hard mask layer includes one or more of chromium, ruthenium, or titanium nitride. The film stack includes a backside layer formed on the second surface. The backside layer formed on the second surface includes one or more of a conductive layer or an oxide layer.

Methods for protecting transparent electronically conductive layers on glass substrates are described herein. Methods include depositing a sacrificial coating during deposition of the transparent electronically conductive layer, before packing the glass substrate for storage or shipping, after unpacking glass substrates from a stack of glass substrates, and/or after a washing operation prior to fabricating an electrochromic stack on the transparent electronically conductive layer. Methods also include removing the sacrificial coating during a washing operation, during tempering, or prior to depositing an electrochromic stack by, e.g., heating the sacrificial coating or exposing the sacrificial coating to an inert plasma.

A composition of AR layer that is aimed to match the refractive index of the underlying substrate e.g. glass, chemically strengthened glass, plastics etc., so as maximum light is transmitting through it. For a device with an sapphire film for anti-scratch protection, because sapphire has a different refractive index to that of the substrate, therefore existing AR layer will not function as well as it should; not only the transmitted light is reduced in quantity, its transmitted range will be changed such that imaging or display color is compromised. Therefore an integrated AR with sapphire film with the top most AR layer as Al.sub.2O.sub.3 which also acts as anti-scratching layer will eliminate this problem. This claim involves replacing one of the materials for AR layer is Al.sub.2O.sub.3 such that the top most AR layer as Al.sub.2O.sub.3 which also acts as anti-scratching layer.

The present invention relates to: a method of manufacturing glass with hollow nanopillars, which includes a silicon oxide layer forming step in which a silicon oxide layer made of silicon oxide is formed on one side of a glass substrate, a first etching step in which the silicon oxide layer is etched and a plurality of silicon oxide clusters are formed on the glass substrate, and a second etching step in which the glass substrate, on which the silicon oxide clusters are formed, is etched and hollow nanopillars are formed; and glass with hollow nanopillars manufactured thereby.

A method for making a plasmonic mushroom array includes: forming a plurality of metal nano-islands each having nanometer-range dimensions on a surface of a glass substrate; and subjecting to the glass substrate having the plurality of metal nano-islands formed thereon to reactive ion etching such that the plurality of metal nano-islands are converted to a plurality of mushroom-shaped structures each having a metal cap supported by a pillar made of a material of the glass substrate and each having dimensions smaller than the dimensions of the nano-islands, the plurality of mushroom-shaped structures being arranged in a substantially regular pattern with intervals smaller than average intervals between the nano-islands, thereby forming the plurality of nano-scale mushroom-shaped structures on the glass substrate that can exhibit localized surface plasmon resonance.

The present invention is an antireflective film, including: a support base, and a pattern composed of a photoresist material formed on the support base, the index at a point closer to the support base. The present invention provides an antireflective film that is able to give antireflection effect to decrease the reflection of light, a method of producing the same, and an eyeglass type display.

A method of fabricating a cover glass includes preparing a base member including a first area and a second area, wherein a surface of the base member is substantially parallel to a direction in the first area and is inclined with respect to the direction in the second area, and forming an ink layer on the surface of the base member in the second area, and forming a first print layer by removing a portion of the ink layer and forming a second print layer on the first print layer.

An electronic package assembly includes a glass substrate including an upper glass cladding layer, a lower glass cladding layer, a glass core layer coupled to the upper glass cladding layer and the lower glass cladding layer, where the upper glass cladding layer and the lower glass cladding layer have a higher etch rate in an etchant than the glass core layer, a first cavity positioned within one of the upper glass cladding layer or the lower glass cladding layer, and a second cavity positioned within one of the upper glass cladding layer or the lower glass cladding layer, a microprocessor positioned within the first cavity, and a micro-electronic component positioned within the second cavity.