Patent classifications
C04B14/326
HIGH THERMAL COEFFICIENT GROUT COMPOSITIONS AND METHODS THEREFOR
A high-thermal conductivity grout composition is provided. The composition includes a grout mixture including a cementitious material, a retarder, and a high-thermal k material that advantageously can form a pumpable slurry upon admixture with water. The retarder is present in an amount effective that delays setting of the grout mixture at a target location having a geostatic target temperature of at least 300 F. for at least two hours. The high-thermal k material is present in an amount effective such that the grout mixture has, upon setting at the target location, a thermal conductivity of at least 1 W/m K.
HIGH THERMAL COEFFICIENT GROUT COMPOSITIONS AND METHODS THEREFOR
A high-thermal conductivity grout composition is provided. The composition includes a grout mixture including a cementitious material, a retarder, and a high-thermal k material that advantageously can form a pumpable slurry upon admixture with water. The retarder is present in an amount effective that delays setting of the grout mixture at a target location having a geostatic target temperature of at least 300 F. for at least two hours. The high-thermal k material is present in an amount effective such that the grout mixture has, upon setting at the target location, a thermal conductivity of at least 1 W/m K.
High thermal coefficient grout compositions and methods therefor
A high-thermal conductivity grout composition is provided. The composition includes a grout mixture including a cementitious material, a retarder, and a high-thermal k material that advantageously can form a pumpable slurry upon admixture with water. The retarder is present in an amount effective that delays setting of the grout mixture at a target location having a geostatic target temperature of at least 300 F. for at least two hours. The high-thermal k material is present in an amount effective such that the grout mixture has, upon setting at the target location, a thermal conductivity of at least 1 W/m K.
High thermal coefficient grout compositions and methods therefor
A high-thermal conductivity grout composition is provided. The composition includes a grout mixture including a cementitious material, a retarder, and a high-thermal k material that advantageously can form a pumpable slurry upon admixture with water. The retarder is present in an amount effective that delays setting of the grout mixture at a target location having a geostatic target temperature of at least 300 F. for at least two hours. The high-thermal k material is present in an amount effective such that the grout mixture has, upon setting at the target location, a thermal conductivity of at least 1 W/m K.
Thermal Reach Enhancement Flowback Prevention Compositions And Methods
Compositions and methods for thermal reach enhancement (TRE) are presented in which a TRE material comprises at least two functionally distinct solid components that enable high thermal conductivity with minimal flowback during and after placement, even where the TRE is placed into a low permeability formation. The first component is characterized by low kinetic friction and deformability upon compression, the second component is characterized by high internal and external kinetic friction and interlocking upon compression, and the first and second components form a compacted hybrid high thermal k material with minimal void space.
Thermal Reach Enhancement Flowback Prevention Compositions And Methods
Compositions and methods for thermal reach enhancement (TRE) are presented in which a TRE material comprises at least two functionally distinct solid components that enable high thermal conductivity with minimal flowback during and after placement, even where the TRE is placed into a low permeability formation. The first component is characterized by low kinetic friction and deformability upon compression, the second component is characterized by high internal and external kinetic friction and interlocking upon compression, and the first and second components form a compacted hybrid high thermal k material with minimal void space.